Multilayer barrier and method of formation
A multi-layer barrier and method of formation. The method includes applying oxidation to a top of a reference layer, and depositing a plurality of different metal layers over the reference layer. The method also includes providing different oxidation doses at different temperatures to different layers of the plurality of metal layers. The method further includes performing an annealing operation after depositing at least two of the plurality of different metal layers.
1. A method of forming a metal oxide barrier layer, the method comprising:
oxidizing a magnetic reference layer to provide an oxygen-terminated magnetic reference layer surface;
depositing a plurality of different metal layers over the oxygen-terminated magnetic reference layer surface;
providing different oxidation doses at different temperatures to different layers of the plurality of metal layers; and
performing an annealing operation after depositing at least two of the plurality of different metal layers.
2. The method of claim 1 and wherein each of the plurality of different metal layers comprises magnesium.
3. A method comprising:
oxidizing a magnetic reference layer to provide an oxygen-terminated magnetic reference layer surface;
depositing a plurality of different magnesium layers over the oxygen-terminated magnetic reference layer surface; and
providing oxidation doses at different temperatures to different layers of the plurality of magnesium layers.
4. The method of claim 3 and further comprising performing an annealing operation after depositing at least two of the plurality of different magnesium layers.
5. The method of claim 4 and wherein the oxidizing the magnetic reference layer is carried out at room temperature, and wherein the oxidizing the magnetic reference layer is carried out using a dose of oxygen between about 1 Standard Cubic Centimeters per minute (SCCM) and about 2 SCCM.
6. The method of claim 4 and further comprising, prior to the annealing operation, increasing a temperature of a wafer comprising the magnetic reference layer and the at least two of the plurality of different magnesium layers from a first temperature level that is above room temperature, attained when the wafer is on a heated wafer support, to a second temperature level that is higher than the first temperature level.
7. The method of claim 6 and wherein the wafer is electrostatically chucked to a wafer support to increase the temperature of the wafer from the first temperature level to the second temperature level.
8. A method comprising:
oxidizing a magnetic reference layer to provide an oxygen-terminated magnetic reference layer surface;
depositing a plurality of different magnesium layers over the oxygen-terminated magnetic reference layer surface;
providing different oxidation doses at different temperatures to different layers of the plurality of magnesium layers; and
performing an annealing operation after depositing at least two of the plurality of different magnesium layers, the annealing operation being an intermediate process carried out before providing any oxidation dose to at least one of the plurality of magnesium layers.
9. The method of claim 8 and wherein the oxidizing the magnetic reference layer is carried out at room temperature.
10. The method of claim 9 and wherein the depositing the plurality of different magnesium layers over the oxygen-terminated magnetic reference layer surface comprises depositing a first magnesium layer of the plurality of magnesium layers at room temperature.
11. The method of claim 10 and wherein the providing the different oxidation doses at different temperatures to different layers of the plurality of magnesium layers comprises oxidizing the first magnesium layer at a high temperature ranging between about 200 degrees Celsius (° C.) and about 275° C. and with an oxidation doze ranging between about 4 Standard Cubic Centimeters per minute (SCCM) and about 10 SCCM.
12. The method of claim 11 and wherein the depositing the plurality of different magnesium layers over the oxygen-terminated magnetic reference layer surface further comprises depositing, over the oxidized first magnesium layer, a second magnesium layer of the plurality of magnesium layer, the second magnesium layer being thinner than the first magnesium layer.
13. The method of claim 12 and further comprising performing the annealing operation after the depositing the second magnesium layer over the oxidized first magnesium layer, the annealing operation being carried out for a time period between about 100 seconds and about 200 seconds.
14. The method of claim 13 and further comprising, prior to the annealing operation, increasing a temperature of a wafer comprising the magnetic reference layer, the oxidized first magnesium layer and the second magnesium layer from a first temperature level that is above room temperature, attained when the wafer is on a heated wafer support, to a second temperature level that is higher than the first temperature level.
15. The method of claim 14 and wherein the wafer is electrostatically chucked to the wafer support to increase the temperature of the wafer from the first temperature level to the second temperature level.
16. The method of claim 15 , and wherein the providing the different oxidation doses at different temperatures to different layers of the plurality of magnesium layers further comprises, while the wafer is electrostatically chucked to the wafer support, oxidizing the second magnesium layer with an oxidation doze ranging between about 4 SCCM and about 10 SCCM.
17. The method of claim 16 and wherein the depositing the plurality of different magnesium layers over the oxygen-terminated magnetic reference layer surface further comprises depositing, while the wafer is electrostatically chucked to the wafer support, third and fourth magnesium layers.
18. The method of claim 17 and wherein the providing the different oxidation doses at different temperatures to different layers of the plurality of magnesium layers further comprises, while the wafer is electrostatically chucked to the wafer support, oxidizing the third magnesium layer and oxidizing the fourth magnesium layer after the fourth magnesium layer is deposited on the oxidized third magnesium layer.
19. The method of claim 17 and further comprising depositing a fifth magnesium layer over the oxidized fourth magnesium layer, the fifth magnesium layer serving a magnesium substrate layer on which a free layer is deposited, the deposited free layer being in direct contact with the magnesium substrate layer.
20. A read sensor formed by the method of claim 8 .