Apparatus for surface mount connectors

1. An apparatus to reduce or prevent deformation of a surface mount connector during soldering of the surface mount connector to a substrate in a reflow oven, the surface mount connector including a connector housing having a top surface, a first housing end portion having defined therein a first portion of a socket, and a second housing end portion having defined therein a second portion of a socket, the apparatus comprising:

an elongated body having a planar surface to couple with and contact the top surface of the surface mount connector along an entire length of the planar surface, wherein the elongated body includes:

a first body end portion forming a first tab insertable into the first portion of the socket; and

a second body end portion forming a second tab insertable into the second portion of the socket; wherein the entire length of the planar surface extends from a beginning of the first body end portion to a beginning of the second body end portion.

2. The apparatus of claim 1 , wherein the elongated body is formed from a plurality of slabs in a stacked arrangement.

3. The apparatus of claim 2 , wherein the plurality of slabs in a stacked arrangement are configured to be disposed on the top surface of the connector housing to provide a floating weight.

4. The apparatus of claim 1 , wherein the first tab and the second tab are each coplanar with the elongated body.

5. The apparatus of claim 2 , wherein each slab of the the plurality of slabs includes a plurality of slots.

6. The apparatus of claim 5 , wherein a quantity of slabs included in the plurality of slabs is a function of a rigidity to reduce or prevent deformation of the surface mount connector during the soldering.

7. The apparatus of claim 5 , further comprising a weight assembly inserted through a slot of the plurality of slots.

8. The apparatus of claim 7 , wherein the weight assembly includes a threaded fastener inserted through the slot and at least one nut threaded on the threaded fastener.

9. The apparatus of claim 5 , comprising a plurality of weight assemblies inserted through the plurality of slots.

10. The apparatus of claim 1 , wherein a remaining portion of the socket, between the first housing end portion and the second housing end portion, is defined by the connector housing and the socket is for receiving an electronic component after the soldering.

11. The apparatus of claim 10 , wherein the electronic component is a memory module.

12. The apparatus of claim 1 , wherein the surface mount connector is a Surface Mount Technology (SMT) Double Data Rate (DDR) connector.

13. The apparatus of claim 1 , wherein the first tab and the second tab are sized for insertion into the first housing end portion and the second housing end portion, respectively.

14. The apparatus of claim 1 , wherein the first tab and the second tab have a width that is less than a width of the elongated body.

15. A method for reducing or preventing deformation of a surface mount connector during soldering of the surface mount connector to a substrate in a reflow oven, the surface mount connector including a connector housing having a top surface, a first housing end portion having defined therein a first portion of a socket, and a second housing end portion having defined therein a second portion of a socket, the method comprising:

providing an apparatus that includes an elongated body having a planar surface to couple with and contact the top surface of the surface mount connector along an entire length of the planar surface, wherein the elongated body includes:

a first body end portion forming a first tab insertable into the first portion of the socket, and

a second body end portion forming a second tab insertable into the second portion of the socket, wherein the entire length of the planar surface extends from a beginning of the first body end portion to a beginning of the second body end portion;

prior to the soldering:

distributing a weight of the apparatus across a top surface of the surface mount connector by disposing the elongated body on a top surface of the surface mount connector, wherein a planar surface of the elongated body contacts the top surface of the surface mount connector along an entire length of the planar surface;

inserting the first tab into the first portion of the socket; and

inserting the second tab into the second portion of the socket.

16. The method of claim 14 , further comprising:

inserting a portion of a first weight assembly and a portion of a second weight assembly through respective slots in the elongated body; and

fastening the first weight assembly and the second weight assembly to the elongated body.

17. The method of claim 15 , wherein said providing comprises forming the elongated body by disposing a plurality of slabs in a stacked arrangement.

18. The method of claim 17 , wherein a quantity of slabs included in the plurality of slabs is a function of a desired rigidity or a desired weight of the elongated body.

19. The method of claim 15 , further comprising after the soldering:

decoupling the apparatus from the surface mount connector; and

inserting an electronic component into the socket.