IP Library › Granted Patent US 1,093,443
Granted Patent S1
US 1,093,443 · App. 29/990,356 · Granted Sep 16, 2025

3D printer platform

Inventors: Hossein Bassir (Los Angeles, CA); Lee Hendrickson (Los Angeles, CA)
Assignee: SprintRay, Inc.
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Quick Facts
Patent No.
US 1,093,443
App. No.
29/990,356
Granted
Sep 16, 2025
Kind
S1
Claims (1)

The ornamental design for a 3D printer platform as shown and described.

Continuity (3)
Continuation In Part 19059144 · Feb 20, 2025
Continuation In Part 18244380 · Sep 11, 2023
Continuation 18133521 · Apr 11, 2023
References Cited (2)
US 20240092023A1 · Sprintray · 2024 [cited by applicant]
CN 107160683B · 2023 [cited by applicant]