IP Library › Granted Patent US 1,070,603
Granted Patent S1
US 1,070,603 · App. 35/520,388 · Granted Apr 15, 2025

Blister pack packaging

Inventor: Daehyun Kim (Hwaseong-si, KR)
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Quick Facts
Patent No.
US 1,070,603
App. No.
35/520,388
Granted
Apr 15, 2025
Kind
S1
Claims (1)

The ornamental design for a blister pack packaging as shown and described.

Priority Claims (3)
KR 30-2023-0016353 · Apr 27, 2023 · national
KR 30-2023-0016387 · Apr 27, 2023 · national
KR 30-2023-0016388 · Apr 27, 2023 · national
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