IP Library › Granted Patent US 10,677,534
Granted Patent B1
US 10,677,534 · App. 16/779,146 · Granted Jun 9, 2020

Heat sink

Inventors: Yosuke Watanabe (Tokyo, JP); Tatsuro Miura (Tokyo, JP); Toshiaki Nakamura (Tokyo, JP); Kenya Kawabata (Tokyo, JP); Yoshikatsu Inagaki (Tokyo, JP)
Assignee: FURUKAWA ELECTRIC CO., LTD.
F28D15/04F28D15/0233F28D15/0275F28F9/22F28D2021/0029F28F2215/00H05K7/20336
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Quick Facts
Patent No.
US 10,677,534
App. No.
16/779,146
Granted
Jun 9, 2020
Kind
B1
Abstract

The present disclosure is to provide a heat sink capable of improving cooling efficiency of a heat radiation fin and exhibiting excellent cooling performance with respect to a cooling target regardless of an installation posture of the heat sink, and capable of being installed even in a narrow space. The heat sink includes: a heat transport member having a heat receiving portion thermally connected to a heat-generating element and including a first wick structure; a tube body connected to a heat insulating portion or a heat radiating portion of the heat transport member and including a second wick structure; and a heat radiation fin group which is thermally connected to the tube body and in which a plurality of heat radiation fins are arranged, in which, the heat transport member has an integral internal space that communicates from the heat receiving portion to a connection portion with the tube body and is sealed with a working fluid, the internal space of the heat transport member communicating with an internal space of the tube body, and the first wick structure includes a branch portion branched in a thickness direction of the heat transport member and multi-stage stem parts extending from the branch portion in a predetermined direction.

Claims (16)

1. A heat sink comprising:

a heat transport member having a heat receiving portion thermally connected to a heat-generating element and including a first wick structure;

a tube body connected to a heat insulating portion or a heat radiating portion of the heat transport member and including a second wick structure; and

a heat radiation fin group which is thermally connected to the tube body and in which a plurality of heat radiation fins are arranged, wherein

the heat transport member has an integral internal space that communicates from the heat receiving portion to a connection portion with the tube body and is sealed with a working fluid, the internal space of the heat transport member communicating with an internal space of the tube body, and

the first wick structure includes a branch portion branched in a direction orthogonal to a heat transport direction of the heat transport member and multi-stage stem parts extending from the branch portion in a predetermined direction.

2. The heat sink according to claim 1 , wherein a plurality of tube bodies are arranged in the direction orthogonal to the heat transport direction of the heat transport member.

3. The heat sink according to claim 1 , wherein the stem part has a part extending in a heat transport direction of the heat transport member.

4. The heat sink according to claim 1 , wherein the stem part is connected to the second wick structure via a connection member.

5. The heat sink according to claim 4 , wherein the connection member is a wick member having a capillary force.

6. The heat sink according to claim 4 , wherein the connection member is supported by a support member.

7. The heat sink according to claim 1 , wherein a heat-receiving-portion surface area increasing portion is provided on an inner surface of the heat receiving portion.

8. The heat sink according to claim 1 , wherein the tube body extends along an arrangement direction of the heat radiation fins.

9. The heat sink according to claim 1 , wherein an extending direction of the tube body is not parallel to a heat transport direction of the heat transport member.

10. The heat sink according to claim 1 , wherein the tube body extends in a plurality of direction from the heat transport member.

11. The heat sink according to claim 1 , wherein at least one surface of the heat transport member has a planar shape.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 3, 2020
From: WATANABE, YOSUKE; MIURA, TATSURO; NAKAMURA, TOSHIAKI; KAWABATA, KENYA; INAGAKI, YOSHIKATSU
To: FURUKAWA ELECTRIC CO., LTD.
Reel/Frame 051702/0489 →
Priority Claims (1)
JP 2018-226034 · Nov 30, 2018 · national
Continuity (1)
Continuation PCTJP2019045900 · Nov 25, 2019