IP Library › Granted Patent US 1,048,029
Granted Patent S1
US 1,048,029 · App. 29/833,188 · Granted Oct 22, 2024

Housing module for an electronic device

Inventors: Jody Akana (San Francisco, CA); Molly Anderson (San Francisco, CA); Bartley K. Andre (Palo Alto, CA); Shota Aoyagi (San Francisco, CA); Anthony Michael Ashcroft (San Francisco, CA); Marine C. Bataille (San Francisco, CA); Jeremy Bataillou (San Francisco, CA); Abidur Rahman Chowdhury (San Francisco, CA); Sawyer Isaac Cohen (Menlo Park, CA); Clara Geneviève Marine Courtaigne (Palo Alto, CA); Markus Diebel (San Francisco, CA); Richard Hung Minh Dinh (Saratoga, CA); Jonathan Gomez Garcia (San Francisco, CA); M. Evans Hankey (San Francisco, CA); Julian Hoenig (San Francisco, CA); Richard P. Howarth (San Francisco, CA); Jonathan P. Ive (San Francisco, CA); Julian Jaede (San Francisco, CA); Hugh J. Jay (Mountain View, CA); Duncan Robert Kerr (San Francisco, CA); Peter Russell-Clarke (San Francisco, CA); Benjamin Andrew Shaffer (San Jose, CA); Sung-Ho Tan (Vienna, AT); Clement Tissandier (San Francisco, CA); Eugene Antony Whang (San Francisco, CA); Christopher R. Xydis (San Francisco, CA); Rico Zörkendörfer (San Francisco, CA)
Assignee: Apple Inc.
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Quick Facts
Patent No.
US 1,048,029
App. No.
29/833,188
Granted
Oct 22, 2024
Kind
S1
Claims (1)

The ornamental design for a housing module for an electronic device as shown and described.

Continuity (1)
Continuation 29714466 · Nov 22, 2019