IP Library Granted Patent US 10,653,039
Granted Patent B2
US 10,653,039 · App. 14/898,686 · Granted May 12, 2020

Base layer architecture infrastructure device

Inventors: Kevin B. Leigh (Houston, TX); George D. Megason (Spring, TX)
Assignee: Hewlett Packard Enterprise Development LP
H05K7/20709H05K7/1492H05K7/20509
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,653,039
App. No.
14/898,686
Granted
May 12, 2020
Kind
B2
Abstract

A base layer architecture (BLA) infrastructure device comprises a power base layer (PBL) to supply power to a cartridge, a cold thermal base layer (cold TBL) to cool the cartridge, a hot thermal base layer (hot TBL) to remove heat from the cartridge, an optical base layer (OBL) to transmit an optical signal to the cartridge and a radio frequency base layer (RBL) to transmit a radio frequency signal to the cartridge. Each base layer comprises a rack interface to couple the base layer to a rack and a number of cartridge interfaces to couple the base layers to the cartridge. A BLA infrastructure system comprises a BLA infrastructure device comprising a number of base layers. The number of base layers are removably coupled to a rack and a system management device to manage the number of base layers.

Claims (42)

1. A base layer architecture (BLA) infrastructure device comprising:

a power base layer (PBL) to supply power to a cartridge;

a cold thermal base layer (cold TBL) to cool the cartridge;

a hot thermal base layer (hot TBL) to remove heat from the cartridge;

an optical base layer (OBL) to transmit an optical signal to the cartridge; and

a radio frequency base layer (RBL) to transmit a radio frequency signal to the cartridge;

in which the base layers each comprise:

a rack interface to couple the base layers to a rack; and

a number of cartridge interfaces to couple the base layers to the cartridge.

2. The infrastructure device of claim 1 , in which at least two of the PBL, cold TBL, hot TBL, OBL, and RBL are incorporated into an integrated base layer and are directly connectable to a same single cartridge.

3. The infrastructure device of claim 1 , further comprising a housing to house the base layers.

4. The infrastructure device of claim 1 , in which a number of the cold TBL and hot TBL utilize liquid or air.

5. The infrastructure device of claim 1 , in which the PBL, cold TBL, hot TBL, OBL, and RBL independently interface to the rack.

6. The infrastructure device of claim 1 , in which a number of rack interfaces are consolidated into an integrated rack interface.

7. The infrastructure device of claim 1 , in which a base layer is positioned on top of another base layer, to the side of another base layer, embedded in another base layer, or combinations thereof.

8. The infrastructure device of claim 1 , in which a base layer comprises a number of base layer segments.

9. The infrastructure device of claim 1 , wherein each of the base layers is to directly connect to a first cartridge on top of each of the base layers, the first cartridge comprising:

a processor;

a memory;

a power base layer (PBL) interface to removably connect to a PBL to receive power for the cartridge;

a cold thermal base layer (cold TBL) interface to removably connect to a cold TBL to cool the cartridge;

a hot thermal base layer (hot TBL) interface to removably connect to a hot TBL to remove heat from the cartridge; and at least one of:

an optical base layer (OBL) interface to removably connect to an OBL to receive an optical signal; and

a radio frequency base layer (RBL) interface to removably connect to and RBL to receive a radio frequency signal.

10. A base layer architecture (BLA) infrastructure system, comprising:

a base layer architecture (BLA) infrastructure device comprising a number of base layers to receive a number of cartridges;

a rack, in which the base layers are removably coupled to the rack; and

a system management device to manage the number of base layers;

wherein each of the base layers is to directly connect to a first cartridge on top of each of the base layers, the first cartridge comprising:

a processor;

a memory;

a power base layer (PBL) interface to removably connect to a PBL to receive power for the cartridge;

a cold thermal base layer (cold TBL) interface to removably connect to a cold TBL to cool the cartridge;

a hot thermal base layer (hot TBL) interface to removably connect to a hot TBL to remove heat from the cartridge; and at least one of:

an optical base layer (OBL) interface to removably connect to an OBL to receive an optical signal; and

a radio frequency base layer (RBL) interface to removably connect to and RBL to receive a radio frequency signal.

11. The BLA infrastructure system of claim 10 , in which the cartridges each comprise a liquid cooling device or an air cooling device.

12. The BLA infrastructure system of claim 10 , in which a number of base layers are connected to the rack via a single interface.

13. The BLA infrastructure system of claim 10 , in which the base layer architecture infrastructure device comprises a power base layer (PBL), a cold thermal base layer (cold TBL), a hot thermal base layer (hot TBL), an optical base layer (OBL), a radio frequency base layer (RBL), or combinations thereof.

14. The BLA infrastructure system of claim 10 , further comprising cartridge sockets defined in the BLA infrastructure device, in which the cartridge sockets receive the number of cartridges.

15. The BLA infrastructure system of claim 10 , wherein each of the base layers is to directly connect to a second cartridge on top of each of the base layers alongside the first cartridge.

16. The BLA infrastructure system of claim 10 , wherein each of the base layers extend alongside one another, parallel to one another.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 4, 2020
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
To: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Reel/Frame 051710/0205 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2015
From: LEIGH, KEVIN B.; MEGASON, GEORGE
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 037297/0204 →
Continuity (1)
Related Publication 20160150681A1 · May 26, 2016