IP Library Granted Patent US 10,692,563
Granted Patent B2
US 10,692,563 · App. 15/695,866 · Granted Jun 23, 2020

Semiconductor memory device and memory system

Inventors: Shan Li (Kanagawa, JP); Keigo Hara (Kanagawa, JP)
Assignee: TOSHIBA MEMORY CORPORATION
G11C11/4085G11C7/04G11C8/08G11C11/4074G11C11/4091G11C11/4099G11C11/40626G11C11/56G11C11/5642G11C16/0483G11C16/26G11C7/14
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Quick Facts
Patent No.
US 10,692,563
App. No.
15/695,866
Granted
Jun 23, 2020
Kind
B2
Abstract

A semiconductor memory device includes a memory cell transistor, a word line coupled to the memory cell transistor, a temperature detection element configured to detect a temperature, and a control unit. The control unit is configured to determine, responsive to receiving a first command from a controller, a compensation value for a read voltage designated by the controller according to the detected temperature, and to lock updating of the compensation value.

Claims (15)

1. A semiconductor memory system comprising:

a memory cell transistor;

a word line coupled to the memory cell transistor;

a temperature detection element configured to detect a temperature; and

a control unit,

wherein the control unit is configured to determine, responsive to receiving a first command from a controller, a first temperature and a compensation value for a read voltage designated by the controller according to the first temperature, and to lock updating of the compensation value.

2. The semiconductor memory system of claim 1 , wherein the control unit is configured to determine a voltage to apply to the word line based on the read voltage and the compensation value.

3. The semiconductor memory system of claim 2 , wherein the control unit is configured to unlock the updating responsive to receiving a second command from the controller.

4. The semiconductor memory system of claim 3 , wherein the control unit is configured to determine a second temperature responsive to receiving the second command from the controller, and determine the compensation value of the voltage to apply to the word line after receiving the second command according to the second temperature.

5. The semiconductor memory system of claim 4 , further comprising the controller.

6. The semiconductor memory system of claim 5 , wherein the controller is configured to issue the first command to the semiconductor memory device responsive to an error correction of data read from the semiconductor memory device being unsuccessful.

7. The semiconductor memory system of claim 6 , wherein the controller is configured to read the data from the semiconductor memory device by using a plurality of read voltages having different magnitudes after issuing the first command and until issuing the second command.

8. The semiconductor memory system of claim 6 , wherein the controller is configured to execute the error correction based on the data read from the semiconductor memory device after issuing the second command.

9. The semiconductor memory system of claim 7 , wherein the data read from the semiconductor memory device corresponds to the plurality of read voltages, and the controller is configured to execute the error correction based on the data read from the semiconductor memory device corresponding to the plurality of read voltages.

10. The semiconductor memory system of claim 9 , wherein the error correction comprises a hard bit decoding process.

Assignments (4)
MERGER Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: K.K. PANGEA
Reel/Frame 055659/0471 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 055669/0001 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 055669/0401 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 3, 2017
From: LI, SHAN; HARA, KEIGO
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 043761/0943 →
Priority Claims (1)
JP 2017-049975 · Mar 15, 2017 · national
Continuity (1)
Related Publication 20180268891A1 · Sep 20, 2018