Conductive paste for external electrode and method for manufacturing electronic component including the conductive paste for external electrode

1. A conductive paste for an external electrode, the conductive paste comprising:

a conductive metal powder;

a glass frit having an average particle diameter D50 of not more than 0.8 μm and having a flat shape with an average flatness of 1.5 to 5.5; and

a binder resin.

2. The conductive paste for an external electrode according to claim 1 , wherein the glass frit contains at least one selected from Ba, Ti, Al, Zn and Sr.

3. The conductive paste for an external electrode according to claim 1 , wherein the glass frit contains a B—Si-based glass.

4. The conductive paste for an external electrode according to claim 3 , wherein a shape of the conductive metal powder is spherical.

5. The conductive paste for an external electrode according to claim 4 , wherein the conductive metal powder is a Cu powder having an average particle diameter D50 of not more than 1.0 μm.

6. The conductive paste for an external electrode according to claim 1 , wherein a shape of the conductive metal powder is spherical.

7. The conductive paste for an external electrode according to claim 6 , wherein the conductive metal powder is a Cu powder having an average particle diameter D50 of not more than 1.0 μm.

8. The conductive paste for an external electrode according to claim 1 , wherein the conductive metal powder is a Cu powder having an average particle diameter D50 of not more than 1.0 μm.

9. The conductive paste for an external electrode according to claim 1 , wherein the binder resin is an acrylic resin.

10. A method for manufacturing an electronic component, the method comprising:

preparing an electronic component element;

applying conductive paste for an external electrode onto an outer surface of the electronic component element, the conductive paste comprising:

a conductive metal powder;

a glass frit having an average particle diameter D50 of not more than 0.8 μm and having a flat shape with an average flatness of 1.5 to 5.5; and

a binder resin; and

baking the conductive paste to form an external electrode on the outer surface of the electronic component element.

11. The method for manufacturing an electronic component according to claim 10 , further comprising drying the conductive paste on the outer surface of the electronic component element before the conductive paste is baked.

12. The method for manufacturing an electronic component according to claim 10 , wherein the glass frit contains at least one selected from Ba, Ti, Al, Zn and Sr.

13. The method for manufacturing an electronic component according to claim 10 , wherein the glass frit contains a B—Si-based glass.

14. The method for manufacturing an electronic component according to claim 13 , wherein a shape of the conductive metal powder is spherical.

15. The method for manufacturing an electronic component according to claim 14 , wherein the conductive metal powder is a Cu powder having an average particle diameter D50 of not more than 1.0 μm.

16. The method for manufacturing an electronic component according to claim 10 , wherein a shape of the conductive metal powder is spherical.

17. The method for manufacturing an electronic component according to claim 16 , wherein the conductive metal powder is a Cu powder having an average particle diameter D50 of not more than 1.0 μm.

18. The method for manufacturing an electronic component according to claim 10 , wherein the conductive metal powder is a Cu powder having an average particle diameter D50 of not more than 1.0 μm.

19. The method for manufacturing an electronic component according to claim 10 , wherein the binder resin is an acrylic resin.