Vertical transistor having reduced edge fin variation
A semiconductor device includes a substrate with a first semiconductor fin and a second semiconductor fin formed thereon. A pair of opposing dielectric trench spacers are between the first and second semiconductor fins. The opposing dielectric trench spacers define an isolation region therebetween. The semiconductor device further includes a shallow trench isolation (STI) element formed in the isolation region. The STI element includes a lower portion on the substrate and an upper portion located opposite the lower portion. The upper portion extends above an upper end of the dielectric trench spacers.
1. A semiconductor device comprising:
a substrate including a first semiconductor fin and a second semiconductor fin separated from the first semiconductor fin by an isolation region;
a pair of opposing dielectric trench spacers in a portion of the substrate located in the isolation region between the first and second semiconductor fins; and
a shallow trench isolation (STI) element comprising a trench dielectric material formed in the isolation region, the STI element including an upper surface that extends no higher than an upper end of the opposing dielectric trench spacers,
wherein the STI element includes a trench liner interposed between the trench dielectric material and the opposing dielectric spacers, and wherein the opposing dielectric trench spacers are discrete from one another.
2. The semiconductor device of claim 1 , wherein the upper surface of the STI element includes a divot that extends into the trench dielectric material and below both the trench liner and upper ends of the opposing dielectric trench spacers.
3. The semiconductor device of claim 2 further comprising a top spacer formed on an upper surface of the STI element, the top spacer including a V-shaped portion that extends into the divot.
4. The semiconductor device of claim 3 , wherein the trench liner is formed on sidewalls of the trench dielectric material, along with a base of the trench dielectric material.
5. The semiconductor device of claim 4 further comprising:
a bottom source or drain (S/D) region formed on an upper surface of the substrate; and
a bottom spacer formed on an upper surface of the S/D region, wherein an upper surface of the bottom spacer is flush with the upper end of the dielectric trench spacers.
6. The semiconductor device of claim 5 , wherein the opposing dielectric trench spacers are formed directly against each of the substrate, the bottom S/D region, and the bottom spacer.