Additive manufacturing of active devices using dielectric, conductive, and magnetic materials
The present invention includes a process, system and apparatus for multi-material additive manufacturing process comprising: extruding an extrudable material through a nozzle capable of moving along one or more axis and concurrently extruding one or more filaments, wherein the filament is embedded in, on or about the extrudable material from the nozzle.
1. A multi-material additive manufacturing process comprising:
extruding an extrudable material through a nozzle capable of moving along one or more axis;
concurrently extruding one or more filaments, wherein the one or more filaments is embedded in or on the extrudable material from the nozzle; and
cutting the one or more filaments with a cutter, wherein a distal tip of a filament feeding capillary that feeds the one or more filaments comprises a slot, and the cutter is positioned within the slot, wherein the filament feeding capillary is positioned within the nozzle.
2. The process of claim 1 , wherein the one or more filaments is extruded nominally coaxial with the extrudable material.
3. The process of claim 1 , wherein the one or more filaments is at least one of a metal, a semiconductor, a ceramic, a conductor, a conductive polymer, a magnetic material, a conductive powder, a fiber, an optical fiber, a tube, or a conductive thermoplastic polymer.
4. The process of claim 1 , wherein the one or more filaments is wound into coils, formed into a block, or formed into a cylinder.
5. The process of claim 1 , wherein the extrudable material is a thermoplastic material, a dielectric material, or an elastomeric material.
6. The process of claim 1 , wherein the one or more filaments is defined further as one or more sacrificial filaments, and the process comprises removing the one or more sacrificial filaments to create one or more open conduits or vias in the extrudable material.
7. The process of claim 1 , wherein the extrudable material is a dielectric surrounding the one or more filaments, the process comprising removing at least part of the dielectric by at least one of laser processing, heating, mechanical stripping, or plasma etching.
8. The process of claim 1 , comprising joining the one or more filaments by welding, soldering, brazing, ultrasonic/thermosonic bonding, crimping, winding, pressure contact, or mutual entanglement.
9. The process of claim 1 , wherein the step of cutting the one or more filaments occurs upon extrusion of the one or more filaments.
10. The process of claim 1 , further comprising a computer that controls the extruding of the extrudable material and the extruding of the one or more filaments.
11. The process of claim 1 , wherein the one or more filaments comprises two or more filaments.