Chip package structure
A chip package structure is provided. The chip package structure includes a first redistribution structure including a dielectric structure and a plurality of wiring layers in the dielectric structure. The chip package structure includes a first chip over the first surface. The chip package structure includes a first conductive bump between the first chip and the first redistribution structure. The chip package structure includes a first conductive pillar over the first surface adjacent to the first chip and electrically connected to the wiring layers. The chip package structure includes a second chip over the second surface. The chip package structure includes a second conductive pillar over the second surface adjacent to the second chip and electrically connected to the wiring layers. The chip package structure includes a first molding layer over the first surface and surrounding the first chip, the first conductive bump, and the first conductive pillar.
1. A chip package structure, comprising:
a first redistribution structure comprising a dielectric structure and a plurality of wiring layers in the dielectric structure, wherein the first redistribution structure has a first surface and a second surface opposite to the first surface;
a first chip over the first surface;
a first conductive bump between the first chip and the first redistribution structure;
a first conductive pillar over the first surface adjacent to the first chip and electrically connected to the wiring layers;
a second chip over the second surface, wherein the second chip comprises a substrate and a conductive pad over the substrate, and the conductive pad is between the substrate and the first redistribution structure;
a second conductive pillar over the second surface adjacent to the second chip and electrically connected to the wiring layers;
a first molding layer over the first surface and surrounding the first chip, the first conductive bump, and the first conductive pillar; and
a second molding layer over the second surface and surrounding the second chip.
2. The chip package structure as claimed in claim 1 , wherein the second molding layer further surrounds the second conductive pillar.
3. The chip package structure as claimed in claim 1 , further comprising:
a second conductive bump between the second chip and the first redistribution structure.
4. The chip package structure as claimed in claim 1 , further comprising:
a second redistribution structure having a first top surface;
a third conductive pillar over the first top surface and having a second top surface;
a third chip over the first top surface and having a third top surface, wherein a first height of the second top surface relative to the first top surface is less than a second height of the third top surface relative to the first top surface; and
a second conductive bump between the third conductive pillar and the first conductive pillar.
5. The chip package structure as claimed in claim 4 , further comprising:
a third molding layer surrounding the first molding layer, the second molding layer, the third chip, the third conductive pillar, and the second conductive bump.
6. The chip package structure as claimed in claim 5 , wherein the third molding layer is in direct contact with the third chip, the third conductive pillar, and the second conductive bump.
7. The chip package structure as claimed in claim 1 , further comprising:
a second redistribution structure over the second chip and the second molding layer;
a buffer layer between the second redistribution structure and the second chip and between the second redistribution structure and the second molding layer; and
a third chip over the second redistribution structure, wherein the second redistribution structure is between the second chip and the third chip.
8. The chip package structure as claimed in claim 7 , wherein the buffer layer comprises a polymer material.
9. The chip package structure as claimed in claim 1 , wherein the second chip is directly over the first chip.
10. A chip package structure, comprising:
a redistribution structure comprising a dielectric layer and a wiring layer over and in the dielectric layer, wherein the redistribution structure has a first surface and a second surface opposite to the first surface, and a first width of the wiring layer in the dielectric layer decreases toward the second surface;
a conductive pad over and in the dielectric layer, wherein a second width of the conductive pad in the dielectric layer decreases toward the first surface;
a first chip over the first surface;
a first conductive bump between the first chip and the redistribution structure;
a second chip over the second surface; and
a second conductive bump between the second chip and the conductive pad.
11. The chip package structure as claimed in claim 10 , wherein the conductive pad is partially over the second surface.
12. The chip package structure as claimed in claim 10 , wherein the conductive pad is in direct contact with the wiring layer over the dielectric layer.
13. The chip package structure as claimed in claim 10 , wherein the second conductive bump in direct contact with the conductive pad over the dielectric layer.
14. The chip package structure as claimed in claim 10 , further comprising:
a first molding layer over the first surface and surrounding the first chip and the first conductive bump.
15. The chip package structure as claimed in claim 14 , further comprising:
a second molding layer over the second surface and surrounding the second chip, the second conductive bump, and the conductive pad.
16. A chip package structure, comprising:
a first redistribution structure comprising a first dielectric structure and first wiring layers in the first dielectric structure;
a first chip over the first redistribution structure;
a first conductive pillar over the first redistribution structure;
a first molding layer over the first redistribution structure and surrounding the first chip and the first conductive pillar;
a second redistribution structure over the first chip, the first conductive pillar, and the first molding layer, wherein the first chip comprises a first substrate and a first conductive pad, and the first conductive pad is between the first substrate and the second redistribution structure;
a second chip over the second redistribution structure;
a second conductive pillar over the second redistribution structure; and
a second molding layer surrounding the second chip and the second conductive pillar.
17. The chip package structure as claimed in claim 16 , wherein the second chip comprises a second substrate and a second conductive pad, and the second conductive pad is between the second substrate and the second redistribution structure.
18. The chip package structure as claimed in claim 16 , further comprising:
an adhesive layer between the first substrate and the first redistribution structure.
19. The chip package structure as claimed in claim 18 , wherein the adhesive layer is made of an insulating material.
20. The chip package structure as claimed in claim 16 , wherein the second conductive pillar is directly over the first conductive pillar.