Light-emitting device and integrated light-emitting device
A light-emitting device includes: a base member that comprises conductor wirings; a light-emitting element that is mounted on the base member and emits first light; a wavelength conversion member that is disposed on or above an upper surface of the light-emitting element and is adapted to absorb at least part of the first light and emit second light with a wavelength longer than a wavelength of the first light; a light-reflective film that is disposed on an upper surface of the wavelength conversion member; and an encapsulating member that covers the light-emitting element, the wavelength conversion member, and the light-reflective film. A ratio (H/W) of a height (H) to a width (W) of the encapsulating member is smaller than 0.5.
1. A light-emitting device comprising:
a base member that comprises conductor wirings;
a light-emitting element that is mounted on the base member and emits first light;
a wavelength conversion member that is disposed on or above an upper surface of the light-emitting element and is adapted to absorb at least part of the first light and emit second light with a wavelength longer than a wavelength of the first light;
a light-reflective film that is disposed on an upper surface of the wavelength conversion member; and
an encapsulating member that covers the light-emitting element, the wavelength conversion member, and the light-reflective film,
wherein a ratio (H/W) of a height (H) to a width (W) of the encapsulating member is smaller than 0.5, and
wherein the wavelength conversion member has a bottom surface positioned on a light emitting element side, and an area of the bottom surface of the wavelength conversion member is larger than an area of the upper surface of the light-emitting element.
2. The light-emitting device according to claim 1 , wherein a surface of the encapsulating member comprises a convex surface.
3. The light-emitting device according to claim 1 , wherein the light-reflective film comprises a dielectric multilayer film.
4. The light-emitting device according to claim 1 , further comprising a white member that covers lateral surfaces of the light-emitting element.
5. The light-emitting device according to claim 4 , further comprising an oil-repellent material disposed along a periphery of a bottom surface of the wavelength conversion member.
6. The light-emitting device according to claim 1 , wherein an inner bottom surface of the wavelength conversion member faces the upper surface of the light-emitting element.
7. The light-emitting device according to claim 6 , wherein a peripheral bottom surface of the wavelength conversion member surrounds the inner bottom surface.
8. The light-emitting device according to claim 7 , further comprising a light-transmissive member below the peripheral bottom surface, the light-transmissive member covering lateral surfaces of the light-emitting element.
9. The light-emitting device according to claim 8 , wherein a surface of the light-transmissive member comprises an inclined surface that becomes closer to a lateral surface of the light-emitting element as a distance from the wavelength conversion member increases.
10. The light-emitting device according to claim 9 , further comprising a low refractive member that covers the inclined surface and has a refractive index smaller than a refractive index of the light-transmissive member.
11. The light-emitting device according to claim 1 , further comprising a white member that covers the inclined surface.
12. The light-emitting device according to claim 1 , wherein 30% or more of a total amount of light emitted from the light-emitting device is emitted in an elevation angle range of less than 20° relative to an upper surface of the base member.
13. The light-emitting device according to claim 1 , wherein 40% or more of a total amount of light emitted from the light-emitting device is emitted in an elevation angle range of less than 20° relative to an upper surface of the base member.
14. The light-emitting device according to claim 1 , wherein the ratio (H/W) of a height (H) to a width (W) of the encapsulating member is 0.3 or less.
15. The light-emitting device according to claim 1 , wherein the light-emitting element is flip-chip mounted.
16. An integrated light-emitting device comprising:
a plurality of light-emitting devices according to claim 1 ; and
a plurality of light-reflective members respectively disposed between the light-emitting devices.
17. The integrated light-emitting device according to claim 16 , wherein a height of the light-reflective members is a maximum of 0.3 times a distance between the light-emitting devices.
18. The integrated light-emitting device according to claim 16 , wherein a height of the light-reflective members is a maximum of 0.2 times a distance between the light-emitting devices.