Optimization program and mounting work system
With multiple-board substrate defined as a circuit substrate provided with multiple boards of circuit pattern on which multiple electronic components are mounted, when performing mounting work of multiple electronic components on a multiple-board substrate using three mounters lined up in a row, electronic component mounting work procedures are set such that mounting work of electronic components for each of multiple circuit patterns is performed by all three mounters. Work procedures for mounting work of electronic components surrounded by the dashed lines are set to a first mounter, work procedures for mounting work of electronic components surrounded by the single-dashed solid lines are set to a second mounter, and work procedures for mounting work of electronic components surrounded by the double-dashed solid lines are set to a third mounter.
1. A method for mounting electronic components in a mounting work system provided with multiple mounting work machines lined up in a row with multiple-board printed panels being conveyed in the mounting work system from an upstream side of the multiple mounting work machines to a downstream side and each of the multiple-board printed panels being defined as a panel with multiple boards on one circuit substrate, in which multiple electronic circuit board patterns, on which multiple of the electronic components are to be mounted, are provided, the method comprising:
setting a mounting work procedure of mounting the multiple electronic components to each of the electronic circuit board patterns for each of the multiple mounting work machines such that work of mounting the multiple electronic components onto each of the multiple electronic circuit board patterns is performed by all of the multiple mounting work machines including that:
a first mounting work machine of the multiple mounting work machines mounts a first subset of the multiple electronic components onto corresponding mounting positions of the first subset of the multiple electronic components on each of the multiple electronic circuit board patterns of the multiple-board printed panels,
a second mounting work machine of the multiple mounting work machines mounts a second subset of the multiple electronic components onto corresponding mounting positions of the second subset of the multiple electronic components on each of the multiple electronic circuit board patterns of the multiple-board printed panels, and
a first total time for work of the first mounting work machine mounting the first subset of the electronic components to each of the multiple electronic circuit board patterns is equalized with a second total time for work of the second mounting work machine mounting the second subset of the electronic components to each of the multiple electronic circuit board patterns;
storing the work mounting procedure to a memory; and
controlling the multiple mounting work machines to mount the electronic components on the multiple-board printed panels according to the mounting work procedure.
2. The method according to claim 1 , further comprising:
setting the mounting work procedure according to a quantity of the electronic components per unit of time to be mounted to each of the electronic circuit board patterns by each of the multiple mounting work machines.
3. A mounting work system comprising:
multiple mounting work machines lined up in a row: and
a control device configured to control operation of the multiple mounting work machines,
wherein multiple-board printed panels are conveyed in the mounting work system from an upstream side of the multiple mounting work machines to a. downstream side, each of the multiple-board printed panels being defined as a panel with multiple boards on one circuit substrate, in which multiple electronic circuit board patterns, on which multiple of electronic components are to be mounted, are provided, and
wherein the control device is configured to control the operation of the multiple mounting work machines according to a mounting work procedure of mounting the multiple electronic components to each of the electronic circuit board patterns for each of the multiple mounting work machines such that work of mounting the multiple electronic components onto each of the multiple electronic circuit board patterns is performed by all of the multiple mounting work machines including that:
a first mounting work machine of the multiple mounting work machines mounts a first subset of the multiple electronic components onto corresponding mounting positions of the first subset of the multiple electronic components on each of the multiple electronic circuit board patterns of the multiple-board printed panels,
a second mounting work machine of the multiple mounting work machines mounts a second subset of the multiple electronic components onto corresponding mounting positions of the second subset of the multiple electronic components on each of the multiple electronic circuit board patterns of the multiple-board printed panels, and
a first total time for work of the first mounting work machine mounting the first subset of the electronic components to each of the multiple electronic circuit board patterns is equalized with a second total time for work of the second mounting work machine mounting the second subset of the electronic components to each of the multiple electronic circuit board patterns.
4. The work mounting system according to claim 3 , wherein the work mounting procedure is set according to a quantity of electronic components per unit of time to be mounted to each of the electronic circuit board patterns by each of the multiple mounting work machines.