Method for manufacturing of display device using inspection pattern
A method for manufacturing a display device is provided. A process of forming an inspection pattern, in which a protective film unit is partially removed in a thickness direction, in a pad area portion of the protective film unit, which corresponds to a pad area of a display unit, may be performed, and then, a process of delaminating the pad area portion of the protective film unit may be performed. A process of checking whether the inspection pattern exists may be performed to check whether the delamination has succeeded, and, at the same time, a process of measuring distances from an alignment mark to each of a long side and a short side of the display unit may be performed.
1. A method for manufacturing a display device, the method comprising:
providing a work panel comprising a work substrate comprising a plurality of display units each comprising a display area and a pad area, and a work protective film attached onto the work substrate;
separating a plurality of display panels from the work panel, each comprising a display unit of the plurality of display units and a protective film unit of the work protective film overlapping on the display unit on a plane;
forming a cutting line in the protective film unit so as to correspond to a boundary between the display area and the pad area;
forming an inspection pattern, in which the protective film unit is partially removed in a thickness direction, in a pad film area portion of the protective film unit, which corresponds to the pad area of the display unit;
delaminating the pad film area portion of the protective film unit along the cutting line; and
checking whether the inspection pattern exists in the pad area of the display unit.
2. The method of claim 1 , wherein the pad area comprises a plurality of wires and a plurality of alignment marks, and
the inspection pattern overlaps at least one of the plurality of alignment marks.
3. The method of claim 2 , wherein the inspection pattern overlaps at least one of the plurality of wires.
4. The method of claim 2 , wherein the plurality of alignment marks is formed on a same layer as that of a wire of the plurality of wires.
5. The method of claim 2 , further comprising measuring distances from an alignment mark of the plurality of alignment marks to each of a long side and a short side of the display unit.
6. The method of claim 5 , wherein measuring distances from the alignment mark to each of the long side and the short side of the display unit and checking whether the inspection pattern exists are performed at the same time.
7. The method of claim 1 , wherein an adhesive layer is between the protective film unit and the display unit, and
wherein the cutting line is formed by completely removing the protective film unit in a thickness direction of the display panel along the boundary between the display area and the pad area to expose the adhesive layer to the outside.
8. The method of claim 7 , wherein the adhesive layer exposed to the outside by the cutting line has a thickness of 25 μm to about 40 μm.
9. The method of claim 1 , wherein the display unit comprises a base substrate, a circuit element layer, a display element layer, and a thin-film encapsulation layer, which are sequentially laminated.
10. The method of claim 1 , further comprising a work protective film attached to a bottom surface of the work panel.
11. A method for manufacturing a display device, the method comprising:
providing a display unit comprising a display area and a pad area;
attaching a protective film unit comprising a first area and a second area respectively corresponding to the display area and the pad area onto the display unit;
forming a cutting line so as to correspond to a boundary between the first area and the second area;
forming an inspection pattern, in which the protective film unit is partially removed in a thickness direction, on the second area of the protective film unit;
delaminating the protective film unit corresponding to the second area along the cutting line; and
checking whether the inspection pattern exists on the pad area.
12. The method of claim 11 , wherein the pad area comprises a plurality of alignment marks, and
the inspection pattern overlaps at least one of the plurality of alignment marks.
13. The method of claim 12 , further comprising measuring distances from the at least one alignment mark to each of a long side and a short side of the display unit.
14. The method of claim 13 , wherein measuring distances from the at least one alignment mark to each of the long side and the short side of the display unit and checking whether the inspection pattern exists are performed at the same time.
15. The method of claim 11 , wherein the pad area comprises a plurality of wires, and
the inspection pattern overlaps at least one of the plurality of wires.
16. The method of claim 11 , wherein an adhesive layer is between the protective film unit and the display unit, and
wherein the cutting line is formed by completely removing the protective film unit in a thickness direction of the display panel along the boundary between the display area and the pad area to expose the adhesive layer to the outside.
17. The method of claim 11 , wherein the display unit comprises a base substrate, a circuit element layer, a display element layer, and a thin-film encapsulation layer, which are sequentially laminated.