Microneedle-beauty device using sound wave vibration
A microneedle skin care device includes a housing having a predetermined space formed therein; a sound wave module disposed inside the housing to provide sound wave vibration; a microneedle assembly configured to receive vibration of the sound wave module and vibrate in front and rear directions, the microneedle assembly having microneedles disposed at a front end; and a needle tip coupled to the front end of the microneedle assembly and having through-holes through which the microneedles selectively pass through formed corresponding to the microneedles.
1. A microneedle skin care device using sound wave vibration, the microneedle skin care device comprising:
a housing having a predetermined space formed therein;
a sound wave module disposed inside the housing to provide sound wave vibration;
a microneedle assembly configured to receive the vibration of the sound wave module and vibrate in front and rear directions, the microneedle assembly having microneedles disposed at a front end; and
a needle tip coupled to the front end of the microneedle assembly and having through-holes formed corresponding to the microneedles through which the microneedles selectively pass through,
wherein the sound wave module includes:
a lower case having an open upper portion and an accommodating space formed therein;
a side ring having an open upper portion and an open lower portion and installed in the accommodating space of the lower case;
a magnetic body fixed and installed at a lower surface of the lower case to generate a magnetic force;
a bobbin installed inside the lower case at an upper portion of the magnetic body;
a voice coil installed at an outer peripheral surface of the bobbin to interact with the magnetic body;
an upper case installed at an upper surface of the bobbin and coupled to an upper surface at an edge of the lower case;
a cone damper configured to generate vibration in a vertical direction by interactions between the magnetic body and the voice coil; and
a guide disposed at an upper surface of the cone damper and being coupled to the microneedle assembly to guide vibration of the microneedle assembly,
wherein the microneedle assembly includes:
a disc-shaped base plate having a predetermined thickness;
the microneedles vertically coupled to a front surface of the base plate;
a coupling portion protruding from a rear surface of the base plate and coupled to the sound wave module;
a guide protrusion protruding from an outer peripheral surface of the coupling portion and configured to guide vibration by being inserted into an insertion groove formed in the guide of the sound wave module; and
a guide ring protruding from an outer peripheral surface of the base plate,
wherein the needle tip includes:
a disc-shaped tip plate having the through-holes formed at positions corresponding to those of the microneedles and formed in a predetermined size; and
a fixing plate protruding from a rear surface of the tip plate, and
further includes a coupling housing formed in a hollow shape, having the needle tip coupled to a front end and the microneedle assembly coupled to an opposing end, and selectively coupled to a needle coupling portion formed at a front end of the housing,
wherein, after use of the microneedles, the coupling housing is detached to entirely replace the needle tip and the microneedle assembly,
wherein:
coupling recessed grooves of corresponding shapes are formed at an outer surface of the coupling housing and an inner surface of the needle coupling portion of the housing so that the coupling housing is fixedly coupled to the housing; and
when the coupling housing is coupled by the coupling recessed grooves, the microneedle assembly and the coupling housing are coupled to each other to allow the guide protrusion of the microneedle assembly to be inserted into the insertion groove of the sound wave module.
2. A microneedle skin care device using sound wave vibration, the microneedle skin care device comprising:
a housing having a predetermined space formed therein;
a sound wave module disposed inside the housing to provide sound wave vibration;
a microneedle assembly configured to receive the vibration of the sound wave module and vibrate in front and rear directions, the microneedle assembly having microneedles disposed at a front end; and
a needle tip coupled to the front end of the microneedle assembly and having through-holes formed corresponding to the microneedles through which the microneedles selectively pass through,
wherein the sound wave module includes:
a lower case having an open upper portion and an accommodating space formed therein;
a side ring having an open upper portion and an open lower portion and installed in the accommodating space of the lower case;
a magnetic body fixed and installed at a lower surface of the lower case to generate a magnetic force;
a bobbin installed inside the lower case at an upper portion of the magnetic body;
a voice coil installed at an outer peripheral surface of the bobbin to interact with the magnetic body;
an upper case installed at an upper surface of the bobbin and coupled to an upper surface at an edge of the lower case;
a cone damper configured to generate vibration in a vertical direction by interactions between the magnetic body and the voice coil; and
a guide disposed at an upper surface of the cone damper and being coupled to the microneedle assembly to guide vibration of the microneedle assembly,
wherein the microneedle assembly includes:
a disc-shaped base plate having a predetermined thickness;
the microneedles vertically coupled to a front surface of the base plate;
a coupling portion protruding from a rear surface of the base plate and coupled to the sound wave module;
a guide protrusion protruding from an outer peripheral surface of the coupling portion and configured to guide vibration by being inserted into an insertion groove formed in the guide of the sound wave module; and
a guide ring protruding from an outer peripheral surface of the base plate,
wherein the needle tip includes:
a disc-shaped tip plate having the through-holes formed at positions corresponding to those of the microneedles and formed in a predetermined size; and
a fixing plate protruding from a rear surface of the tip plate, and
further includes: a coupling housing formed in a hollow shape, having the needle tip coupled to a front end and the microneedle assembly coupled to an opposing end, and selectively coupled to a needle coupling portion formed at a front end of the housing,
an ampoule capsule disposed between the coupling housing and the microneedle assembly and filled with an ampoule to be applied to skin; and
an ampoule cover fixed to an inside of the coupling housing and configured to fix the ampoule capsule to the inside of the coupling housing.