Photonics interposer optoelectronics
In one embodiment an optoelectronic system can include a photonics interposer having a substrate and a functional interposer structure formed on the substrate, a plurality of through vias carrying electrical signals extending through the substrate and the functional interposer structure, and a plurality of wires carrying signals to different areas of the functional interposer structure. The system can further include one or more photonics device integrally formed in the functional interposer structure, and one or more prefabricated component attached to the functional interposer structure.
1. An optoelectronic system comprising:
a photonics interposer having a substrate and a functional interposer structure formed on the substrate, a plurality of through vias carrying electrical signals extending through the substrate and the functional interposer structure, and a plurality of wires carrying electrical signals to different areas of the functional interposer structure;
one or more photonics device integrally formed in the functional interposer structure; and
one or more prefabricated component attached to the functional interposer structure, wherein the one or more photonics device includes a dielectric waveguide, the dielectric waveguide having a bottom elevation above a top elevation of a metallization layer formed within the functional interposer structure, the metallization layer defining a wire of the plurality of wires.
2. The optoelectronic system of claim 1 , wherein the one or more prefabricated component includes a component selected from the group consisting of a prefabricated laser die chip, a prefabricated photonics integrated circuit chip and a prefabricated semiconductor chip.
3. The optoelectronic system of claim 1 , wherein the interposer includes a cavity, and wherein the one or more prefabricated component includes a prefabricated chip electrically connected to the metallization layer and disposed in the cavity, wherein the prefabricated chip is selected from the group consisting of a prefabricated laser die chip and a prefabricated photonics integrated circuit chip.
4. The optoelectronic system of claim 1 , wherein the dielectric waveguide is formed of nitride.
5. An optoelectronic system comprising:
a photonics interposer having a substrate and a functional interposer structure formed on the substrate, a plurality of through vias carrying electrical signals extending through the substrate and the functional interposer structure, and a plurality of wires carrying electrical signals to different areas of the functional interposer structure;
one or more photonics device integrally formed in the functional interposer structure; and
one or more prefabricated component attached to the functional interposer structure, wherein the one or more prefabricated component includes a prefabricated chip having a horizontally extending structure, wherein the one or more photonics device integrally formed in the functional interposer structure includes an integrally formed elongated waveguide extending horizontally in the functional interposer structure, and wherein the functional interposer structure defines a cavity, the cavity being adapted to receive the prefabricated chip so that the integrally formed elongated waveguide extending horizontally in the functional interposer structure couples to the horizontally extending structure of the prefabricated chip.
6. The optoelectronic system of claim 5 , wherein the one or more prefabricated component attached to the functional interposer structure includes a prefabricated laser die chip attached at the cavity of the functional interposer structure, and wherein the prefabricated laser die chip has a horizontally extending emission layer aligned with the integrally formed elongated waveguide extending horizontally in the functional interposer structure.
7. The optoelectronic system of claim 5 , wherein the one or more prefabricated component attached to the functional interposer structure includes a prefabricated photonics integrated circuit chip attached at the cavity of the functional interposer structure, the prefabricated photonics integrated circuit chip having an elongated horizontally extending waveguide aligned with the integrally formed elongated waveguide extending horizontally in the functional interposer structure.
8. The optoelectronic system of claim 5 , wherein the one or more prefabricated component attached to the functional interposer structure includes a prefabricated laser die chip attached at the cavity of the functional interposer structure, wherein the prefabricated laser die chip has a horizontally extending emission layer aligned with the integrally formed elongated waveguide extending horizontally in the functional interposer structure, and wherein the one or more prefabricated component attached to the functional interposer structure includes a prefabricated photonics integrated circuit chip attached at a second cavity of the functional interposer structure, the prefabricated photonics integrated circuit chip having an elongated horizontally extending waveguide aligned with the integrally formed elongated waveguide extending horizontally in the functional interposer structure.
9. The optoelectronic system of claim 5 , wherein the one or more prefabricated component attached to the functional interposer structure includes a prefabricated laser die chip attached at the cavity of the functional interposer structure, wherein the prefabricated laser die chip has a horizontally extending emission layer aligned with the integrally formed elongated waveguide extending horizontally in the functional interposer structure, wherein the one or more prefabricated component attached to the functional interposer structure includes a prefabricated photonics integrated circuit chip attached at a second cavity of the functional interposer structure, the prefabricated photonics integrated circuit chip having an elongated horizontally extending waveguide aligned with the integrally formed elongated waveguide extending horizontally in the functional interposer structure, and wherein the photonics interposer is mounted to a substructure, the substructure being a substructure selected from the group consisting of a printed circuit board, a ball grid array package and an interposer.
10. The optoelectronic system of claim 5 , wherein the one or more prefabricated component attached to the functional interposer structure includes a prefabricated laser die chip attached at the cavity of the functional interposer structure, wherein the prefabricated laser die chip has a horizontally extending emission layer aligned with the integrally formed elongated waveguide extending horizontally in the functional interposer structure, wherein the one or more prefabricated component attached to the functional interposer structure includes a prefabricated photonics integrated circuit chip attached at a second cavity of the functional interposer structure, the prefabricated photonics integrated circuit chip having an elongated horizontally extending waveguide aligned with the integrally formed elongated waveguide extending horizontally in the functional interposer structure, wherein the one or more prefabricated component attached to the functional interposer structure includes a prefabricated semiconductor chip and wherein the photonics interposer is mounted to a printed circuit board, and wherein the prefabricated semiconductor chip is a chip selected from the group consisting of a CMOS chip, an RF component chip, a MEMs chip, and a discrete component chip.
11. The optoelectronic system of claim 5 , wherein a bottom of the cavity is defined by a conductive material formation and a dielectric alignment feature, wherein the dielectric alignment feature is adapted to contact the prefabricated chip at a location of the prefabricated chip other than an electrical contact of the prefabricated chip.
12. The optoelectronic system of claim 5 , wherein a bottom of the cavity includes an alignment feature configured to facilitate elevational alignment of the prefabricated chip for which the cavity is adapted to receive, the alignment feature including a conductive material formation, the conductive material formation being configured so that on reflow of the conductive material formation the integrally formed elongated waveguide extending horizontally in the functional interposer structure is at a common elevation with the horizontally extending structure of the prefabricated chip.
13. The optoelectronic system of claim 5 , wherein the functional interposer structure defines a dielectric stack, wherein a bottom of the cavity includes an alignment feature configured to facilitate elevational alignment of the prefabricated chip for which the cavity is adapted to receive, the alignment feature including a dielectric alignment structure integrally formed at a bottom of the cavity as part of the dielectric stack, wherein the bottom of the cavity includes a conductive material formation adapted for electrical connection to an electrical contact of the prefabricated chip, wherein the dielectric alignment structure is adapted to contact the prefabricated chip at a location of the prefabricated chip other than the electrical contact so that elevational alignment of the prefabricated chip within the cavity is independent of an electrical connection between the conductive material formation and the electrical contact.
14. The optoelectronic system of claim 5 , wherein the optoelectronic system is configured so that when the prefabricated chip is received in the cavity the horizontally extending structure of the prefabricated chip and the horizontally extending waveguide are aligned along a common horizontal axis.
15. The optoelectronic system of claim 5 , wherein the optoelectronic system is configured so that when the prefabricated chip is received in the cavity the horizontally extending structure of the prefabricated chip and the horizontally extending waveguide are edge coupled to one another.
16. The optoelectronic system of claim 5 , wherein the integrally formed elongated waveguide extending horizontally in the functional interposer structure is a dielectric waveguide, wherein the optoelectronic system is adapted so that when the prefabricated chip is received in the cavity the integrally formed elongated waveguide extending horizontally in the functional interposer structure is at a common elevation with the horizontally extending structure of the prefabricated chip, and wherein the optoelectronic system is configured so that when the prefabricated chip is received in the cavity, the horizontally extending structure of the prefabricated chip and the horizontally extending waveguide are aligned along a common horizontal axis, wherein the functional interposer structure includes horizontally extending nanometer scale metallization layer defining a wire of the plurality of wires, the integrally formed elongated waveguide extending horizontally in the functional interposer structure having a bottom elevation above a top elevation of a metallization layer formed within the functional interposer structure, wherein a through via of the plurality of through vias terminates at a through via top elevation within the functional interposer structure, wherein the through via top elevation is below a bottom elevation of a photonics device of the integrally formed elongated waveguide extending horizontally in the functional interposer structure, and wherein formed on a backside of the substrate defining the photonics interposer, there is a micron scale horizontally extending redistribution layer.
17. A method for fabrication of the optoelectronic system of claim 16 , wherein the method comprises deposing dielectric material on the substrate to a certain elevation, forming a trench having a top elevation at the certain elevation and a bottom elevation at a particular elevation within the substrate; filling the trench with metal to define the through via so that the through via extends through the substrate and the dielectric material; fabricating the integrally formed elongated waveguide extending horizontally in the functional interposer structure above the certain elevation; removing bottom elevations of the substrate to reveal the through via on a bottom side of the substrate; and forming the micron scale redistribution layer on the bottom side of the substrate.
18. The optoelectronic system of claim 5 , wherein the integrally formed elongated waveguide extending horizontally in the functional interposer structure is a dielectric waveguide, wherein there is integrally formed within the functional interposer below an elevation of the dielectric waveguide a photodetector, wherein the optoelectronic system is adapted so that when the prefabricated chip is received in the cavity the integrally formed elongated waveguide extending horizontally in the functional interposer structure is at a common elevation with the horizontally extending structure of the prefabricated chip, and wherein the optoelectronic system is configured so that when the prefabricated chip is received in the cavity, the horizontally extending structure of the prefabricated chip and the horizontally extending waveguide are aligned along a common horizontal axis, wherein the functional interposer structure includes horizontally extending nanometer scale metallization layer defining a wire of the plurality of wires, the integrally formed elongated waveguide extending horizontally in the functional interposer structure having a bottom elevation above a top elevation of a metallization layer formed within the functional interposer structure, wherein a through via of the plurality of through vias terminates at a through via top elevation within the functional interposer structure, wherein through via top elevation is below a bottom elevation of a photonics device of the integrally formed elongated waveguide extending horizontally in the functional interposer structure, and wherein formed on a backside of the substrate defining the photonics interposer there is a micron scale horizontally extending redistribution layer in electrical communication with the through via, wherein a bottom elevation of the cavity is above a top elevation of the nanometer scale metallization layer, and wherein the nanometer scale metallization layer is formed on the through via, and wherein the nanometer scale metallization layer is in communication with conductive formations at a bottom of the cavity for electrically connecting to the prefabricated component, wherein a bottom of the cavity includes an alignment feature configured to facilitate elevational alignment of the prefabricated chip for which the cavity is adapted to receive, the alignment feature including a conductive material formation, the conductive material formation being configured so that on reflow of the conductive material formation, the integrally formed elongated waveguide extending horizontally in the functional interposer structure is at a common elevation with the horizontally extending structure of the prefabricated chip, the conductive material formation being configured so that the common elevation is essentially the elevation of the prefabricated chip prior to the reflow of the conductive material formation, and wherein functional interposer structure has integrally formed therein a horizontally extending nitride waveguide, wherein the functional interposer structure is adapted to receive a horizontally extending fiber optic cable having an elevation in common with the horizontally extending nitride waveguide, the horizontally extending nitride waveguide receiving light from the horizontally extending fiber optic cable.
19. An optoelectronic system comprising:
a photonics interposer having a substrate and a functional interposer structure formed on the substrate, a plurality of through vias carrying electrical signals extending through the substrate and the functional interposer structure, and a plurality of wires carrying electrical signals to different areas of the functional interposer structure;
one or more photonics device integrally formed in the functional interposer structure; and
one or more prefabricated component attached to the functional interposer structure, wherein the one or more photonics device includes a horizontally extending waveguide, the horizontally extending waveguide having a bottom elevation above a top elevation of a metallization layer formed within the functional interposer structure, the metallization layer defining a wire of the plurality of wires.
20. The optoelectronic system of claim 19 , wherein a via of the plurality of through vias terminates at a top elevation within the functional interposer structure, wherein the top elevation is below a bottom elevation of a photonics device of the one or more photonics device.