IP Library Granted Patent US 11,013,149
Granted Patent B2
US 11,013,149 · App. 16/810,144 · Granted May 18, 2021

Electronic device including heat dissipation structure

Inventors: Yonghwa Kim (Suwon-si, KR); Dongil Son (Suwon-si, KR); Chihwei Lee (Suwon-si, KR)
Assignee: Samsung Electronics Co., Ltd.
H05K7/20436H01Q1/002H05K5/0004H05K5/0017H05K7/2099H05K7/20336H05K7/20963H04M1/0202
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Quick Facts
Patent No.
US 11,013,149
App. No.
16/810,144
Granted
May 18, 2021
Kind
B2
Abstract

An electronic device is provided. The electronic device includes a housing including a front plate, a rear plate facing away from the front plate, and a side structure surrounding a space between the front plate and the rear plate, a heat dissipation member accommodated inside the housing, at least one antenna module disposed adjacent to the side structure or at least partially accommodated in the side structure, the at least one antenna module being disposed to be inclined or perpendicular relative to the front plate or the rear plate, and a fixing member coupled to and at least partially surrounding the antenna module. The fixing member may include a first heat transfer portion at least partially surrounding a rear face of the antenna module, and a second heat transfer portion disposed in contact with the heat dissipation member.

Claims (60)

1. An electronic device comprising:

a housing including a front plate, a rear plate facing away from the front plate, and a side structure surrounding a space between the front plate and the rear plate;

a heat dissipation member accommodated inside the housing;

at least one antenna device disposed adjacent to the side structure or at least partially accommodated in the side structure, the at least one antenna device being disposed to be inclined or perpendicular relative to the front plate or the rear plate; and

a fixing member coupled to and at least partially surrounding the at least one antenna device,

wherein the fixing member includes:

a fixing piece at least partially surrounding a side face of the at least one antenna device;

a first heat transfer portion at least partially surrounding a rear face of the at least one antenna device; and

a second heat transfer portion disposed in contact with the heat dissipation member, the second heat transfer portion being configured to transfer heat from the first heat transfer portion to the heat dissipation member, and

wherein the first heat transfer portion or the second heat transfer portion extends from the fixing piece.

2. The electronic device of claim 1 ,

wherein the at least one antenna device includes a substrate and a molding portion formed on one face of the substrate, and

wherein the one face of the substrate or another face of the substrate facing away from the one face is disposed to be inclined or perpendicular relative to the front plate or the rear plate.

3. The electronic device of claim 2 , wherein the first heat transfer portion is disposed in contact with at least a part of the molding portion.

4. The electronic device of claim 1 , wherein the heat dissipation member includes a graphite sheet, a vapor chamber, or a heat pipe.

5. The electronic device of claim 1 ,

wherein the fixing member further includes at least one fastening piece extending from at least one end of the fixing piece, and

wherein the at least one fastening piece is bound to the side structure.

6. The electronic device of claim 5 , wherein the at least one fastening piece transfers heat from the first heat transfer portion or the fixing piece to the side structure.

7. The electronic device of claim 1 , further comprising:

a heat transfer member,

wherein a portion of the heat transfer member is attached to the fixing piece, and another portion of the heat transfer member is attached to the heat dissipation member.

8. The electronic device of claim 1 , wherein the first heat transfer portion is bent to be inclined or perpendicular relative to the fixing piece and is disposed to face or to be in contact with one face of the at least one antenna device.

9. The electronic device of claim 8 ,

wherein at least a part of the heat dissipation member is disposed to face the first heat transfer portion, and

wherein the second heat transfer portion is interposed between the heat dissipation member and the first heat transfer portion.

10. The electronic device of claim 8 ,

wherein the fixing member further includes an opening formed to penetrate the first heat transfer portion,

wherein at least a part of the heat dissipation member is disposed to face the first heat transfer portion, and

wherein the second heat transfer portion partially comes into contact with one face of the at least one antenna device through the opening while being interposed between the heat dissipation member and the first heat transfer portion.

11. The electronic device of claim 8 , further comprising:

an adhesive member,

wherein the adhesive member is used to attach the first heat transfer portion to one face of the at least one antenna device, and transfers heat from the at least one antenna device to the first heat transfer portion.

12. The electronic device of claim 1 ,

wherein the side structure includes an electrically conductive material portion and an electrically nonconductive material portion, and

wherein the at least one antenna device is disposed to face the electrically nonconductive material portion inside the side structure.

13. The electronic device of claim 12 ,

wherein the fixing member further includes a fixing piece at least partially surrounding a side face of the at least one antenna device and fastening pieces extending from both ends of the fixing piece, respectively, and

wherein the fastening pieces are bound to the electrically conductive material portion and are configured to transfer heat from the first heat transfer portion or the fixing piece to the electrically conductive material portion.

14. The electronic device of claim 1 ,

wherein the first heat transfer portion is disposed to be inclined or perpendicular relative to the fixing piece while extending from the fixing piece, and

wherein the second heat transfer portion is disposed to be inclined or perpendicular relative to the first heat transfer portion while extending from the fixing piece.

15. An electronic device comprising:

a housing;

a display device mounted on one face of the housing;

at least one antenna device accommodated inside the housing, the at least one antenna device being configured to transmit/receive a wireless signal by forming a beam in a direction inclined or perpendicular relative to a direction in which the display faces;

a fixing member coupled to and at least partially surrounding the at least one antenna device; and

a heat dissipation member accommodated inside the housing,

wherein the fixing member includes:

a first heat transfer portion at least partially surrounding a rear face of the at least one antenna device; and

a second heat transfer portion disposed in contact with the heat dissipation member, the second heat transfer portion being configured to transfer heat from the first heat transfer portion to the heat dissipation member.

16. The electronic device of claim 15 ,

wherein the fixing member further includes a fixing piece at least partially surrounding a side face of the at least one antenna device,

wherein the first heat transfer portion is disposed to be inclined or perpendicular relative to the fixing piece while extending from the fixing piece, and

wherein the second heat transfer portion is disposed to be inclined or perpendicular relative to the first heat transfer portion while extending from the fixing piece.

17. The electronic device of claim 16 , wherein the first heat transfer portion is disposed to face or to come into contact with at least a part of one face of the at least one antenna device.

18. The electronic device of claim 16 , further comprising:

a heat transfer member,

wherein a portion of the heat transfer member is attached to the fixing piece, and another portion of the heat transfer member is attached to the heat dissipation member.

19. The electronic device of claim 18 , wherein another portion of the heat transfer member is attached to the second heat transfer portion.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 5, 2020
From: KIM, YONGHWA; SON, DONGIL; LEE, CHIHWEI
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 052028/0445 →
Priority Claims (1)
KR 10-2019-0056849 · May 15, 2019 · national
Continuity (1)
Related Publication 20200367386A1 · Nov 19, 2020
Cited By (2)
US 12,272,877 US 12,449,866