Cooling electronic devices in a data center
A cooling system, for example, for rack mounted electronic devices (e.g., servers, processors, memory, networking devices or otherwise) in a data center. In various disclosed implementations, the cooling system may be or include a liquid cold plate assembly that is part of or integrated with a server tray package. In some implementations, the liquid cold plate assembly includes a base portion and a top portion that, in combination, form a cooling liquid flow path through which a cooling liquid is circulated and a thermal interface between one or more heat generating devices and the cooling liquid.
1. A server tray package, comprising:
a motherboard assembly that comprises a plurality of data center electronic devices, the plurality of data center electronic devices comprising at least one heat generating processor device that comprises a height dimension less than a respective height dimension of at least another of the plurality of data center electronic devices; and
a liquid cold plate assembly that comprises:
a base mounted to the motherboard assembly, the base and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and
a top hat mounted to the base and comprising a heat transfer member that comprises an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member, the heat transfer member comprising a first portion, in conductive thermal contact with the at least another of the plurality of data center electronic devices through a first thermal interface material positioned between the at least another of the plurality of data center electronic devices and the first portion of the top hat, the first portion having a first thickness dimension, and a second portion, in conductive thermal contact with the heat generating processor device through a second thermal interface material positioned between the at least one heat generating processor device and the second portion of the top hat, the second portion having a second thickness dimension greater than the first thickness dimension.
2. The server tray package of claim 1 , wherein the liquid cold plate assembly further comprises a plurality of heat transfer surfaces enclosed within the cooling liquid flow path.
3. The server tray package of claim 2 , wherein the heat transfer surfaces are positioned in a volume of the top hat defined by the second portion.
4. The server tray package of claim 3 , wherein the heat transfer surfaces extend from a bottom interior surface of the second portion of the top hat to at or near a top interior surface of the top hat, and the cooling liquid flow path comprises a first height dimension in the first portion of the top hat less than a second height dimension in the second portion of the top hat.
5. The server tray package of claim 3 , wherein the heat transfer surfaces extend from a bottom interior surface of the second portion of the top hat to at or near a top interior surface of the top hat, and the cooling liquid flow path comprises a first height dimension in the first portion of the top hat equal to a second height dimension in the second portion of the top hat.
6. The server tray package of claim 1 , wherein the heat transfer surfaces are positioned in the first and second portions of the top hat.
7. The server tray package of claim 1 , wherein the base portion further comprises a lid that comprises an aperture therethrough sized to receive the second portion of the top hat.
8. The server tray package of claim 7 , wherein the lid is in conductive thermal contact between the first portion of the top hat at the another of the plurality of data center electronic devices.
9. The server tray package of claim 1 , wherein the first portion of the top hat comprises a perimeter portion and the second portion of the top hat comprises an interior portion bounded by the perimeter portion.
10. The server tray package of claim 1 , wherein the another of the plurality of data center electronic devices comprises a voltage regulator.
11. A method for cooling heat generating devices in a data center, comprising:
circulating a flow of a cooling liquid to a server tray package that comprises:
a motherboard assembly that comprises a plurality of data center electronic devices, the plurality of data center electronic devices comprising at least one heat generating processor device that comprises a height dimension less than a respective height dimension of at least another of the plurality of data center electronic devices, and
a liquid cold plate assembly that comprises a base mounted to the motherboard assembly, the base and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices, and a top hat mounted to the base and comprising a heat transfer member that comprises a first portion in conductive thermal contact with the at least another of the plurality of data center electronic devices through a first thermal interface material positioned between the at least another of the plurality of data center electronic devices and the first portion of the top hat, the first portion having a first thickness dimension, and a second portion, in conductive thermal contact with the heat generating processor device through a second thermal interface material positioned between the at least one heat generating processor device and the second portion of the top hat, the second portion having a second thickness dimension greater than the first thickness dimension;
circulating a flow of a cooling liquid into an inlet port of the heat transfer member;
circulating the flow of the cooling liquid from the inlet port through a cooling liquid flow path defined through the first portion of the heat transfer member;
receiving heat from the another of the plurality of data center electronic devices into the cooling liquid flowing through the first portion of the heat transfer member;
circulating the flow of the cooling liquid from the inlet port through the cooling liquid flow path defined through the second portion of the heat transfer member;
receiving heat from the at least one heat generating processing device into the cooling liquid flowing through the second portion of the heat transfer member; and
circulating the heated flow of the cooling liquid from the cooling liquid flow path to an outlet port of the heat transfer member.
12. The method of claim 11 , wherein the liquid cold plate assembly further comprises a plurality of heat transfer surfaces enclosed within the cooling liquid flow path.
13. The method of claim 12 , wherein the heat transfer surfaces are positioned in a volume of the top hat defined by the second portion.
14. The method of claim 13 , wherein the heat transfer surfaces extend from a bottom interior surface of the second portion of the top hat to at or near a top interior surface of the top hat, and the cooling liquid flow path comprises a first height dimension in the first portion of the top hat less than a second height dimension in the second portion of the top hat.
15. The method of claim 13 , wherein the heat transfer surfaces extend from a bottom interior surface of the second portion of the top hat to at or near a top interior surface of the top hat, and the cooling liquid flow path comprises a first height dimension in the first portion of the top hat equal to a second height dimension in the second portion of the top hat.
16. The method of claim 11 , wherein the heat transfer surfaces are positioned in the first and second portions of the top hat.
17. The method of claim 11 , wherein the base portion further comprises a lid that comprises an aperture therethrough sized to receive the second portion of the top hat.
18. The method of claim 17 , wherein the lid is in conductive thermal contact between the first portion of the top hat at the another of the plurality of data center electronic devices.
19. The method of claim 11 , wherein the first portion of the top hat comprises a perimeter portion and the second portion of the top hat comprises an interior portion bounded by the perimeter portion.
20. The method of claim 11 , wherein the another of the plurality of data center electronic devices comprises a voltage regulator.
21. The server tray package of claim 3 , wherein the heat transfer surfaces are positioned in the first and second portions of the top hat,
the base portion further comprises a lid that comprises an aperture therethrough sized to receive the second portion of the top hat, the lid in conductive thermal contact between the first portion of the top hat at the another of the plurality of data center electronic devices,
the first portion of the top hat comprises a perimeter portion and the second portion of the top hat comprises an interior portion bounded by the perimeter portion, and
the another of the plurality of data center electronic devices comprises a voltage regulator.
22. The method of claim 13 , wherein the heat transfer surfaces are positioned in the first and second portions of the top hat,
the base portion further comprises a lid that comprises an aperture therethrough sized to receive the second portion of the top hat, the lid in conductive thermal contact between the first portion of the top hat at the another of the plurality of data center electronic devices,
the first portion of the top hat comprises a perimeter portion and the second portion of the top hat comprises an interior portion bounded by the perimeter portion, and
the another of the plurality of data center electronic devices comprises a voltage regulator.