Support assembly
A method and apparatus for removing native oxides from a substrate surface is provided. In one aspect, the apparatus comprises a support assembly. In one embodiment, the support assembly includes a shaft coupled to a disk-shaped body. The disk-shaped body includes an upper surface, a lower surface and a cylindrical outer surface. A flange extends radially outward from the cylindrical outer surface. A fluid channel is formed in the disk-shaped body and is coupled to the heat transfer fluid conduit of the shaft. A plurality of grooves formed in the upper surface are coupled by a hole to the vacuum conduit of the shaft. A gas conduit formed through the disk-shaped body couples the gas conduit of the shaft to the cylindrical outer surface of the disk-shaped body.
1. A component for mounting to a chamber lid of a plasma processing chamber, comprising:
a first electrode adapted to be coupled to an RF power source, the first electrode comprising:
an upper section having a lower disk surface, an upper disk surface, and an outer disk diameter; and
an expanding section extending from the lower disk surface to a lower body surface, the expanding section having:
a cylindrical peripheral outer wall having a diameter extending from the lower disk surface to the lower body surface, wherein the diameter is less than the outer disk diameter; and
a conical inner diameter wall defining a cavity and expanding outwards from an opening formed in the cavity to the lower body surface, wherein the conical inner diameter wall has a slope in the range of 1:1 to 20:1; and
a gas inlet extending from the outer disk diameter to the opening formed in the cavity; and
a second electrode coupled to a top surface of a distribution plate, a top surface of a blocker plate, and a ground, wherein the first electrode is coupled to and electrically isolated from the second electrode by an insulator disposed therebetween;
wherein the blocker plate comprises apertures formed therein; and
wherein the blocker plate is disposed between the second electrode and the distribution plate.
2. The component of claim 1 , wherein the conical inner diameter wall is nickel plated.
3. The component of claim 1 , wherein the conical inner diameter wall has a slope of at least 5:1.
4. The component of claim 1 further comprising:
an o-ring gland formed on a lower surface of the upper section.
5. The component of claim 1 , wherein the upper section is configured to be coupled to an RF power source.
6. The component of claim 1 , wherein the upper section of the first electrode is configured to be encompassed by the insulator when mounted to the chamber lid.
7. The component of claim 1 , wherein the expanding section of the first electrode is configured to be encompassed by the insulator when mounted to the chamber lid.
8. A component for mounting to a chamber lid of a plasma processing chamber, comprising:
a first electrode adapted to be coupled to an RF power source, the first electrode comprising:
an upper section having a lower disk surface, an upper disk surface and an outer disk diameter; and
an expanding section extending from the lower disk surface to a lower body surface, the expanding section having:
a cylindrical peripheral outer wall having a diameter extending from the lower disk surface to the lower body surface, wherein the diameter is less than the outer disk diameter; and
a conical inner diameter wall defining a cavity and expanding outwards from an opening formed in the cavity to the lower body surface, wherein the conical inner diameter wall has a slope in the range of 1:1 to 20:1; and
a gas inlet that extends from the outer disk diameter to the opening formed in the cavity; and
a second electrode coupled to a ground, a top surface of a distribution plate, and a top surface of a blocker plate, wherein the first electrode is coupled to and electrically isolated from the second electrode by an insulator disposed therebetween;
wherein the distribution plate is in electrical communication with the second electrode;
wherein the blocker plate comprises apertures formed therein; and
wherein the blocker plate is disposed between the second electrode and the distribution plate.
9. The component of claim 8 , wherein the second electrode is coupled to the distribution plate, and wherein the distribution plate is disk-shaped and comprises apertures for disposing a flow of gas from therein.
10. The component of claim 9 , further comprises a channel for housing a heater or a heat transfer medium, wherein the channel is disposed above the bottom surface of the distribution plate.
11. The component of claim 8 , wherein the upper section of the first electrode is configured to be encompassed by the insulator when mounted to the chamber lid.
12. The component of claim 8 , wherein the expanding section of the first electrode is configured to be encompassed by the insulator when mounted to the chamber lid.
13. A component for mounting to a chamber lid of a processing chamber, comprising:
a first electrode adapted to be coupled to an RF power source, the first electrode comprising:
an upper section having an outer disk diameter and a lower disk surface;
an expanding section extending from the lower disk surface to a lower body surface, the expanding section having:
a cylindrical peripheral outer wall having a diameter extending from the lower disk surface to the lower body surface, wherein the diameter is less than the outer disk diameter; and
a conical inner diameter wall defining a cavity and expanding away from an opening formed in the cavity to the lower body surface; and wherein
a gas inlet extending from the outer disk diameter to the opening formed in the cavity; and
a second electrode coupled to a top surface of a distribution plate, a top surface of a blocker plate, and a ground, wherein the first electrode is coupled to and electrically isolated from the second electrode by an insulator disposed therebetween;
wherein the distribution plate is in electrical communication with the second electrode;
wherein the blocker plate comprises apertures formed therein; and
wherein the blocker plate is disposed between the second electrode and the distribution plate.
14. The component of claim 13 , wherein the second electrode is coupled to and in electrical communication with a blocker plate with apertures formed therein and a distribution plate with apertures formed therein.
15. The component of claim 13 , wherein the second electrode is coupled to and in electrical communication with a distribution plate.
16. The component of claim 13 , wherein the conical inner diameter wall has a slope of at least 5:1.
17. The component of claim 13 , wherein the conical inner diameter wall is nickel plated.
18. The component of claim 13 , wherein the upper section of the first electrode is configured to be encompassed by the insulator when mounted to the chamber lid.
19. The component of claim 13 , wherein the expanding section of the first electrode is configured to be encompassed by the insulator when mounted to the chamber lid.
20. The component of claim 13 , wherein the distribution plate is disk-shaped and comprises apertures for disposing a flow of gas from therein.