IP Library › Granted Patent US 10,483,253
Granted Patent B1
US 10,483,253 · App. 15/247,249 · Granted Nov 19, 2019

Display with embedded pixel driver chips

Inventor: Hsin-Hua Hu (Los Altos, CA)
Assignee: Apple Inc.
H01L25/18H01L23/5389H01L24/02H01L24/24H01L25/50H01L27/088H01L27/156H01L2224/02381H01L2224/24146H01L2224/24147
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Quick Facts
Patent No.
US 10,483,253
App. No.
15/247,249
Granted
Nov 19, 2019
Kind
B1
Abstract

Embodiments describe a display integration scheme in which an array of pixel driver chips embedded front side up in an insulator layer. A front side redistribution layer (RDL) spans across and is in electrical connection with the front sides of the array of pixel driver chips, and an array of light emitting diodes (LEDs) is bonded to the front side RDL. The pixel driver chips may be located directly beneath the display area of the display panel.

Claims (23)

1. A display panel comprising:

an array of pixel driver chips embedded front side up in an insulator layer;

a front side redistribution layer (RDL) spanning across and in electrical connection with front sides of the array of pixel driver chips; and

an array of light emitting diodes (LEDs) bonded to the front side RDL, the array of LEDs arranged in an array of pixels, wherein each pixel driver chip is to switch and drive a plurality of LEDs in the array of LEDs for a plurality of pixels;

wherein each pixel driver chip has a minimum x-y dimension that that is larger than a maximum pitch in the x-y dimension between adjacent LEDs of the array of LEDs, and each pixel driver chip is characterized by pixel driver chip area in x-y dimensions that is directly underneath an entire LED area in the x-y dimensions for each of a corresponding plurality of LEDs of the array of LEDs.

2. The display panel of claim 1 , further comprising a back side RDL spanning across the insulator layer and the array of pixel driver chips.

3. The display panel of claim 2 , further comprising a plurality of conductive pillars extending through the insulator layer from the back side RDL to the front side RDL.

4. The display panel of claim 3 , further comprising a plurality of device chips mounted on the back side RDL and in electrical connection with the plurality of conductive pillars.

5. The display panel of claim 1 , wherein each pixel driver chip comprises an analog driving circuit.

6. The display panel of claim 5 , wherein each pixel driver chip comprises a storage capacitor.

7. The display panel of claim 1 , wherein each pixel driver chip comprises digital driving circuit.

8. The display panel of claim 7 , each pixel driver chip comprises a data storage element.

9. The display panel of claim 1 , further comprising a plurality of row driver chips.

10. The display panel of claim 9 , wherein the plurality of row driver chips are embedded front side up in the insulator layer.

11. The display panel of claim 9 , wherein the plurality of row driver chips are bonded to the front side RDL outside of a display area.

12. The display panel of claim 9 , further comprising a back side RDL spanning across the insulator layer and the array of pixel driver chips, wherein the plurality of row driver chips are bonded to the back side RDL.

13. The display panel of claim 2 , further comprising a device chip including a timing controller bonded to the back side RDL.

14. The display panel of claim 1 , wherein each LED is formed of an inorganic semiconductor-based material.

15. The display panel of claim 1 , wherein each LED has a maximum lateral dimension of 1 to 300 μm.

16. The display panel of claim 1 , wherein each LED has a maximum lateral dimension of 1 to 20 μm.

17. The display panel of claim 1 , further comprising a passivation layer laterally surrounding each LED of the array of LEDs.

18. The display panel of claim 17 , further comprising a plurality of transparent top conductive contact layers formed over the passivation layer and the array of LEDs to make electrical contact with the array of LEDs.

19. The display panel of claim 1 , wherein the front side RDL includes a plurality of dielectric layers and a plurality of redistribution lines.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 25, 2016
From: HU, HSIN-HUA
To: APPLE INC.
Reel/Frame 039544/0378 →
Continuity (1)
Provisional Application 62232281 · Sep 24, 2015
Cited By (5)
US 12,243,863 US 12,437,703 US 12,464,879 US 12,599,044 US 12,710,606