IP Library Granted Patent US 10,653,022
Granted Patent B2
US 10,653,022 · App. 16/508,225 · Granted May 12, 2020

Deployable hardened housing units

Inventor: David McDowell (Arlington, VA)
Assignee: CACI, Inc.-Federal
H05K5/0213F16F15/02H05K5/023H05K5/0204H05K5/0247H05K7/20145H05K7/20336H05K5/04H05K5/06
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,653,022
App. No.
16/508,225
Granted
May 12, 2020
Kind
B2
Abstract

The housing relates to apparatus, systems, and methods for robust, adaptable, and deployable computing devices and radio systems. An embodiment can be the housing for a C-sUAS that can be deployed to detect, identify, locate and defeat hostile sUASs and locate the sUAS operators and that can be ruggedized and efficiently deployed for use in various power- and space-constrained mobile platforms and at fixed locations. An embodiment can be housing for a C-sUAS that operates under severe environmental conditions.

Claims (28)

1. A chassis for housing electronic componentry, comprising:

a chassis frame having a top plate and a bottom plate, wherein the chassis frame has a plurality of protrusions that extend beyond the top plate and the bottom plate;

a first handle and a second handle, wherein the first handle is attached to two of the plurality of protrusions and the second handle is attached to two of the plurality of protrusions;

an interface panel and a back panel, wherein the back panel is located on the chassis frame opposite the interface panel; and

at least one vent located in the back panel.

2. The chassis according to claim 1 , further comprising shock mounts having bolt holes, wherein the shock mounts are a monolithic component of the chassis frame.

3. The chassis according to claim 1 , further comprising a plurality of heat pipes disposed inside the chassis frame.

4. The chassis according to claim 3 , wherein the heat pipes are in thermal contact with the top plate.

5. The chassis according to claim 3 , wherein the heat pipes are in thermal contact with the back panel.

6. The chassis according to claim 3 , further comprising at least one second vent and at least one fan.

7. A multi-chassis system for housing electronic componentry, comprising:

a first chassis frame having a first top plate and a first bottom plate, wherein the first chassis frame has a plurality of first protrusions that extend beyond the first top plate and the first bottom plate;

a first handle and a second handle, wherein the first handle is attached to two of the plurality of first protrusions and the second handle is attached to two of the plurality of first protrusions;

a first interface panel having a first port;

a first back panel, wherein the first back panel is located on the first chassis frame opposite the first interface panel;

a second chassis frame having a second top plate and a second bottom plate, wherein the second chassis frame has a plurality of second protrusions that extend beyond the second top plate and the second bottom plate;

a third handle and a fourth handle, wherein the third handle is attached to two of the plurality of second protrusions and the fourth handle is attached to two of the plurality of fourth protrusions;

a second interface panel having a second port;

a second back panel, wherein the second back panel is located on the second chassis frame opposite the second interface panel; and

wherein the first port and the second port are configured to be coupled via a wired communication link.

8. The multi-chassis system of claim 7 , wherein the wired communication link is configured to carry communication signals between the first interface panel and the second interface panel, and wherein the wired communication link is configured to carry electric power from the first interface panel to the second interface panel.

9. The multi-chassis system of claim 8 , wherein the second interface panel further comprises a first Wi-Fi antenna port and a second Wi-Fi antenna port.

10. The multi-chassis system of claim 9 , wherein the second interface panel further comprises a high band antenna port, a low band antenna port, and a GPS antenna port.

11. The chassis according to claim 1 , wherein the chassis frame further comprises internal mounts for mounting computer componentry within the chassis frame.

12. The chassis according to claim 11 , wherein the computer componentry includes a software-defined radio.

13. The chassis according to claim 11 , wherein the computer componentry includes counter-UAS.

14. The chassis according to claim 13 , further comprising an antenna, and wherein the computer componentry includes a radio componentry.

15. The chassis according to claim 11 , wherein the computer componentry includes heat pipes.

Assignments (3)
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Jan 22, 2025
From: CACI, INC. - FEDERAL
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 069987/0475 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Dec 13, 2021
From: CACI, INC. - FEDERAL
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 058741/0731 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 20, 2019
From: MCDOWELL, DAVID
To: CACI, INC. - FEDERAL
Reel/Frame 050104/0376 →
Continuity (2)
Provisional Application 62729336 · Sep 10, 2018
Related Publication 20200084900A1 · Mar 12, 2020