IP Library Granted Patent US 10,840,109
Granted Patent B2
US 10,840,109 · App. 16/367,575 · Granted Nov 17, 2020

Terminal, molded product for power module provided with terminal, and method of manufacturing molded product for power module provided with terminal

Inventors: Tamanobu Naruoka (Kyoto, JP); Kenro Shibata (Tokyo, JP)
Assignee: NAGASE & CO., LTD.
H01L21/4846B29C45/14639B29C45/76H01L23/49838H01L23/49861H01R12/585H01R13/10H01R43/205H01R43/24H05K7/1432B29C45/14065B29C45/14311B29C45/14418B29C45/14426B29C45/14467B29C2045/14139
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Quick Facts
Patent No.
US 10,840,109
App. No.
16/367,575
Granted
Nov 17, 2020
Kind
B2
Abstract

There are provided a method of manufacturing a molded product for a power module capable of integrally molding terminals and a substrate, and a terminal in a particular shape used for the manufacturing method. The method of manufacturing the molded product for a power module includes the steps of: inserting a first tip portion of each of terminals having a particular shape into a substrate; arranging the substrate in a mold such that the second tip portion is inserted into a terminal insertion portion inside the mold; and integrally molding the substrate and the terminals by flowing resin into the mold.

Claims (15)

1. A method of manufacturing a molded product for a power module, the method comprising the steps of:

preparing a terminal and an L-shaped substrate with a first portion and a second portion that is perpendicular to the first portion and has a wiring portion, the L-shaped substrate being in the form of a plate, which is L-shaped in a plane orthogonal to the longitudinal axis of the terminal, the terminal comprising a main body connecting two end portions, a first tip portion including one of the end portions, a second tip portion including an end portion on the opposite side of the first tip portion and a first expanded portion provided on the main body, an area of the first expanded portion being larger than an area of the main body relating to a cross section orthogonal to the longitudinal direction of the main body;

inserting the terminal into the L-shaped substrate from the first tip portion;

arranging the L-shaped substrate with the terminal in a mold such that the second tip portion is inserted into a terminal insertion portion inside the mold; and

integrally molding the L-shaped substrate and the terminal by flowing resin into the mold so that the wiring portion of the second portion of the L-shaped substrate is exposed for connection to another apparatus at a position spaced from a vertical line passing through a longitudinal axis of the terminal.

2. The manufacturing method according to claim 1 , wherein a length from a tip of the second tip portion to the first expanded portion is larger than a depth of the terminal insertion portion of the mold.

3. The manufacturing method according to claim 1 , wherein a length from a tip of the second tip portion to the first expanded portion is the same as or smaller than a depth of the terminal insertion portion of the mold.

4. The manufacturing method according to claim 3 , wherein the main body is further provided with a second expanded portion, and a length from the tip of the second tip portion to the second expanded portion is larger than the depth of the terminal insertion portion of the mold.

5. A molded product for a power module comprising:

a resin case;

an L-shaped substrate integrated with the case having a first portion and a second portion that is perpendicular to the first portion and has a wiring portion; and

a terminal integrated with the case and connected to the L-shaped substrate, wherein

the L-shaped substrate is in the form of a plate, which is L-shaped in a plane orthogonal to the longitudinal axis of the terminal,

the terminal comprises a main body connecting two end portions, a first tip portion including one of the end portions, a second tip portion including an end portion on an opposite side of the first tip portion and a first expanded portion provided on the main body, an area of the first expanded portion being larger than an area of the main body relating to a cross section orthogonal to the longitudinal direction of the main body, the second tip portion being exposed from the case, and

the wiring portion of the second portion of the L-shaped substrate is exposed for connection to another apparatus at a position spaced from a vertical line passing through a longitudinal axis of the terminal.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 26, 2019
From: NARUOKA, TAMANOBU; SHIBATA, KENRO
To: NAGASE & CO., LTD.
Reel/Frame 049598/0928 →
Priority Claims (1)
JP 2018-063858 · Mar 29, 2018 · national
Continuity (1)
Related Publication 20190304802A1 · Oct 3, 2019