Power supply module used in a smart terminal and power supply module assembly structure
The present disclosure provides a power supply module used in a smart terminal and a power supply module assembly structure, the power supply module includes a substrate having first and second surfaces opposite to each other; a power passive element, an active element and a plurality of first conductive parts disposed at the substrate; the power passive element being independently disposed on the first surface of the substrate as a whole; wherein a maximum height of the power passive element disposed on the first surface of the substrate is greater than a sum of a maximum height of an element disposed on the second surface of the substrate and an half of the thickness of the substrate.
1. A power supply module used in a smart terminal, comprising:
a substrate having first and second surfaces opposite to each other;
a power passive element, an active element and a plurality of first conductive parts disposed at the substrate;
the power passive element being independently disposed on the first surface of the substrate as a whole;
wherein a maximum height of the power passive element disposed on the first surface of the substrate is greater than a sum of a maximum height of any element disposed on the second surface of the substrate and a half of the thickness of the substrate;
wherein the first surface at the opposite edges of the substrate is retracted relative to the second surface to form an inclined surface;
wherein the first conductive parts are disposed at the inclined surface.
2. The power supply module used in a smart terminal according to claim 1 , wherein the power passive element comprises an energy storage device or a transformer.
3. The power supply module used in a smart terminal according to claim 1 , wherein all components on the second surface of the substrate are molded on the second surface of the substrate.
4. The power supply module used in a smart terminal according to claim 1 , wherein the power supply module further has a second shielding structure, and the second shielding structure is disposed on the second surface and envelopes all components on the second surface.
5. The power supply module used in a smart terminal of claim 1 , wherein the first conductive parts are disposed at at least two sides of the substrate.
6. The power supply module used in a smart terminal of claim 5 , wherein the first conductive part is disposed at the first surface or the second surface of the substrate.
7. The power supply module used in a smart terminal according to claim 1 , wherein the first conductive parts are soldering pads.
8. The power supply module used in a smart terminal according to claim 7 , wherein the first conductive parts are soldering pads in form of stamp hole.
9. A power supply module assembly structure used in a smart terminal, comprising a system board and a power supply module, the power supply module comprises:
a substrate having first and second surfaces opposite to each other;
a power passive element, an active element and a plurality of first conductive parts disposed at the substrate;
the power passive element being independently disposed on the first surface of the substrate as a whole;
wherein a maximum height of the power passive element disposed on the first surface of the substrate is greater than a sum of a maximum height of any element disposed on the second surface of the substrate and half of the thickness of the substrate;
the system board having first and second surfaces opposite to each other, an opening through the first and second surfaces of the system board, and a plurality of second conductive parts located at the system board; wherein,
the power passive element passing through the opening, and the first conductive parts of the substrate and the second conductive parts of the system board being fixed and electrically connected, such that the power supply module being electrically connected to the system board;
wherein the first surface of the substrate is retracted relative to the second surface to form an inclined surface at the opposite edges, the first conductive parts are disposed at the inclined surface; and the edge of the opening of the system board is configured as an inclined surface in match with the edge of the substrate, and the second conductive parts are disposed at the inclined surface of the opening of the system board.
10. The power supply module assembly structure according to claim 9 , wherein the first conductive parts are disposed at at least two sides of the substrate, and the second conductive parts are disposed at sides of the opening of the second surface of the system board, and corresponds to the first conductive parts.
11. The power supply module assembly structure according to claim 9 , wherein the first conductive parts are connected to the second conductive parts by means of the SMT.
12. The power supply module assembly structure according to claim 9 , wherein the relative position between the substrate and the system board can be adjusted through adjusting a tilt angle of the inclined surface.
13. The power supply module assembly structure according to claim 9 , wherein the system board further comprises a stepped portion, which protrudes to the opening in a horizontal direction from the inclined surface, such that the portion of the first surface of the substrate close to the inclined surface is supported on the stepped portion.