IP Library Granted Patent US 10,515,739
Granted Patent B2
US 10,515,739 · App. 15/772,662 · Granted Dec 24, 2019

Conductive member and method for producing conductive member

Inventors: Osamu Satou (Mie, JP); Masamichi Yamagiwa (Mie, JP)
Assignee: SUMITOMO WIRING SYSTEMS, LTD.
H01B5/02C22F1/08H01B1/026H01B5/08H01B5/12H01B7/04H01B13/0013
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,515,739
App. No.
15/772,662
Granted
Dec 24, 2019
Kind
B2
Abstract

Sufficient welding of multiple metal wires in at least a portion of a conductive member that is constituted by multiple metal wires is enabled. The conductive member includes multiple metal wires each including a metal strand and a metal covering layer formed around the metal strand, and a joined portion in which the metal wires are joined by melting of alloy portions of the metal covering layers, the alloy portions including the metal that forms the metal strands. The joined portion can be formed by joining the metal wires to each other by performing heating at a temperature higher than the melting point of the alloy portions of the metal covering layers, the alloy portions including the metal that forms the metal strands.

Claims (15)

1. A conductive member comprising:

a plurality of metal wires each including a metal strand and a metal covering layer formed of a metal that is different from the metal of the metal strand and formed around the metal strand; and

a joined portion in which the plurality of metal wires are joined by melting of alloy portions of the metal covering layers and portions of the metal strands, the alloy portions including a metal that forms the metal strands.

2. The conductive member according to claim 1 ,

wherein the metal strands are copper, and

the metal covering layers are formed by performing tin plating around the copper.

3. The conductive member according to claim 1 , wherein the joined portion is formed with a terminal shape configured to be electrically and mechanically connected to a partner conductive portion.

4. The conductive member according to claim 1 , wherein the plurality of metal wires are combined to form an elongated shape.

5. A conductive member manufacturing method comprising:

(a) preparing a group of a plurality of metal wires each including a metal strand and a metal covering layer formed of a metal that is different from the metal of the metal strand and formed around the metal strand; and

(b) joining the plurality of metal wires to each other by performing heating at a temperature higher than a melting point of alloy portions of the metal covering layers and portions of the metal strands, the alloy portions including a metal that forms the metal strands.

6. The conductive member manufacturing method according to claim 5 ,

wherein the metal strands are copper,

the metal covering layers are formed by performing tin plating around the copper, and

the heating temperature is a temperature higher than a melting point of a copper-tin alloy.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 1, 2018
From: SATOU, OSAMU; YAMAGIWA, MASAMICHI
To: SUMITOMO WIRING SYSTEMS, LTD.
Reel/Frame 045683/0551 →
Priority Claims (1)
JP 2015-221797 · Nov 12, 2015 · national
Continuity (1)
Related Publication 20180322982A1 · Nov 8, 2018
Cited By (2)
US 12,191,054 US 12,381,338