Method of manufacturing electromagnetic wave shield housing
A method of manufacturing an electromagnetic wave shield housing that accommodates an electronic component and shields the electronic component from electromagnetic waves is provided, which includes: placing a resin plate inside a shielding metal plate, the shielding metal plate including a plate central area of the metal plate having a shielding property against the electromagnetic waves, and plate outer peripheral edges that are formed around the plate central area and stand up from the plate central area in standing postures, the resin plate including a central portion that overlaps with the plate central area, and stand-up portions that stand up from the central portion so as to conform to the standing postures and overlap with the plate outer peripheral edges, respectively; and injecting resin to the shielding metal plate, where the resin plate is placed, from outside the shielding metal plate to cover the shielding metal plate with the injected resin from outside. Thus, the electromagnetic wave shield housing can easily be manufactured, without causing any changes to the postures of the plate outer peripheral edges of the shielding metal plate and impeding the weight reduction.
1. A method of manufacturing an electromagnetic wave shield housing that accommodates an electronic component and shields the electronic component from electromagnetic waves, comprising:
a first step of placing a resin plate inside a shielding metal plate, the shielding metal plate including a plate central area of the metal plate having a shielding property against the electromagnetic waves, and plate outer peripheral edges that are formed around the plate central area and stand up from the plate central area in standing postures, the resin plate including a central portion that overlaps with the plate central area, and stand-up portions that stand up from the central portion so as to conform to the standing postures and overlap with the plate outer peripheral edges, respectively; and
a second step of injecting resin to the shielding metal plate, where the resin plate is placed, from outside the shielding metal plate to cover the shielding metal plate with the injected resin from outside,
wherein the injected resin covers a portion of an inner surface of at least one plate outer peripheral edge and does not cover inner surfaces of the stand-up portions,
wherein in the first step, when the resin plate is placed inside the shielding metal plate, the stand-up portions of the resin plate have a height that is lower than a stand-up height of the plate outer peripheral edges of the shielding metal plate that stand up, and
wherein in the second step, the resin injected from the outside of the shielding metal plate goes over the plate outer peripheral edges of the shielding metal plate and gets to an inner side of the shielding metal plate to reach the stand-up portions of the resin plate, so as to cover the shielding metal plate.
2. The method of manufacturing the electromagnetic wave shield housing in accordance with claim 1 , wherein the resin plate is formed by injection molding using dies, the resin plate being formed inside the shielding metal plate of which the plate outer peripheral edges are stood up from the plate central area.
3. The method of manufacturing the electromagnetic wave shield housing in accordance with claim 1 , wherein the plate outer peripheral edges are formed in the standing postures in which the plate outer peripheral edges are bent and stood up by substantially 90 degrees from the plate central area.
4. A method of manufacturing an electromagnetic wave shield housing that accommodates an electronic component and shields the electronic component from electromagnetic waves, comprising:
placing a resin plate inside a shielding metal plate, the shielding metal plate including a plate central area of the metal plate having an opening therein and a shielding property against the electromagnetic waves, and plate outer peripheral edges that are formed around the plate central area and stand up from the plate central area in standing postures, the resin plate including a central portion that overlaps with the plate central area and which includes an opening that overlaps with the opening of the metal plate, and stand-up portions that stand up from the central portion so as to conform to the standing postures and overlap with the plate outer peripheral edges, respectively; and
injecting resin to the shielding metal plate, where the resin plate is placed, from outside the shielding metal plate,
wherein the injected resin goes over the plate outer peripheral edges of the shielding metal plate and gets to an inner side of the shielding metal plate to reach the stand-up portions of the resin plate to cover the shielding metal plate with the injected resin from outside, and
wherein the injected resin covers a portion of an inner surface of at least one plate outer peripheral edge and does not cover inner surfaces of the stand-up portions.
5. The method of manufacturing the electromagnetic wave shield housing in accordance with claim 4 , wherein the resin plate is formed by injection molding using dies, the resin plate being formed inside the shielding metal plate of which the plate outer peripheral edges are stood up from the plate central area.
6. The method of manufacturing the electromagnetic wave shield housing in accordance with claim 4 , wherein the plate outer peripheral edges are formed in the standing postures in which the plate outer peripheral edges are bent and stood up by substantially 90 degrees from the plate central area.
7. The method of manufacturing the electromagnetic wave shield housing in accordance with claim 1 , wherein a location where the resin injected in the second step meets at least one stand-up portion of the resin plate is situated in a middle portion of a height dimension of the plate outer peripheral edges.
8. The method of manufacturing the electromagnetic wave shield housing in accordance with claim 4 , wherein a location where the injected resin meets at least one stand-up portion of the resin plate is situated in a middle portion of a height dimension of the plate outer peripheral edges.