IP Library › Granted Patent US 10,868,996
Granted Patent B1
US 10,868,996 · App. 16/918,375 · Granted Dec 15, 2020

Protective covering for an electronic device

Inventors: Jeremy Lang (Saskatoon, CA); Raymond Leung (Chai Wan, HK)
H04N5/378H04N5/33H04N5/341
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Quick Facts
Patent No.
US 10,868,996
App. No.
16/918,375
Granted
Dec 15, 2020
Kind
B1
Abstract

In one embodiment there is provided a protective case for an electronic device. The case has a substantially transparent planar back surface. The substantially transparent planar back surface is made from a compostable biopolymer material configured to form a rigid back surface and wherein the substantially transparent planar back surface has a terminal outer periphery edge. An outer bumper formed into a continuous side wall extends transversely from the planar back surface. The continuous side wall has an inwardly extending edge such that the outer bumper is configured to form fit around an electronic device. The outer bumper is made from a compostable biopolymer material configured to form into the outer bumper that is softer then the rigid back surface, and wherein the outer periphery edge of the transparent planar back surface is over-molded into the outer bumper.

Claims (18)

1. A protective case for an electronic device comprising:

a substantially rigid planar back surface made from a first compostable biopolymer material that is substantially transparent to define a substantially transparent rigid planar back surface, a terminal outer periphery edge positioned entirely around the substantially transparent rigid planar back surface;

an outer bumper formed into a continuous side wall extending transversely from the substantially transparent rigid planar back surface, the continuous side wall having an inwardly extending edge such that the outer bumper is configured to form fit around the electronic device, the outer bumper being made from a second compostable biopolymer material that is softer then the first compostable biopolymer material and that is substantially opaque, to define a substantially opaque outer bumper; and

wherein the second compostable biopolymer material is over-molded entirely around the terminal outer periphery edge of the substantially transparent rigid planar back surface;

whereby the substantially opaque outer bumper of the protective case is softer then the substantially transparent rigid transparent back surface and whereby the protective case for the electronic device is entirely manufactured from compostable biopolymer material.

2. The protective case of claim 1 , wherein the substantially transparent rigid planar back surface is made from 100% compostable biopolymer material and is configured with an Elastic Modulus between: 3.0-3.5 GPa and a Tensile Strength between: 50-60 MPa.

3. The protective case of claim 1 , wherein the substantially opaque outer bumper is made from 100% compostable elastomeric bioplastic material and is configured with an Elastic Modulus between 4-5 MPa, and a Tensile Strength between 8 and 10 MPa.

4. The protective case of claim 3 , wherein the substantially opaque outer bumper is preferably 100% compostable elastomeric bioplastic material and is configured with an Elastic Modulus of 4.4 MPa, and a Tensile Strength of 9.4 MPa.

5. A protective case comprising:

two case halves that connect to form around an electronic device, and wherein each half comprises:

a substantially transparent planar surface having a terminal outer periphery edge, the substantially transparent planar surface being made from a first compostable biopolymer material configured into a rigid surface;

a substantially opaque outer bumper formed into a continuous side wall and extending transversely from the substantially transparent planar surface, and wherein the terminal outer periphery edge of the substantially transparent planar surface is over-molded into the substantially opaque outer bumper;

the substantially opaque outer bumper being made from a second compostable biopolymer material configured to form into the substantially opaque outer bumper, and wherein the second compostable biopolymer material is softer then the first compostable biopolymer material,

whereby the substantially opaque outer bumper of the protective case is softer then the rigid surface, of the substantially transparent planar surface, and whereby the protective case for the electronic device is entirely manufactured from compostable biopolymer material.

6. The protective case of claim 5 , wherein the substantially transparent planar surface is a clear material and the substantially opaque outer bumper is an opaque material.

7. The protective case of claim 6 , wherein the substantially transparent planar surface is made from 100% compostable biopolymer material and is configured with an Elastic Modulus between: 3.0-3.5 GPa and a Tensile Strength between: 50-60 MPa.

8. The protective case of claim 6 , wherein the substantially opaque outer bumper is made from 100% compostable elastomeric bioplastic material and is configured with an Elastic Modulus between 4-5 MPa, and a Tensile Strength between 8 and 10 MPa.

9. The protective case of claim 8 , wherein the substantially opaque outer bumper is preferably 100% compostable elastomeric bioplastic material and is configured with an Elastic Modulus of 4.4 MPa, and a Tensile Strength of 9.4 MPa.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 1, 2020
From: LANG, JEREMY; LEUNG, RAYMOND
To: OPEN MIND DEVELOPMENTS CORPORATION
Reel/Frame 053115/0758 →
Continuity (1)
Division 16839224 · Apr 3, 2020
Cited By (1)
US 12,532,949