Granted Patent
S1
US 1,059,363 · App. 29/817,158 · Granted Jan 28, 2025
Device cover
Assignee:
Amazon Technologies, Inc.
View Patent ↗
Loading inventors, assignments & file history…
Claims (1)
The ornamental design for a device cover, as shown and described.
Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded Nov 29, 2021
From: WALL, TIM; CHANG, JEN-YANG
To: AMAZON TECHNOLOGIES, INC.
Reel/Frame 058231/0579 →
Continuity (2)
Division
29765019
· Jan 5, 2021
Division
29661335
· Aug 27, 2018
References Cited (40)
US D659139S
· Gengler
· 2012
[cited by examiner]
US D675211S
· Rouser
· 2013
[cited by examiner]
US D676449S
· Probst et al.
· 2013
[cited by applicant]
US D685799S
· Canizares et al.
· 2013
[cited by applicant]
US D685800S
· Canizares et al.
· 2013
[cited by applicant]
US D685801S
· Canizares et al.
· 2013
[cited by applicant]
US D685802S
· Canizares et al.
· 2013
[cited by applicant]
US D710857S
· Mecchella et al.
· 2014
[cited by applicant]
US D723038S
· Kim
· 2015
[cited by applicant]
US D733111S
· Kim
· 2015
[cited by examiner]
US D745480S
· Mathews
· 2015
[cited by examiner]
US D748636S
· Zadvinskis
· 2016
[cited by examiner]
US D779497S
· Meng
· 2017
[cited by examiner]
US D809497S
· Kim
· 2018
[cited by examiner]
US D810088S
· Moore et al.
· 2018
[cited by applicant]
US D810750S
· Chang et al.
· 2018
[cited by applicant]
US D811411S
· Moore et al.
· 2018
[cited by applicant]
US D859416S
· Moore et al.
· 2019
[cited by applicant]
US D875101S
· Moore
· 2020
[cited by applicant]
US D892125S
· Ham
· 2020
[cited by applicant]
US D903687S
· Moore
· 2020
[cited by applicant]
US D909389S
· Wall et al.
· 2021
[cited by applicant]
US D923013S
· Akana et al.
· 2021
[cited by applicant]
US D929385S
· Cho
· 2021
[cited by examiner]
US D929386S
· Chung
· 2021
[cited by examiner]
US D929978S
· Hwang
· 2021
[cited by examiner]
US D929979S
· Hwang
· 2021
[cited by examiner]
US D939492S
· Kim
· 2021
[cited by examiner]
US 20130015088A1
· Wu
· 2013
[cited by applicant]
JP D1638498
· 2019
[cited by applicant]
Canadian Office Action mailed on Sep. 9, 2019 for Canadian Design Application No. 185774, a counterpart of U.S. Appl. No. 29/661,335, 3 pages.
[cited by applicant]
Indian Office Action mailed on Feb. 11, 2019 for Indian Patent Application No. 314337-001, a counterpart of U.S. Appl. No. 29/661,335, 2 pages.
[cited by applicant]
Japanese Office Action mailed on Feb. 7, 2020 for Japanese Patent Application No. 2019-001239, a counterpart of U.S. Appl. No. 29/661,335, 3 pages.
[cited by applicant]
Korean Office Action mailed on Sep. 9, 2019 for Korean Patent Application No. 30-2019-3938, a counterpart of U.S. Appl. No. 29/661,335, 2 pages.
[cited by applicant]