Standalone interface for stacked silicon interconnect (SSI) technology integration

1. An integrated circuit (IC) package comprising:

a package substrate;

at least one interposer disposed above the package substrate and comprising a plurality of interconnection lines;

a programmable IC die disposed above the interposer;

a fixed feature die disposed above the interposer; and

an interface die disposed above the interposer and configured to couple the programmable IC die to the fixed feature die using a first set of interconnection lines routed through the interposer between the programmable IC die and the interface die and a second set of interconnection lines routed through the interposer between the interface die and the fixed feature die, wherein the programmable IC die and the interface die share a same semiconductor substrate in the IC package, layers of the programmable IC die and layers of the interface die both being disposed on the semiconductor substrate.

2. The package of claim 1 , wherein the programmable IC die and the interface die are separated on the semiconductor substrate by a scribe line.

3. The package of claim 1 , further comprising a plurality of microbumps electrically connecting the interconnection lines routed through the interposer with circuits in the programmable IC die, the interface die, and the fixed feature die.

4. The package of claim 3 , wherein the interface die is compatible with a first pattern of the microbumps and the first set of interconnection lines for the programmable IC die and is compatible with a second pattern of the microbumps and the second set of interconnection lines for the fixed feature die.

5. The package of claim 1 , wherein the programmable IC die comprises a field programmable gate array (FPGA) die, wherein the fixed feature die comprises a high bandwidth memory (HBM) die, and wherein the interface die comprises an HBM buffer die.

6. The package of claim 5 , wherein the second set of interconnection lines is in accordance with the HBM JEDEC standard.

7. The package of claim 1 , wherein the fixed feature die comprises an application-specific integrated circuit (ASIC).

8. The package of claim 1 , wherein there are no electrical connections between the programmable IC die and the interface die, other than through the interconnection lines routed through the interposer.

9. The package of claim 1 , wherein the programmable IC and the interface continued to share the semiconductor substrate after dicing of a wafer of which the semiconductor substrate was a portion.

10. The package of claim 1 , wherein the semiconductor substrate, the programmable IC die, and the interface die each compose at least a portion of a monolith in the IC package.

11. An integrated circuit (IC) package comprising:

a package substrate;

at least one interposer disposed above the package substrate and comprising a plurality of interconnection lines;

a fixed feature die disposed above the interposer; and

a monolith disposed above the interposer, the monolith comprising:

a semiconductor substrate;

a programmable IC die disposed on the semiconductor substrate; and

an interface die disposed on and sharing the semiconductor substrate with the programmable IC die, the interface die being configured to couple the programmable IC die to the fixed feature die via a first set of interconnection lines routed through the interposer between the programmable IC die and the interface die and a second set of interconnection lines routed through the interposer between the interface die and the fixed feature die.

12. The IC package of claim 11 , wherein the programmable IC die and the interface die are separated in the monolith by a scribe line.

13. The IC package of claim 11 , wherein there are no electrical connections in the monolith between the programmable IC die and the interface die, other than through the first set of interconnection lines routed through the interposer.

14. The IC package of claim 11 , wherein the programmable IC die comprises a field programmable gate array (FPGA) die, wherein the fixed feature die comprises a high bandwidth memory (HBM) die, and wherein the interface die comprises an HBM buffer die.

15. An integrated circuit (IC) package comprising:

a package substrate;

an interposer disposed on and attached to the package substrate, the interposer comprising first interconnect lines and second interconnect lines;

a fixed feature die attached to the interposer by first connectors; and

a monolith attached to the interposer by second connectors, the monolith being disposed on a same side of the interposer as the fixed feature die, the monolith comprising:

a semiconductor substrate;

a programmable circuit disposed on the semiconductor substrate; and

an interface circuit disposed on the semiconductor substrate, a scribe line being disposed on the semiconductor substrate between the programmable circuit and the interface circuit, no electrical connections between the programmable circuit and the interface circuit being across the scribe line and in the monolith, the programmable circuit being electrically connected to the interface circuit through a first set of the second connectors and the second interconnect lines of the interposer, the interface circuit being electrically connected to the fixed feature die through at a second set of the second connectors, at least some of the first connectors, and the first interconnect lines of the interposer.