Camera module-use liquid crystalline polyester resin composition and camera module-use molded product formed thereof
A liquid crystalline polyester resin composition for use in camera modules includes 20 to 45 parts by weight of spherical silica particles (B) having an average particle diameter of 15 μm or more and less than 30 μm in 100 parts by weight of a liquid crystalline polyester resin (A). A polyamide resin composition with which a camera module exhibiting excellent low dust forming property, toughness and impact strength can be obtained.
1. A liquid crystalline polyester resin composition for use in camera modules, the resin composition comprising 20 to 45 parts by weight of spherical silica particles (B) having an average particle diameter of 15 μm or more and less than 30 μm in 100 parts by weight of a liquid crystalline polyester resin (A), wherein the liquid crystalline polyester resin (A) is composed of structural units (I), (II), (III), (IV) and (V), and wherein the content of structural unit (I) is from 65 to 80% by mole relative to the total content of structural units (I), (II) and (III), and the content of structural unit (II) is from 55 to 85% by mole relative to the total content of structural units (II) and (III), and the content of structural unit (IV) is from 50 to 95% by mole relative to the total content of structural units (IV) and (V)
2. The liquid crystalline polyester resin composition according to claim 1 , further comprising a plate-like filler (C) having an average particle diameter of 10 to 50 μm and/or a fibrous filler (D) having an average fiber length of 30 to 300 μm.
3. The liquid crystalline polyester resin composition according to claim 1 , wherein the spherical silica particles (B) is a spherical silica particle having a sphericity of not less than 0.85.
4. A molded product for use in camera modules comprising the resin composition according to claim 1 .
5. A molded product for use in camera modules comprising the resin composition according to claim 2 .
6. A molded product for use in camera modules comprising the resin composition according to claim 3 .