Method for mounting SMD components on contact springs in electric motors
A method for mounting SMD components on contact springs in electric motors. In a first method variation, the SMD component is mounted on the base of a carrier of the electric motor, which has already been provided with a contact spring protruding into a cavity. As the SMD component is installed, the contact spring is pressed back such that no frictional or sliding contact arises during installation. In a second variation, the SMD component is mounted first and then a contact spring is inserted using a press tool. As the contact spring is inserted, the spring is held back such that likewise no frictional or sliding contact arises with the SMD component that has already been installed. This avoids damage to the SMD component caused by the contact spring during installation.
1. A method for mounting surface mount device (SMD) components on at least one projecting electrical contact spring comprising:
gripping an SMD component to be mounted on a base of a support using a gripping and mounting tool;
moving the SMD component over a mounting point on the support;
pushing back the previously installed at least one projecting electrical contact spring using a pusher;
arranging the SMD component on the base of the support after the previously installed at least one projecting electrical contact spring has been installed;
removing the gripping and mounting tool; and
removing the pusher so that the previously installed at least one projecting electrical contact spring directly contacts the SMD component.
2. The method as claimed in claim 1 , wherein the SMD component is arranged in a cavity of the support into which the at least one contact spring projects.
3. The method as claimed in claim 2 , wherein a pressing tool is used on which the pusher is arranged.
4. The method as claimed in claim 1 , wherein the SMD component is moved onto its mounting point until it touches fixed lead frame contacts.
5. The method as claimed in claim 1 , wherein a pusher pin is used as a pusher.
6. A method for mounting surface mount device (SMD) components on at least one projecting contact spring, comprising:
gripping an SMD component to be mounted on a base of a support using a gripping and mounting tool;
moving the SMD component over a mounting point on the support;
pushing back the at least one projecting contact spring using a pusher;
arranging the SMD component on the base of the support;
removing the gripping and mounting tool; and
removing the pusher, wherein the method is performed simultaneously with multiple SMD components to be mounted.
7. The method for mounting SMD components on at least one contact spring as claimed in claim 1 , wherein the at least one contact spring is in an electromotor.
8. A method for mounting surface mount device (SMD) components on at least one electrical contact spring of a component comprising:
gripping an SMD component to be mounted on a base of a support of the component using a gripping and mounting tool;
arranging the SMD component on the base of the support;
pressing a device holding the at least one electrical contact spring onto a component of the device using a pressing tool and simultaneously holding back the at least one electrical contact spring using a pusher;
removing the pressing tool and the pusher; and
removing the gripping and mounting tool so that the at least one electrical contact spring directly electrically contacts the SMD component.
9. The method for mounting SMD components as claimed in claim 8 , wherein the component is an electromotor.
10. The method as claimed in claim 8 , wherein the SMD component is arranged in a cavity of the support into which the at least one contact spring projects.
11. The method as claimed in claim 10 , wherein a pressing tool is used on which the pusher is arranged.
12. The method as claimed in claim 8 , wherein the SMD component is moved onto its mounting point until it touches fixed lead frame contacts.
13. The method as claimed in claim 8 , wherein a pusher pin is used as a pusher.
14. The method as claimed in claim 8 , wherein the method is performed simultaneously with multiple SMD components to be mounted.