Radiative cooling structures and systems
Polymer-based selective radiative cooling structures are provided which include a selectively emissive layer of a polymer or a polymer matrix composite material. Exemplary selective radiative cooling structures are in the form of a sheet, film or coating. Also provided are methods for removing heat from a body by selective thermal radiation using polymer-based selective radiative cooling structures.
1. A method for removing heat from a body by selective thermal radiation, the method comprising the steps of:
a. placing a selective radiative cooling structure in thermal communication with a surface of the body, the selective radiative cooling structure comprising:
a selectively emissive layer comprising a polymer and a plurality of dielectric particles dispersed in the polymer, the volume percentage of the dielectric particles in the selectively emissive layer selected from the range of 1% to 25% and the dielectric particles characterized by an average size range from 3 μm to 30 μm; and
a reflective layer that is a silver film characterized by an average thickness from 20 nanometers to 300 nanometers, wherein the selectively emissive layer is provided on the reflective layer;
wherein the selectively emissive layer is in thermal communication with the body, the selective radiative cooling structure is characterized by an average emissivity ranging from 0.5 to 1.0 over the wavelength range 7 μm to 14 μm, and the selectively emissive layer has a transmissivity of 0.7 to 1 over a solar wavelength range of 0.3 μm to 3 μm;
wherein the polymer is selected from the group consisting of polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), a 4-methyl-1-pentene polymer, a 4-methyl-1-pentene copolymer, and polyvinyl fluoride; and
wherein the dielectric particles comprise silicon dioxide (SiO 2 );
b. transferring heat from the body to the selective radiative cooling structure; and
c. radiating heat from the selectively emissive layer of the selective radiative cooling structure.
2. The method of 1 , wherein the body is a solar panel, the roof or window of an automobile, the roof or window of a building, or a cold storage structure for energy, food, oil or other commodity.
3. The method of claim 1 , wherein the body is a passive thermosiphon or an active channel array and wherein a heat transfer fluid circulates inside the body.
4. The method of claim 1 , wherein the selective radiative cooling structure is characterized by an average emissivity ranging from 0.6 to 1.0 over the wavelength range 7 μm to 13 μm.
5. The method of claim 1 , wherein the selective radiative cooling structure is characterized by an average emissivity ranging from 0.5 to 1.0 over the wavelength range 7 μm to 13 μm.
6. The method of claim 1 , wherein the radiative cooling structure is in the form of a sheet.
7. The method of claim 1 , wherein the selective radiative cooling structure further comprises a protective film that is solar transparent and weather-resistant.
8. The method of claim 1 , wherein a barrier layer or a protective layer is provided between the selectively emissive layer and the reflective layer.
9. The method of claim 1 , wherein the reflective layer is attached by adhesive to the body.
10. The method of claim 1 , wherein a thermally conductive layer is provided between the reflective layer and the surface of the body.
11. The method of claim 1 , wherein the selective radiative cooling structure provides a radiative heat flux from 50 W/m 2 to 150 W/m 2 at a working temperature in the range of −100° C. to 500° C.
12. The method of claim 1 , wherein the selective radiative cooling structure provides a radiative heat flux from 50 W/m 2 to 150 W/m 2 during the daytime, nighttime or both.
13. The method of claim 1 , wherein the selective radiative cooling structure is characterized by a solar reflectivity ranging from 0.8 to 1 over the wavelength range 0.3 μm to 3 μm.
14. The method of claim 1 , wherein the dielectric particles are characterized by an average size ranging from 3 μm to 15 μm.
15. The method of claim 1 , wherein the dielectric particles are characterized by an average size ranging from 4 μm to 10 μm.
16. The method of claim 1 , wherein the particles are characterized by an average effective diameter selected from the range of 3 μm to 30 μm.
17. The method of claim 1 , wherein the volume percentage of the dielectric particles in the selectively emissive layer is selected from the range of 5% to 15%.
18. The method of claim 1 , wherein the polymer and dielectric particles are mixed as a uniform blend.
19. The method of claim 1 , wherein the concentration variation of dielectric particles in the polymer is less than 0.4%.
20. The method of claim 1 , wherein the selectively emissive layer is characterized by an average thickness from 10 μm to 3 mm.
21. The method of claim 1 , wherein the selectively emissive layer is characterized by an average thickness from 5 μm to 500 μm.
22. The method of claim 1 , wherein the polymer is selected from the group consisting of polyethylene terephthalate (PET), a 4-methyl-1-pentene polymer, and a 4-methyl-1-pentene copolymer.
23. The method of claim 1 , wherein the polymer is selected from the group consisting of a 4-methyl-1-pentene polymer, and a 4-methyl-1-pentene copolymer.
24. The method of claim 1 , wherein the polymer is a 4-methyl-1-pentene copolymer.
25. The method of claim 1 , wherein the polymer is a copolymer of poly(4-methyl-1 pentene) with α-olefins selected from the group consisting of 1-pentene, 1-hexene and 1-octene.
26. The method of claim 1 , wherein the polymer is polyvinyl fluoride.
27. The method of claim 1 , wherein the dielectric particles are silica.