Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device

1. An actinic ray-sensitive or radiation-sensitive resin composition comprising a photoacid generator represented by General Formula (1-A),

in General Formula (1-A), R 1 and R 6 each independently represent an alkyl group, an alkylthio group, a halogen atom, or a cyano group;

R 2 to R 5 and R 7 to R 10 each independently represent a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, an acyl group, an alkyloxycarbonyl group, a cycloalkyloxycarbonyl group, an alkylthio group, an aryloxy group, an arylthio group, an aryloxycarbonyl group, an alkylaminocarbonyl group, a cycloalkylaminocarbonyl group, an arylaminocarbonyl group, a cyano group, a halogen atom, an amino group, a nitro group, a carboxyl group, or a hydroxyl group;

X 2 represents an aromatic group or an alicyclic group, R 5 and X 2 may be bonded to each other directly or via a linking group to form a ring, and

Y − represents an anion represented by General Formula (2),

in General Formula (2), Xf's each independently represent a fluorine atom or an alkyl group substituted with at least one fluorine atom;

R 7 and R 8 each independently represent a hydrogen atom, a fluorine atom, an alkyl group, or an alkyl group substituted with at least one fluorine atom;

L represents a divalent linking group;

A represents a cyclic organic group;

x represents an integer of 1 to 20, y represents an integer of 0 to 10, z represents an integer of 0 to 10, in a case where y is 2 or more, a plurality of R 7 's and R 8 's may be the same as or different from each other, respectively, and in a case where z is 2 or more, a plurality of L's may be the same as or different from each other.

2. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 ,

wherein the photoacid generator represented by General Formula (1-A) is a photoacid generator represented by General Formula (1-B),

in General Formula (1-B), R 1 , R 6 , and R 11 each independently represent an alkyl group, an alkylthio group, a halogen atom, or a cyano group;

R 2 to R 5 , R 7 to R 10 , and R 12 to R 15 each independently represent a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, an acyl group, an alkyloxycarbonyl group, a cycloalkyloxycarbonyl group, an alkylthio group, an aryloxy group, an arylthio group, an aryloxycarbonyl group, an alkylaminocarbonyl group, a cycloalkylaminocarbonyl group, an arylaminocarbonyl group, a cyano group, a halogen atom, an amino group, a nitro group, a carboxyl group, or a hydroxyl group, R 5 and R 15 may be bonded to each other directly or via a linking group to form a ring, and

Y − represents the anion represented by General Formula (2).

3. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 2 ,

wherein R 1 represents an alkylthio group, a halogen atom, or a cyano group.

4. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 2 , further comprising a resin including a repeating unit having a group that decomposes by the action of an acid to generate an alkali-soluble group.

5. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 ,

wherein R 1 represents an alkylthio group, a halogen atom, or a cyano group.

6. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 5 , further comprising a resin including a repeating unit having a group that decomposes by the action of an acid to generate an alkali-soluble group.

7. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 , further comprising a resin including a repeating unit having a group that decomposes by the action of an acid to generate an alkali-soluble group.

8. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 , further comprising an acid diffusion control agent.

9. A resist film formed using the actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 .

10. A pattern forming method comprising:

a step of exposing the resist film according to claim 9 ; and

a step of developing the exposed resist film.

11. The pattern forming method according to claim 10 ,

wherein the exposure is liquid immersion exposure.

12. A method for manufacturing an electronic device, comprising the pattern forming method according to claim 10 .

13. An actinic ray-sensitive or radiation-sensitive resin composition comprising a photoacid generator represented by General Formula (1-B),

in General Formula (1-B), R 1 , R 6 , and R 11 each independently represent an alkyl group, an alkylthio group, or a cyano group;

R 2 to R 5 , R 7 to R 10 , and R 12 to R 15 each independently represent a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, an acyl group, an alkyloxycarbonyl group, a cycloalkyloxycarbonyl group, an alkylthio group, an aryloxy group, an arylthio group, an aryloxycarbonyl group, an alkylaminocarbonyl group, a cycloalkylaminocarbonyl group, an arylaminocarbonyl group, a cyano group, a halogen atom, an amino group, a nitro group, a carboxyl group, or a hydroxyl group, R 5 and R 15 may be bonded to each other directly or via a linking group to form a ring, and

Y − represents a non-nucleophilic anion.

14. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 13 , further comprising a resin including a repeating unit having a group that decomposes by the action of an acid to generate an alkali-soluble group.

15. A resist film formed using the actinic ray-sensitive or radiation-sensitive resin composition according to claim 13 .

16. A pattern forming method comprising:

a step of exposing the resist film according to claim 15 ; and

a step of developing the exposed resist film.

17. An actinic ray-sensitive or radiation-sensitive resin composition comprising a resin having a repeating unit represented by General Formula (1-C),

in General Formula (1-C), R 20 to R 22 each independently represents a hydrogen atom or a monovalent organic group, L A represents a single bond or a divalent linking group, and Z represents a group represented by General Formula (1-D),

in General Formula (1-D), R 1A , R 6A , and R 11A each independently represents a hydrogen atom, an alkyl group, an alkoxy group, an alkylthio group, a halogen atom, or a cyano group, at least one of R 1A , R 6A , and R 11A represents a group other than a hydrogen atom, * represents a bonding position to L a , and R 7A to R 10A and R 12A to R 15A each independently represents a hydrogen atom or a monovalent organic group, and Y − represents a non-nucleophilic anion.

18. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 17 , further comprising a resin including a repeating unit having a group that decomposes by the action of an acid to generate an alkali-soluble group.

19. A resist film formed using the actinic ray-sensitive or radiation-sensitive resin composition according to claim 17 .

20. A pattern forming method comprising:

a step of exposing the resist film according to claim 19 ; and

a step of developing the exposed resist film.