Photonic integrated circuit packages
A photonic integrated circuit package includes a first substrate including a first mirror and an optical coupling device spaced apart from each other, and a second substrate on an upper portion of the first substrate, the second substrate including an electro-optical converter and a second mirror, the electro-optical converter to output an optical signal to the first mirror, and the second mirror to reflect an optical signal reflected by and received from the first mirror to the optical coupling device.
1. A photonic integrated circuit package, comprising:
a first substrate including a first mirror and a grating coupler spaced apart from each other; and
a second substrate on an upper portion of the first substrate, the second substrate including a light source, a second mirror, and an optical fiber, the light source to output an optical signal to the first mirror, the second mirror to reflect the optical signal reflected by and received from the first mirror to the grating coupler, and the optical fiber to receive the optical signal from the grating coupler,
wherein the light source is in a recessed region of a lower surface of the second substrate.
2. The photonic integrated circuit package as claimed in claim 1 , wherein the first and second mirrors are on opposite surfaces of the first and second substrates, respectively.
3. The photonic integrated circuit package as claimed in claim 1 , wherein the first and second mirrors are concave mirrors in recessed surfaces of the first and second substrates, respectively.
4. The photonic integrated circuit package as claimed in claim 1 , wherein at least a portion of the first mirror and at least a portion of the second mirror vertically overlap each other.
5. The photonic integrated circuit package as claimed in claim 1 , wherein at least a portion of the second mirror and at least a portion of the grating coupler vertically overlap each other.
6. The photonic integrated circuit package as claimed in claim 1 , wherein the second substrate further includes a reflector adjacent to the light source, the reflector to reflect the optical signal received from the light source to the first mirror.
7. The photonic integrated circuit package as claimed in claim 1 , further comprising a third substrate between the first substrate and the second substrate, the third substrate including a transparent material.
8. The photonic integrated circuit package as claimed in claim 7 , wherein the third substrate has a cavity for accommodating at least a portion of the light source.
9. The photonic integrated circuit package as claimed in claim 7 , wherein the third substrate is in contact with the first and second substrates.
10. The photonic integrated circuit package as claimed in claim 1 , wherein the first substrate further includes:
a base substrate;
a first insulating layer on the base substrate;
an optical core layer on the first insulating layer, the grating coupler being in the optical core layer; and
a second insulating layer stacked on the optical core layer, the first mirror being positioned in a recessed portion of the second insulating layer.
11. The photonic integrated circuit package as claimed in claim 10 , wherein the first mirror is positioned in a recessed portion of the second insulating layer and the first insulating layer.
12. The photonic integrated circuit package as claimed in claim 10 , wherein an end portion of the optical core layer is spaced apart from the first mirror.
13. The photonic integrated circuit package as claimed in claim 1 , wherein the second substrate includes a third mirror to reflect the optical signal received from the grating coupler to the first substrate, and the first substrate further includes a fourth mirror to reflect the optical signal reflected by the third mirror toward the optical fiber.
14. A photonic integrated circuit package, comprising:
a first substrate including a first mirror and a grating coupler; and
a second substrate on an upper portion of the first substrate, the second substrate including a light source, a second mirror, and an optical fiber,
wherein the first and second mirrors are on opposite surfaces of the first and second substrates, respectively, and
wherein the light source is in a recessed region of a lower surface of the second substrate.
15. The photonic integrated circuit package as claimed in claim 14 , wherein an optical signal output from the light source travels to the first mirror, is reflected by the first mirror to travel to the second mirror, and is reflected by the second mirror to be transmitted to the grating coupler.
16. The photonic integrated circuit package as claimed in claim 14 , wherein the first and second mirrors are in recessed portions of an upper surface of the first substrate and the lower surface of the second substrate, respectively.
17. A photonic integrated circuit package, comprising:
a photonic integrated circuit substrate including a base substrate, a first insulating layer, an optical core layer with a grating coupler, and a second insulating layer, stacked in sequence;
a first concave mirror in a recessed portion of an upper surface of the second insulating layer; and
an optical bench on the photonic integrated circuit substrate, the optical bench including a light source in a recessed region of a lower surface of the optical bench, an optical fiber, and a second concave mirror in a recessed portion of the lower surface of the optical bench.
18. The photonic integrated circuit package as claimed in claim 17 , wherein the optical fiber is directly on the optical bench.
19. The photonic integrated circuit package as claimed in claim 18 , wherein the optical fiber and the light source are in recesses on a same surface of the optical bench.