Signal isolator having interposer
Methods and apparatus for a signal isolator having a dielectric interposer supporting first and second die each having a magnetic field sensing element. A first signal path extends from the first die to the second die and a second signal path extends from the second die to the first die. In embodiments, the first signal path is located in the interposer and includes a first coil to generate a magnetic field and the second signal path is located in the interposer and includes a second coil to generate a magnetic filed. The first coil is located in relation to the second magnetic field sensing element of the second die and the second coil is located in relation to the first magnetic field sensing element of the first die.
1. A signal isolator, comprising:
an interposer comprising a dielectric material;
a first die disposed on a surface of the interposer;
a first magnetic field sensing element associated with the first die;
a second die disposed on the surface of the interposer;
a second magnetic field sensing element associated with the second die;
a first signal path extending from the first die to the second die to transmit data from the first die to the second die, wherein the first and second die are configured for different voltage domains;
a second signal path extending from the second die to the first die to transmit data from the second die to the first die;
wherein the first signal path is located in the interposer and includes a first coil to generate a magnetic field in response to current flow, and wherein the second signal path is located in the interposer and includes a second coil to generate a magnetic field in response to current flow, wherein the first coil is located in relation to the second magnetic field sensing element of the second die and the second coil is located in relation to the first magnetic field sensing element of the first die.
2. The signal isolator according to claim 1 , wherein the interposer includes a substrate on which the dielectric material is disposed.
3. The signal isolator according to claim 2 , wherein the dielectric material comprises at two or more layers.
4. The signal isolator according to claim 2 , wherein the substrate comprises a semiconductor material.
5. The signal isolator according to claim 1 , wherein the first and second signal paths are configured to provide horizontal isolation between the first and second die.
6. The signal isolator according to claim 5 , wherein the horizontal isolation includes locating the first and second signal paths at opposite portions of the interposer.
7. The signal isolator according to claim 1 , wherein the first and second signal paths are configured to provide vertical isolation between the first and second die.
8. The signal isolator according to claim 7 , wherein the vertical isolation includes the first coil and the second magnetic field sensing element being vertically aligned and spaced a first distance from each other through the dielectric material of the interposer.
9. The signal isolator according to claim 1 , wherein the first magnetic field sensing element comprises a Hall element.
10. The signal isolator according to claim 1 , wherein the first magnetic field sensing element comprises a magnetoresistance element.
11. The signal isolator according to claim 1 , wherein the first magnetic field sensing element comprises a giant magnetoresistance (GMR) element.
12. The signal isolator according to claim 1 , wherein the first magnetic field sensing element comprises a tunneling magnetoresistance (TMR) element.
13. The signal isolator according to claim 1 , wherein a space is formed between the first die and the interposer.
14. The signal isolator according to claim 13 , wherein the space is at least partially filled with mold compound.
15. The signal isolator according to claim 13 , wherein the space is at least partially filled with an underfill material.
16. A method, comprising:
employing an interposer comprising a dielectric material;
disposing a first die on a surface of the interposer with a first magnetic field sensing element associated with the first die;
disposing a second die on the surface of the interposer with a second magnetic field sensing element associated with the second die;
extending a first signal path from the first die to the second die to transmit data from the first die to the second die, wherein the first and second die are configured for different voltage domains; and
extending a second signal path from the second die to the first die to transmit data from the second die to the first die,
wherein the first signal path is located in the interposer and includes a first coil to generate a magnetic field in response to current flow, and wherein the second signal path is located in the interposer and includes a second coil to generate a magnetic field in response to current flow, wherein the first coil is located in relation to the second magnetic field sensing element of the second die and the second coil is located in relation to the first magnetic field sensing element of the first die.
17. The method according to claim 16 , wherein the interposer includes a substrate on which the dielectric material is disposed.
18. The method according to claim 17 , wherein the substrate comprises a semiconductor material.
19. The method according to claim 16 , wherein the first and second signal paths are configured to provide horizontal isolation between the first and second die.
20. The method according to claim 19 , wherein the horizontal isolation includes locating the first and second signal paths at opposite portions of the interposer.
21. The method according to claim 19 , wherein the first and second signal paths are configured to provide vertical isolation between the first and second die.
22. The method according to claim 21 , wherein the vertical isolation includes the first coil and the second magnetic field sensing element being vertically aligned and spaced a first distance from each other through the dielectric material of the interposer.
23. The method according to claim 16 , wherein the first magnetic field sensing element comprises a Hall element.
24. The method according to claim 16 , wherein the first magnetic field sensing element comprises a magnetoresistance element.
25. The method according to claim 16 , wherein the first magnetic field sensing element comprises a giant magnetoresistance (GMR) element.
26. The method according to claim 16 , wherein the first magnetic field sensing element comprises a tunneling magnetoresistance (TMR) element.
27. The method according to claim 16 , wherein a space is formed between the first die and the interposer.
28. The method according to claim 27 , wherein the space is at least partially filled with mold compound.
29. A signal isolator, comprising:
an interposer means comprising a dielectric material;
a first die disposed on a surface of the interposer;
a first magnetic field sensing means associated with the first die;
a second die disposed on the surface of the interposer means;
a second magnetic field sensing means associated with the second die;
a first signal path means extending from the first die to the second die to transmit data from the first die to the second die, wherein the first and second die are configured for different voltage domains;
a second signal path means extending from the second die to the first die to transmit data from the second die to the first die;
wherein the first signal path means is located in the interposer means and includes a first coil to generate a magnetic field in response to current flow, and wherein the second signal path means is located in the interposer means and includes a second coil to generate a magnetic field in response to current flow, wherein the first coil is located in relation to the second magnetic field sensing means of the second die and the second coil is located in relation to the first magnetic field sensing means of the first die.
30. The signal isolator according to claim 29 , wherein the interposer means includes a substrate on which the dielectric material is disposed.