Heat sink assembly
View Patent ↗A heat sink assembly, includes: a first heat sink; an adhesive thermal interface material applied to the first heat sink to mate the first heat sink to a first heat-generating component; a second heat sink; one or more support members connecting the first heat sink and the second heat sink; and a non-adhesive thermal interface material applied to the second heat sink to mate the second heat sink to a second heat-generating component.
1. A heat sink assembly, comprising:
a first heat sink;
an adhesive thermal interface material applied to the first heat sink to mate the first heat sink to a first heat-generating component;
a second heat sink;
one or more support members connecting the first heat sink and the second heat sink, wherein the one or more support members apply a torque to the second heat sink in response to the first heat sink being mated to the first heat-generating component; and
a non-adhesive thermal interface material applied to the second heat sink to mate the second heat sink to a second heat-generating component, wherein the torque from the one or more supporting members mates the second heat sink to, and in contact with, the second heat-generating component.
2. The heat sink assembly of claim 1 , wherein the one or more support members comprise one or more wires or one or more rods.
3. The heat sink assembly of claim 1 , wherein the adhesive thermal interface material comprises a thermal glue or a thermal tape.
4. The heat sink assembly of claim 1 , wherein the non-adhesive thermal interface material comprises a thermal grease or a thermally conductive pad.
5. The heat sink assembly of claim 1 , wherein the first heat-generating component or the second heat-generating component comprise a processor.
6. The heat sink assembly of claim 1 , wherein the first heat-generating component or the second heat-generating component comprise a field programmable gate array.
7. An apparatus, comprising:
a first heat-generating component;
a second heat-generating component;
a heat sink assembly, comprising:
a first heat sink;
an adhesive thermal interface material applied to the first heat sink to mate the first heat sink to the first heat-generating component;
a second heat sink;
one or more support members connecting the first heat sink and the second heat sink, wherein the one or more support members apply a torque to the second heat sink in response to the first heat sink being mated to the first heat-generating component; and
a non-adhesive thermal interface material applied to the second heat sink to mate the second heat sink to a second heat-generating component, wherein the torque from the one or more supporting members mates the second heat sink to, and in contact with, the second heat-generating component.
8. The apparatus of claim 7 , wherein the one or more support members comprise one or more wires or one or more rods.
9. The apparatus of claim 7 , wherein the adhesive thermal interface material comprises a thermal glue or a thermal tape.
10. The apparatus of claim 7 , wherein the non-adhesive thermal interface material comprises a thermal grease or a thermally conductive pad.
11. The apparatus of claim 7 , wherein the first heat-generating component or the second heat-generating component comprise a processor or a field programmable gate array.