IP Library Granted Patent US 10,517,166
Granted Patent B2
US 10,517,166 · App. 16/294,633 · Granted Dec 24, 2019

Optical transceiver including heat dissipation structure

Inventor: Takashi Matsui (Osaka, JP)
Assignee: Sumitomo Electric Industries, Ltd.
H05K1/0203G02B6/428G02B6/4268G02B6/4272H04B10/40H05K1/144H05K1/181G02B6/4246H05K2201/042H05K2201/10121H05K2201/10189
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Quick Facts
Patent No.
US 10,517,166
App. No.
16/294,633
Granted
Dec 24, 2019
Kind
B2
Abstract

An optical transceiver according to one example comprises: a housing having an inner surface therein; a first printed circuit board on which a CDR, which generates heat by consuming electric power, is mounted; a second printed circuit board arranged between the inner surface and the first printed circuit board; a protection member arranged to surround the periphery of the CDR in parallel with the inner surface; a thermal conductive gel in contact with each of the CDR, the protection member and the second printed circuit board; a heat dissipation sheet arranged between the second printed circuit board and the inner surface; and a heat dissipation sheet arranged between the first printed circuit board and the inner surface, wherein the protection member has an opening in contact with a part of the thermal conductive gel.

Claims (21)

1. An optical transceiver comprising:

a housing having a first surface and a second surface facing to the first surface, an internal space between the first surface and the second surface therein;

a first printed circuit board arranged between the first surface and the second surface in the internal space;

a heat generating component mounted on the first printed circuit board, the heat generating component generating heat by consuming electric power;

a second printed circuit board arranged between the first surface and the first printed circuit board in the internal space;

a protection member arranged between the first printed circuit board and the second printed circuit board, and also arranged to surround a periphery of the heat generating component in parallel with the first printed circuit board and the second printed circuit board;

a thermal conductive gel arranged between the first printed circuit board and the second printed circuit board to be in contact with each of at least the heat generating component, the protection member and the second printed circuit board;

a first heat dissipation sheet arranged between the second printed circuit board and the first surface in the internal space; and

a second heat dissipation sheet arranged between the first printed circuit board and the second surface in the internal space,

wherein the protection member surrounds the thermal conductive gel and has an opening in contact with a part of the thermal conductive gel.

2. The optical transceiver according to claim 1 ,

wherein an elastic modulus of the protection member is greater than either of an elastic modulus of the first heat dissipation sheet and an elastic modulus of the second heat dissipation sheet.

3. The optical transceiver according to claim 1 ,

wherein an elastic modulus of the protection member is smaller than either of an elastic modulus of the first printed circuit board and an elastic modulus of the second printed circuit board.

4. The optical transceiver according to claim 1 ,

wherein the protection member is constituted by a plurality of individual pieces, and

the opening is a gap formed between one of the individual pieces and another of the individual pieces.

5. The optical transceiver according to claim 4 , wherein each of the individual pieces has an L-shaped bottom surface, wherein the one of the individual pieces has a same height as the another of the individual pieces in a direction perpendicular to the bottom surface.

6. The optical transceiver according to claim 1 ,

wherein the thermal conductive gel contacts and covers the heat generating component, and is in contact with the second printed circuit board, and

an area of a portion of the thermal conductive gel in contact with the second printed circuit board is larger than an area occupied by the heat generating component on the first printed circuit board.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 6, 2019
From: MATSUI, TAKASHI
To: SUMITOMO ELECTRIC INDUSTRIES, LTD.
Reel/Frame 050244/0442 →
Priority Claims (1)
JP 2018-039624 · Mar 6, 2018 · national
Continuity (1)
Related Publication 20190281691A1 · Sep 12, 2019