IP Library Granted Patent US 10,688,705
Granted Patent B2
US 10,688,705 · App. 15/593,624 · Granted Jun 23, 2020

System and method for making a capped variegated structure

Inventor: S. Adam Ouziel (Blue Ash, OH)
Assignee: CPG International LLC
B29C48/07B29C48/002B29C48/0014B29C48/154B29C48/155B29C48/175B29C48/21B29C48/30B29C48/304B29C48/307B29C48/34B29C48/49B29C59/005B29C59/026B32B27/08B32B27/20B32B33/00B32B37/153E04F15/105B29B11/10B29C48/022B29K2023/065B29K2027/06B29L2007/002B29L2009/005B29L2031/10B32B27/304B32B27/32
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Quick Facts
Patent No.
US 10,688,705
App. No.
15/593,624
Granted
Jun 23, 2020
Kind
B2
Abstract

In a system and method for making a capped structure having a variegated cap layer a layer of cap materials is applied to a substrate and pin stripes are applied onto the cap layer through an extrusion die. After these materials exit the extrusion die they are passed through a single opening in a die plate to create a capped structure having a variegated appearance. This capped structure has a smooth surface that enables an embosser to create a consistent embossing pattern on the entire surface.

Claims (33)

1. A system for making a capped extruded structure with variegated appearance comprising:

a first extruder configured to extrude a substrate;

a second extruder for extruding a primary cap layer;

a third extruder for extruding a pin stripe cap layer;

a cap layer die having a face, a first opening sized and configured to receive the substrate, the first opening passing through the face, a primary cap layer opening adjacent the first opening and passing through the face, the primary cap layer opening sized and configured to apply a primary cap layer onto the substrate, and a plurality of pin stripe openings adjacent the primary cap layer opening, the plurality of pin stripe openings passing through the face, the plurality of pin stripe openings sized and positioned to apply pin stripe cap material onto the primary cap layer, the cap layer die aligned with the first extruder and configured to receive the substrate, the primary cap layer opening connected to the second extruder and the plurality of pin stripe openings connected to the third extruder; and

a die plate connected to the cap layer die and adjacent to the face of the cap layer die, the die plate having a single opening aligned with the first opening, primary cap layer opening and pin stripe openings in the cap layer die such that the substrate, primary cap layer and pin stripe layer must pass through the single opening after exiting the cap layer die, the substrate, primary cap layer and pin stripe layer to form a capped extruded structure having a cap layer with stripes in the cap layer.

2. The system of claim 1 also comprising an embosser positioned to receive and emboss at least one surface of the capped extruded structure.

3. The system of claim 1 wherein the plurality of pin stripe openings are rectangular having a height and a width and the pin stripe openings all have a same height.

4. The system of claim 3 wherein at least two of the plurality of pin stripe openings have different widths.

5. The system of claim 3 wherein all of the plurality of pin stripe openings have a same width.

6. The system of claim 1 wherein the second extruder is able to heat material for the primary cap layer to a temperature of from 290° F. to 500° F.

7. The system of claim 1 wherein the third extruder is able to heat material for the pin stripe cap layer to a temperature of from 290° F. to 500° F.

8. The system of claim 1 wherein the second extruder is capable of creating a flow rate of material passing out of the second extruder of from 75 lb./hr. to 150 lb./hr.

9. The system of claim 1 wherein the primary cap layer and the pin stripe layer are comprised of a same material.

10. The system of claim 9 wherein the same material is high density polyethylene or polyvinyl chloride.

11. The system on claim 1 wherein the substrate is a decking board.

12. The system of claim 1 wherein the capped extruded structure is one of a panel, a decking board and a siding board.

13. A method for making a capped extruded structure with variegated appearance comprising:

extruding a polymeric material to form a substrate,

simultaneously passing the substrate, a primary cap layer material and a pin stripe cap layer material through a cap layer die having:

a face,

a first opening sized and configured to receive the substrate, the first opening passing through the face,

a primary cap layer opening adjacent the first opening and passing through the face, the primary cap layer opening sized and configured to receive and receiving the primary cap layer material and applying that material as a primary cap layer onto the substrate, and

a plurality of pin stripe openings adjacent the primary cap layer opening, the plurality of pin stripe openings passing through the face, the plurality of pin stripe openings sized and configured to receive and receiving the pin stripe cap layer material and applying the pin stripe cap layer material onto the primary cap layer;

thereby forming an extruded structure in which the pin stripe cap layer material is in on the cap layer material and the cap layer material is on the substrate; and

passing the extruded structure containing the substrate, the primary cap layer material and the pin stripe cap layer material through a single opening in a die plate, the die plate connected to the cap layer die and adjacent to the face of the cap layer die, such that the single opening in the die plate is aligned with the first opening, primary cap layer opening and pin stripe openings in the cap layer die and, a capped extruded structure having a cap layer with stripes in the cap layer is formed.

14. The method of claim 13 wherein the primary cap layer material and the pin stripe cap layer material are at a temperature of from 290° F. to 500° F. when those materials pass through the cap layer die.

15. The method of claim 13 wherein the primary cap layer material passes through the cap layer die at a flow rate of from 75 lb./hr. to 150 lb./hr.

16. The method of claim 13 wherein the pin stripe cap layer material passes through the cap layer die at a flow rate of from 3 lb./hr. to 5 lb./hr.

17. The method of claim 13 wherein the primary cap layer material and the pin stripe cap layer material are comprised of a same material.

18. The method of claim 17 wherein the same material is high density polyethylene or polyvinyl chloride.

19. The system on claim 13 wherein the substrate is a decking board.

20. The system of claim 13 wherein the capped extruded structure is one of a panel, a decking board and a siding board.

Assignments (6)
RELEASE OF SECURITY INTEREST IN PATENTS AT R/F 069057/0231 Recorded Jul 1, 2025
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS AGENT
To: THE AZEK GROUP LLC
Reel/Frame 071773/0618 →
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT R/F 059820/0498 Recorded Sep 27, 2024
From: BANK OF AMERICA, N.A., AS AGENT
To: CPG INTERNATIONAL LLC
Reel/Frame 069067/0461 →
SECURITY INTEREST Recorded Sep 26, 2024
From: THE AZEK GROUP LLC
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 069057/0231 →
CHANGE OF NAME Recorded Aug 30, 2023
From: CPG INTERNATIONAL LLC
To: THE AZEK GROUP LLC
Reel/Frame 064783/0001 →
PATENT SECURITY AGREEMENT - TERM LOAN Recorded Apr 28, 2022
From: CPG INTERNATIONAL LLC
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 059820/0498 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 15, 2017
From: OUZIEL, S. ADAM
To: CPG INTERNATIONAL LLC
Reel/Frame 042375/0412 →
Continuity (1)
Related Publication 20180326639A1 · Nov 15, 2018