Method and apparatus for optical coupling of optical signals for a photonic integrated circuit
An optical coupler and method of assembly are described that provide efficient coupling from the photonic integrated circuit (PIC) waveguide layer to external components, such as optical fibers, VCSELs, photodetectors, and gain blocks, among others. The optical coupler includes a PIC that can be supported by a printed circuit board, an optoelectronic transducer supported by the PIC that can convert between optical signals and corresponding electrical signals, and a coupled waveguide assembly. The coupled waveguide assembly includes a low-index waveguide, a high-index waveguide, and a reflective surface that changes a pathway of the optical signals to direct the optical signals from the optoelectronic transducer into the low-index waveguide or from the low-index waveguide into the optoelectronic transducer.
1. An optical coupler comprising:
a photonic integrated circuit (PIC) comprising a substrate, wherein the PIC is configured to be supported by a printed circuit board;
an optoelectronic transducer supported by the PIC and configured to convert between optical signals and corresponding electrical signals;
a coupled waveguide assembly supported by the PIC and configured to direct the optical signals between the optoelectronic transducer and an optical fiber, wherein at least a portion of the optoelectronic transducer is positioned adjacent the coupled waveguide assembly; and
a reflective surface positioned adjacent the transducer,
wherein the coupled waveguide assembly comprises a low-index waveguide, a high-index waveguide at least partially contained within the low-index waveguide, and wherein the reflective surface is configured to change a pathway of the optical signals to direct the optical signals from the optoelectronic transducer into the low-index waveguide or from the low-index waveguide into the optoelectronic transducer.
2. The optical coupler of claim 1 , wherein the high-index waveguide is formed within and is integral to the substrate.
3. The optical coupler of claim 1 , wherein the high-index waveguide is disposed on a surface of the PIC.
4. The optical coupler of claim 1 , wherein the PIC comprises at least one of a nanophotonic silicon on insulator (SOI) substrate or a silicon interposer.
5. The optical coupler of claim 1 , wherein at least one of the high-index waveguide or the low-index waveguide defines a tapered section that is configured to change a mode of the optical signal passing therethrough.
6. The optical coupler of claim 1 , wherein the PIC is connected to a printed circuit board using at least one of a through-silicon via (TSV) or a redistribution layer (RDL).
7. The optical coupler of claim 1 , wherein the optoelectronic transducer comprises at least one of a vertical-cavity surface-emitting laser (VCSEL) or a photodiode.
8. The optical coupler of claim 1 , wherein the reflective surface comprises a first reflective surface configured to change a pathway of the optical signals to direct the optical signals from the optoelectronic transducer into the low-index waveguide or from the low-index waveguide into the optoelectronic transducer, and wherein the coupled waveguide assembly further comprises a second reflective surface configured to change a pathway of the optical signals to direct the optical signals from the optical fiber into the coupled waveguide system or from the coupled waveguide system into the optical fiber.
9. The optical coupler of claim 1 , wherein the reflective surface comprises a prism separate from and disposed proximate the low-index waveguide.
10. The optical coupler of claim 1 , wherein the reflective surface comprises an angled facet of the low-index waveguide.
11. The optical coupler of claim 1 , wherein the coupled waveguide system comprises a plurality of at least one of the low-index waveguide or the high-index waveguide.
12. A method of assembling an optical coupler, the method comprising:
providing a photonic integrated circuit (PIC) comprising a substrate;
supporting an optoelectronic transducer on the PIC, wherein the optoelectronic transducer is configured to convert between optical signals and corresponding electrical signals;
forming a coupled waveguide assembly supported by the PIC, wherein the coupled waveguide assembly is configured to direct the optical signals between the optoelectronic transducer and an optical fiber, and wherein at least a portion of the optoelectronic transducer is positioned adjacent the coupled waveguide assembly; and
providing a reflective surface positioned adjacent the transducer,
wherein the coupled waveguide assembly is formed by coupling at least one low-index waveguide with at least one high-index waveguide such that the at least one high-index waveguide is at least partially contained within the at least one low-index waveguide and wherein the reflective surface is configured to change a pathway of the optical signals to direct the optical signals from the optoelectronic transducer into the low-index waveguide or from the low-index waveguide into the optoelectronic transducer.
13. The method of claim 12 , wherein providing the PIC comprises using at least one of a nanophotonic silicon on insulator (SOI) substrate or a silicon interposer.
14. The method of claim 12 further comprising connecting the PIC to a printed circuit board using at least one of a through-silicon via (TSV) or a redistribution layer (RDL).
15. The method of claim 12 , wherein forming the coupled waveguide assembly comprises forming a tapered section on the high-index waveguide proximate the low-index waveguide, wherein the tapered section is configured to change the mode of the optical signal.
16. The method of claim 12 , wherein supporting an optoelectronic transducer on the PIC comprises mounting the optoelectronic transducer on the PIC using flip-chip technology.
17. The method of claim 12 , wherein providing the reflective surface comprises forming a prism separate from and disposed proximate to an end of the low-index waveguide.
18. The method of claim 12 , wherein providing the reflective surface comprises creating an angled facet of the low-index waveguide.
19. An optical coupler comprising:
a photonic integrated circuit (PIC) comprising a substrate, wherein the PIC is configured to be supported by a printed circuit board and the PIC is connected to the printed circuit board using at least one of a through-silicon via (TSV) or a redistribution layer (RDL);
an optoelectronic transducer supported by the PIC and configured to convert between optical signals and corresponding electrical signals;
a coupled waveguide assembly supported by the PIC and configured to direct the optical signals between the optoelectronic transducer and an optical fiber, wherein at least a portion of the optoelectronic transducer is positioned adjacent the coupled waveguide assembly; and
a reflective surface positioned adjacent the transducer,
wherein the coupled waveguide assembly comprises a low-index waveguide and a high-index waveguide proximate the low-index waveguide, and wherein the reflective surface is configured to change a pathway of the optical signals to direct the optical signals from the optoelectronic transducer into the low-index waveguide or from the low-index waveguide into the optoelectronic transducer.
20. The optical coupler of claim 19 , wherein the high-index waveguide is at least partially contained within the low-index waveguide to create the coupled waveguide assembly.