IP Library Granted Patent US 10,580,948
Granted Patent B2
US 10,580,948 · App. 15/884,295 · Granted Mar 3, 2020

Light source module

Inventors: Yao-Chi Peng (Taipei, TW); Tsan-Li Chiu (Taipei, TW); Po-Chang Li (Taipei, TW); Ming-Hung Chien (Taipei, TW)
Assignee: Lite-On Technology Corporation
H01L33/56H01L33/483H01L33/502H01L33/505H01L33/507H01L33/54H01L33/58H01L33/60H01L33/486H01L2933/005H01L2933/0041H01L2933/0058H01L2933/0091
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Quick Facts
Patent No.
US 10,580,948
App. No.
15/884,295
Granted
Mar 3, 2020
Kind
B2
Abstract

A light source module including a substrate, an LED package, an optical cover, and at least one packing layer is provided. The LED package is disposed on the substrate and includes an encapsulant. The optical cover is disposed above the LED package. The at least one packing layer is filled between the LED package and the optical cover.

Claims (25)

1. A light source module comprising:

a substrate;

an LED package disposed on the substrate, the LED package comprising an encapsulant;

an optical cover disposed above the LED package; and

at least one packing layer filled between the LED package and the optical cover, wherein the at least one packing layer comprises a first packing layer and a second packing layer, the first packing layer covers the LED package, the second packing layer covers the first packing layer, the second packing layer comprises diffuser particles or phosphors, a refractive index of the second packing layer is greater than a refractive index of the first packing layer, and the refractive index of the second packing layer is less than a refractive index of the encapsulant.

2. The light source module according to claim 1 , wherein the refractive index of the second packing layer is greater than or equal to a refractive index of the optical cover.

3. The light source module according to claim 1 , wherein an air gap does not exist between the LED package and the optical cover.

4. The light source module according to claim 1 , wherein a percentage by weight of the diffuser particles is 0.1% to 20%.

5. The light source module according to claim 1 , wherein a percentage by weight of the phosphors is 0.1% to 30%.

6. The light source module according to claim 1 , wherein a difference between a refractive index of the first packing layer and a refractive index of the second packing layer is 0.05 to 0.5.

7. The light source module according to claim 1 , further comprising:

a blue light reflector coating film located on an inner surface or an outer surface of the at least one packing layer so as to reflect a blue light.

8. The light source module according to claim 1 , further comprising:

a yellow light reflector coating film located on an inner surface of the at least one packing layer comprising phosphors so as to reflect a yellow light.

9. The light source module according to claim 1 , wherein an inner surface of the optical cover is a non-axisymmetric curved surface or an irregular curved surface.

10. A manufacturing method of light source module, comprising:

providing an optical cover having a resin material injection hole;

aligning and attaching a substrate having a LED package with the optical cover, wherein the LED package comprises an LED and an encapsulant encapsulating the LED;

injecting a first resin material through the resin material injection hole into the optical cover to cover the LED package;

curing the first resin material to form a first packing layer covering the LED package, wherein the first packing layer covers the encapsulant;

injecting a second resin material through the resin material injection hole into the optical cover to cover the first packing layer; and

curing the second resin material to form a second packing layer covering the first packing layer, wherein the first packing layer is located between the encapsulant and the second packing layer,

wherein the second packing layer comprises diffuser particles or phosphors, a refractive index of the second packing layer is greater than a refractive index of the first packing layer, and the refractive index of the second packing layer is less than a refractive index of the encapsulant.

11. The manufacturing method of light source module according to claim 10 , wherein the optical cover is transparent, the first resin material is a photocurable material, wherein in a step of curing the first resin material further comprises irradiating light on the optical cover.

12. The manufacturing method of light source module according to claim 10 , wherein the optical cover is transparent, the second resin material is a photocurable material, wherein in a step of curing the second resin material further comprises irradiating light on the optical cover.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 16, 2022
From: LITE-ON TECHNOLOGY CORPORATION
To: LEOTEK CORPORATION
Reel/Frame 059911/0453 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 31, 2018
From: PENG, YAO-CHI; CHIU, TSAN-LI; LI, PO-CHANG; CHIEN, MING-HUNG
To: LITE-ON TECHNOLOGY CORPORATION
Reel/Frame 044779/0425 →
Priority Claims (1)
CN 2017 1 0416788 · Jun 6, 2017 · national
Continuity (1)
Related Publication 20180351055A1 · Dec 6, 2018