Method for forming an electrical interconnect

1. A method, comprising:

forming an interconnect in a metal member, the interconnect comprising multiple repeating, nested V-shaped structures forming a continuous central portion, wherein a vertex, within a portion of the continuous central portion of each of the multiple repeating, nested V-shaped structures adjoins a next vertex of, and is nested within, a next V-shaped structure of the multiple repeating, nested V-shaped structures;

separating the interconnect from the metal member

coupling the interconnect to a photovoltaic cell and a terminal; and

encasing a portion of the interconnect in filler material, wherein the interconnect is configured to route electric current from the photovoltaic cell to the terminal.

2. The method of claim 1 , wherein the continuous central portion is coplanar with longitudinal axes of legs of at least one of the multiple repeating, nested V-shaped structures.

3. The method of claim 1 , wherein the interconnect includes:

a first set of connector pads;

a second set of connector pads;

a first plurality of legs, wherein each of the first plurality of legs extends at a first angle from the continuous central portion in a single direction without bending and is connected to a different connector pad of the first set of connector pads, and wherein a first gap is defined between at least one leg and at least one other leg of the first plurality of legs; and

a second plurality of legs, wherein each of the second plurality of legs extends at a second angle from the continuous central portion in the single direction without bending and is connected to a different second connector pad of the second set of connector pads, and wherein a second gap is defined between at least one leg and at least one other leg of the second plurality of legs.

4. The method of claim 3 , wherein the first gap and the second gap enable a movement of the first set of connector pads relative to the second set of connector pads, wherein the movement enables at least a two percent increase in a distance between the first set of connector pads and the second set of connector pads, and wherein the movement includes a first movement of the first set of connector pads in an opposite direction to a second movement of the second set of connector pads.

5. The method of claim 1 , wherein the terminal comprises a metalized portion of a substrate.

6. The method of claim 1 , wherein the interconnect includes a first set of connector pads and a second set of connector pads.

7. The method of claim 6 , wherein the interconnect further includes a first plurality of legs, and wherein each of the first plurality of legs extends at a first angle from the continuous central portion and is connected to a different connector pad of the first set of connector pads.

8. The method of claim 7 , wherein the interconnect further includes a second plurality of legs, and wherein each of the second plurality of legs extends at a second angle from the continuous central portion and is connected to a different second connector pad of the second set of connector pads.

9. The method of claim 8 , wherein each leg of the first plurality of legs and the second plurality of legs of the interconnect extends from the continuous central portion in a single direction without bending.

10. The method of claim 8 , wherein a first gap is defined between at least one leg and at least one other leg of the first plurality of legs.

11. The method of claim 10 , wherein a second gap is defined between at least one leg and at least one other leg of the second plurality of legs.

12. The method of claim 11 , wherein the first gap and the second gap enable a movement of the first set of connector pads relative to the second set of connector pads.

13. The method of claim 12 , wherein the movement enables at least a two percent increase in a distance between the first set of connector pads and the second set of connector pads.

14. The method of claim 12 , wherein the movement includes a first movement of the first set of connector pads in an opposite direction to a second movement of the second set of connector pads.

15. A method, comprising:

forming, in a metal member, an interconnect, the interconnect comprising:

multiple repeating, nested V-shaped structures forming a continuous central portion, wherein a vertex, within a portion of the continuous central portion of each of the multiple repeating, nested V-shaped structures adjoins a next vertex of, and is nested within, a next V-shaped structure of the multiple repeating, nested V-shaped structures;

a first set of connector pads;

a second set of connector pads;

a first plurality of legs, wherein each of the first plurality of legs extends at a first angle from the continuous central portion in a single direction without bending and is connected to a different connector pad of the first set of connector pads, and wherein a first gap is defined between at least one leg and at least one other leg of the first plurality of legs; and

a second plurality of legs, wherein each of the second plurality of legs extends at a second angle from the continuous central portion in the single direction without bending and is connected to a different second connector pad of the second set of connector pads, and wherein a second gap is defined between at least one leg and at least one other leg of the second plurality of legs; and

separating the interconnect from the metal member.

16. The method of claim 15 , wherein the interconnect is fanned by etching the metal member or stamping the metal member.

17. The method of claim 15 , wherein the interconnect is formed by a continuous cutting process, and wherein the interconnect is free of enclosed voids.

18. The method of claim 15 , further comprising coupling the interconnect to a photovoltaic cell and a terminal.

19. The method of claim 15 , further comprising encasing a portion of the interconnect in filler material.

20. The method of claim 18 , wherein the interconnect is configured to route electric current from the photovoltaic cell to the terminal.