Apparatus for inspecting substrate and method thereof

1. A substrate inspection apparatus comprising:

a first light source configured to radiate an ultraviolet light onto a coated film of a substrate, the coated film being mixed with fluorescent pigments;

a first light detector configured to capture fluorescence generated from the coated film onto which the ultraviolet light is radiated, and to obtain a two-dimensional (2D) image of the substrate;

a memory ( 120 ) configured to store information indicating a predetermined region of interest on the substrate;

a processor configured to determine a first region among a plurality of regions of the substrate based on the 2D image and the information indicating the region of interest;

a second light source configured to radiate a laser light onto the first region; and

a second light detector configured to obtain optical interference data generated from the first region by the laser light,

wherein the processor is configured to derive a thickness of the coated film of the first region based on the optical interference data, and

wherein the region of interest is a region that includes electrodes of elements on the substrate.

2. The substrate inspection apparatus of claim 1 , wherein the processor is configured to:

derive an amount of spread of the coated film for each of the plurality of regions based on the 2D image; and

determine a second region among the plurality of regions,

wherein an amount of spread of the second region is less than or equal to a predetermined amount, and

wherein the second light source radiates a laser light onto the second region, the second light detector obtains optical interference data generated from the second region, and the processor derives a thickness of the coated film of the second region based on the optical interference data from the second region.

3. The substrate inspection apparatus of claim 1 , wherein the processor is configured to determine a third region among the plurality of regions, the third region including a defect on the substrate based on the 2D image, and

wherein the second light source radiates a laser light onto the third region, the second light detector obtains optical interference data generated from the third region, and the processor derives a thickness of the coated film of the third region based on the optical interference data from the third region.

4. The substrate inspection apparatus of claim 1 , wherein the memory is further configured to store element arrangement information indicating arrangement of the elements on the substrate,

wherein the processor is further configured to determine a fourth region including the electrodes among the plurality of regions by comparing the element arrangement information with the 2D image, and

wherein the second light source radiates a laser light onto the fourth region, the second light detector obtains optical interference data generated from the fourth region, and the processor derives a thickness of the coated film of the fourth region based on the optical interference data from the fourth region.

5. The substrate inspection apparatus of claim 1 , wherein a reflected light which is reflected from a surface of the coated film is used as a reference light.

6. The substrate inspection apparatus of claim 5 , wherein the processor is further configured to:

obtain a sectional image showing a section cut in a first axial direction corresponding to a depth direction of the coated film, based on the optical interference data from the first region; and

determine the thickness of the coated film of the first region based on a boundary line in the sectional image.

7. The substrate inspection apparatus of claim 5 , wherein a reflectivity of the surface of the coated film with respect to the laser light is determined based on a fluorescent pigment mixing ratio of the coated film with which the fluorescent pigments are mixed, and

wherein the fluorescent pigment mixing ratio is set to a value that enables the reflectivity to exceed a predetermined reference value.

8. The substrate inspection apparatus of claim 5 , wherein the coated film is formed of at least one material selected from among acrylic, urethane, polyurethane, silicone, epoxy, an ultraviolet (UV) curable material, and an infrared (IR) curable material.

9. The substrate inspection apparatus of claim 5 , wherein the surface of the coated film is formed to be a curved surface.

10. A substrate inspection method comprising:

radiating an ultraviolet light onto a coated film of a substrate, the coated film being mixed with fluorescent pigments;

obtaining a 2D image of the substrate by capturing fluorescence generated from the coated film onto which the ultraviolet light is radiated;

determining a first region among a plurality of regions of the substrate based on the 2D image and information indicating a predetermined region of interest on the substrate;

radiating a laser light onto the first region and obtaining optical interference data generated from the first region by the laser light; and

deriving a thickness of the coated film of the first region based on the optical interference data,

wherein the region of interest is a region that includes electrodes of elements on the substrate.

11. The substrate inspection method of claim 10 , comprising:

deriving an amount of spread of the coated film for each of the plurality of regions based on the 2D image;

determining a second region among the plurality of regions,

wherein an amount of spread of the second region is less than or equal to a predetermined amount;

radiating a laser light onto the second region and obtaining optical interference data generated from the second region; and

deriving a thickness of the coated film of the second region based on the optical interference data from the second region.

12. The substrate inspection method of claim 10 , comprising:

determining a third region among the plurality of regions, the third region including a defect on the substrate based on the 2D image, and

radiating a laser light onto the third region and obtaining optical interference data generated from the third region; and

deriving a thickness of the coated film of the third region based on the optical interference data from the third region.

13. The substrate inspection method of claim 10 , comprising:

determining a fourth region including the electrodes among the plurality of regions by comparing the 2D image with element arrangement information indicating arrangement of the elements on the substrate,

radiating a laser light onto the fourth region and obtaining optical interference data generated from the fourth region; and

deriving a thickness of the coated film of the fourth region based on the optical interference data from the fourth region.

14. The substrate inspection method of claim 10 , wherein a reflected light which is reflected from a surface of the coated film is used as a reference light.

15. The substrate inspection method of claim 14 , wherein the deriving the thickness of the coated film comprises:

obtaining a sectional image showing a section cut in a first axial direction corresponding to a depth direction of the coated film, based on the optical interference data from the first region; and

determining the thickness of the coated film of the first region based on a boundary line in the sectional image.

16. The substrate inspection method of claim 14 , wherein a reflectivity of the surface of the coated film with respect to the laser light is determined based on a fluorescent pigment mixing ratio of the coated film with which the fluorescent pigments are mixed; and

wherein the fluorescent pigment mixing ratio is set to a value that enables the reflectivity to exceed a predetermined reference value.