IP Library Granted Patent US 10,996,006
Granted Patent B2
US 10,996,006 · App. 16/293,642 · Granted May 4, 2021

Cycling heat dissipation module

Inventors: Cheng-Yu Cheng (New Taipei, TW); Wen-Neng Liao (New Taipei, TW); Cheng-Wen Hsieh (New Taipei, TW)
Assignee: Acer Incorporated
F28F13/02H05K7/20309H05K7/20318H05K7/20327H05K7/20409
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Quick Facts
Patent No.
US 10,996,006
App. No.
16/293,642
Granted
May 4, 2021
Kind
B2
Abstract

A cycling heat dissipation module suited for dissipating heat generated from a heat source is provided. The cycling heat dissipation module includes an evaporator, a condenser, and a micro/nano-structure. The evaporator is thermal contacted with the heat source to absorb heat generated therefrom. The condenser is connected to the evaporator to form a loop, and a working fluid is filled in the loop. The working fluid in liquid state is transformed to vapor state by absorbing heat in the evaporator, and the working fluid in vapor state is transformed to liquid state by dissipating heat in the condenser. The micro/nano-structure is disposed in the condenser to destroy a boundary layer of the working fluid while passing through the condenser.

Claims (14)

1. A cycling heat dissipation module, configured to dissipate heat generated from a heat source, the cycling heat dissipation module comprising:

an evaporator, thermal contacted with the heat source to absorb heat generated by the heat source;

a condenser, connected to the evaporator to form a loop, a working fluid filled in the loop, wherein the working fluid in liquid-state is transformed into vapor-state by absorbing heat in the evaporator, and the working fluid in vapor-state is transformed into liquid-state by dissipating heat in the condenser; and

a micro/nano-structure, disposed on an inner wall in the condenser to destroy a boundary layer formed by the working fluid when travelling through the condenser.

2. The cycling heat dissipation module according to claim 1 , wherein the working fluid generates a slug flow in the condenser due to presence of vapor and liquid phases, and the boundary layer is formed between the working fluid and the condenser.

3. The cycling heat dissipation module according to claim 1 , wherein the condenser comprises a tube connected to the evaporator to form the loop, and the micro/nano-structure is a rough structure formed on the inner wall of the tube.

4. The cycling heat dissipation module according to claim 1 , wherein the condenser comprises a tube connected to the evaporator to form the loop, and the micro/nano-structure is a rough layer element combined with the inner wall of the tube.

5. The cycling heat dissipation module according to claim 1 , further comprising:

a tube, connected to the evaporator to form the loop, wherein the condenser comprises a tank connected between a portion of the tube, and the micro/nano-structure is disposed in the tank.

6. The cycling heat dissipation module according to claim 5 , wherein the micro/nano-structure is at least one of a protrusion, a groove, a fin or an etching structure disposed in the tank.

7. The cycling heat dissipation module according to claim 1 , further comprising:

a heat-blocking segment, connected between the condenser and the evaporator; and

a heat-blocking material, covering the heat-blocking segment.

8. The cycling heat dissipation module according to claim 7 , wherein the heat-blocking segment is supported at a higher position relative to the condenser or the evaporator.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 6, 2019
From: CHENG, CHENG-YU; LIAO, WEN-NENG; HSIEH, CHENG-WEN
To: ACER INCORPORATED
Reel/Frame 048511/0412 →
Priority Claims (1)
TW 107107762 · Mar 7, 2018 · national
Continuity (1)
Related Publication 20190277584A1 · Sep 12, 2019