IP Library Granted Patent US 10,976,508
Granted Patent B2
US 10,976,508 · App. 15/546,266 · Granted Apr 13, 2021

Optical modules

Inventors: Sagi Varghese Mathai (Sunnyvale, CA); Wayne Victor Sorin (Mountain View, CA); Michael Renne Ty Tan (Menlo Park, CA)
Assignee: Hewlett Packard Enterprise Development LP
G02B6/423G02B6/3897G02B6/4206G02B6/4214G02B6/4215G02B6/4259G02B6/4269G02B6/4246G02B6/4274
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Quick Facts
Patent No.
US 10,976,508
App. No.
15/546,266
Granted
Apr 13, 2021
Kind
B2
Abstract

Optical modules are disclosed. An example optical module includes a substrate comprising a grating coupler, an optical connector removably coupled to the substrate adjacent the grating coupler to optically couple the optical connector and the grating coupler and an integrated circuit coupled to the substrate.

Claims (39)

1. An optical module, comprising:

an optical circuit formed on a substrate to be electrically coupled to an integrated circuit;

first interconnecting alignment structures formed on the substrate;

an expanded beam optical connector comprising second interconnecting alignment structures, the expanded beam optical connector to be removably coupled to the substrate by interconnecting the first and second interconnecting alignment structures to optically couple the expanded beam optical connector with the optical circuit, wherein the first interconnecting alignment structures and the second interconnecting alignment structures interconnect with one another at particular positions to passively align the expanded beam optical connector with the optical circuit within an alignment tolerance threshold; and

a collimating lens coupled to one end of the expanded beam optical connector and disposed at a non-perpendicular angle relative to the substrate, the substrate being oriented such that the light is coupled within the alignment tolerance threshold into a plane of the substrate to form the optical coupling between the expanded beam optical connector and the optical circuit.

2. An optical module, comprising:

a substrate comprising a first grating coupler;

a first optical connector removably coupled to the substrate adjacent the first grating coupler to optically couple the first optical connector and the first grating coupler;

a mating structure optomechanically coupling the first optical connector to the substrate by aligning the optical connector with the grating coupler within an alignment tolerance threshold;

an integrated circuit coupled to the substrate; and

a first collimating lens coupled to one end of the first optical connector and disposed at a non-perpendicular angle relative to the first grating coupler to tilt light emitted from the first optical connector, the substrate being oriented such that the light is coupled within the alignment tolerance threshold into a plane of the substrate to form the optical coupling between the first optical connector and the optical circuit.

3. The optical module of claim 2 , wherein the first optical connector comprises a single mode optical fiber, a multimode optical fiber, or a multicore fiber.

4. The optical module of claim 2 , wherein the grating coupler is a first grating coupler and the optical connector is a first optical connector, wherein the substrate comprises a second grating coupler, the optical module further comprising a second optical connector removably coupled to the substrate in optical communication with the second grating coupler further comprising:

a second grating coupler coupled to the substrate;

a second optical connector removably coupled to the substrate in optical communication with the second grating coupler; and

a second collimating lens coupled to one end of the second optical connector and disposed at a non-perpendicular angle relative to the second grating coupler to tilt light emitted from the second optical connector.

5. The optical module of claim 4 , wherein the integrated circuit is disposed between the first and second optical connectors.

6. The optical module of claim 4 , wherein the second optical connector is disposed between the first optical connector and the integrated circuit.

7. The optical module of claim 6 , further comprising a heat sink cantilevered from the integrated circuit.

8. The optical module of claim 2 , further comprising a heat sink engaging the integrated circuit and a surface of the substrate.

9. The optical module of claim 2 , wherein the first optical fiber of the first optical connector is disposed at a non-perpendicular angle relative to the first grating coupler to tilt the light entering the substrate.

10. The optical module of claim 2 , wherein a surface of the substrate facing the first optical connector is disposed at a non-parallel angle relative to the first grating coupler to tilt the light entering the substrate.

11. The optical module of claim 2 , wherein the integrated circuit and the first grating coupler are disposed on a first surface of the substrate and the first optical connector is disposed on a second surface of the substrate, the first surface opposing the second surface.

12. The optical module of claim 11 , wherein the first grating coupler comprises an exposed optical testing point.

13. An optical module, comprising:

an optical circuit formed on a substrate to be electrically coupled to an integrated circuit;

a first interconnecting alignment structure formed on the substrate;

an optical connector comprising a second interconnecting alignment structure, the optical connector to be removably coupled to the substrate by interconnecting the first and second interconnecting alignment structures to optically couple the optical connector with a grating coupler, wherein the first interconnecting alignment structure and the second interconnecting alignment structure interconnect with one another at particular positions to passively align the optical connector with the grating coupler within an alignment tolerance threshold; and

a collimating lens coupled to one end of the optical connector and disposed at a non-perpendicular angle relative to the grating coupler to tilt light emitted from the optical connector, the substrate being oriented such that the light is coupled within the alignment tolerance threshold into a plane of the substrate and forming the optical coupling between the optical connector and the optical circuit, and

wherein an interface between the substrate and the optical connector comprises a coating disposed on a surface of the substrate facing the optical connector to reduce reflection at the interface.

14. The optical module of claim 13 , wherein the second interconnecting alignment structure comprises an aperture to receive a protrusion of the first interconnecting alignment structure to removably couple the optical connector with the substrate.

15. The optical module of claim 1 , wherein the substrate includes angled surfaces to tilt the light.

16. The optical module of claim 1 , wherein the substrate includes a plurality of prism arrays to tilt the light.

17. The optical module of claim 2 , wherein a first optical axis of the light emitted from the first optical connector is offset relative to a second optical axis of the first collimating lens.

18. The optical module of claim 2 , wherein the first optical fiber is positioned relative to the first grating coupler.

19. The optical module of claim 4 , wherein the second optical connector contains a second optical fiber.

20. The optical module of claim 1 , wherein the first interconnecting alignment structures and the second interconnecting alignment structures comprise standoffs that form a spacing between the substrate and the expanded beam optical connector to reduce the insertion loss.

21. The optical module of claim 2 , wherein the mating structure comprises standoffs that form a spacing between the substrate and the first optical connector to reduce the insertion loss.

22. The optical module of claim 13 , wherein the coating comprises an antireflective coating.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 25, 2017
From: MATHAI, SAGI VARGHESE; SORIN, WAYNE VICTOR; TAN, MICHAEL RENNE TY
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 043095/0209 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 25, 2017
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
To: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Reel/Frame 043329/0001 →
Continuity (1)
Related Publication 20180329159A1 · Nov 15, 2018
Cited By (1)
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