Memory cells and memory arrays

1. A memory cell comprising:

a three-transistor-one-capacitor (3T-1C) configuration; the three transistors of the 3T-1C configuration being a first transistor having first gate, a second transistor having a second gate and a third transistor having a third gate, the first transistor being entirely elevationally above the second transistor and the second transistor being entirely elevationally above the third transistor;

a semiconductor pillar extending through the second gate of the second transistor and through the third gate of the third transistor and not extending through a gate of the first transistor, the semiconductor pillar comprising channel regions and source/drain regions of the second and third transistors; and

wherein the capacitor of the 3T-1C configuration has an inner node, an outer node, and a dielectric material between the inner and outer nodes; the inner node being electrically coupled with a source/drain region of the first transistor and with a gate of the second transistor.

2. The memory cell of claim 1 wherein the first transistor is between the capacitor and a bitline.

3. The memory cell of claim 2 wherein the bitline is a write bitline, and wherein a separate read bitline is electrically coupled with a source/drain region of the third transistor.

4. A memory cell comprising:

a three-transistor-one-capacitor (3T-1C) configuration; the three transistors of the 3T-1C configuration being a first transistor, a second transistor and a third transistor, the first transistor being entirely elevationally above the second transistor and the second transistor being entirely elevationally above the third transistor;

a first semiconductor pillar extending through the second and third transistors and comprising channel regions and source/drain regions of the second and third transistors;

a second semiconductor pillar extending through the first transistor, the second semiconductor pillar being distinct from the first semiconductor pillar and lacking direct physical contact with the first semiconductor pillar;

a write bitline vertically above the first, second and third transistors;

a read bitline vertically below the first, first second and third transistors, and a common plate electrically coupled to a node of the capacitor and electrically coupled to a second memory cell capacitor node.

5. The memory cell of claim 4 wherein the capacitor is disposed vertically between the first and second transistors.

6. The memory cell of claim 4 wherein a first transistor channel region is disposed within the second semiconductor pillar.

7. The memory cell of claim 4 wherein a first source/drain region of the first transistor is in direct contact with the write bitline.

8. The memory cell of claim 7 wherein a second source/drain region of the first transistor is coupled to a conductive interconnect.

9. The memory cell of claim 8 wherein the conductive interconnect extends between the second conductive pillar and an inner node of the capacitor.

10. A memory cell comprising:

a three-transistor-one-capacitor (3T-1C) configuration; the three transistors of the 3T-1C configuration being a first transistor, a second transistor and a third transistor, all of the first, second and third transistors are vertically displaced relative to one another;

a first semiconductor pillar extending through a gate of the first transistor and comprising a channel region and source/drain regions of the first transistor;

a first conductive interconnect extending between the first pillar and an inner node of the capacitor;

a second semiconductor pillar extending through a gate of the second transistor and through a gate of the third transistor, the second semiconductor pillar comprising channel regions and source/drain regions of the second and third transistors, the first and second semiconductive pillars being distinct from one another with an absence of direct physical contact and being laterally offset relative to each other; and

a second conductive interconnect extending between the second semiconductor pillar and the inner node of the capacitor.

11. The memory cell of claim 10 wherein the first and second conductive interconnects comprise metal.

12. The memory cell of claim 10 wherein the inner node comprises metal.

13. The memory cell of claim 10 wherein the inner node, the first conductive interconnect and the second conductive interconnect are formed of a single common material.

14. The memory cell of claim 13 wherein the single common material comprises conductively-doped semiconductor material.

15. The memory cell of claim 13 wherein the single common material comprises one or more metals.

16. The memory cell of claim 13 wherein the second transistor comprises a conductive gate comprising the single common material.

17. A memory cell comprising:

a three-transistor-one-capacitor (3T-1C) configuration; the three transistors of the 3T-1C configuration being a first transistor, a second transistor and a third transistor, all of the first, second and third transistors are vertically displaced relative to one another;

a first semiconductor pillar extending along the first transistor and comprising a channel region and source/drain regions of the first transistor;

a first conductive interconnect extending between the first pillar and an inner node of the capacitor;

a second semiconductor pillar extending along the second and third transistors and comprising channel regions and source/drain regions of the second and third transistors, the first and second semiconductive pillars being distinct from one another and being laterally offset relative to each other; and

a second conductive interconnect extending between the second semiconductor pillar and the inner node of the capacitor;

a write bitline vertically above the first, second and third transistors; and

a read bitline vertically below the first second and third transistors.