High thermal expansion glass composites and uses thereof
View Patent ↗The present invention relates to glass composites, including filled glass composites and uses thereof. In particular examples, the composites provide improved thermal expansion characteristics. Also described are methods of forming such composites, such as by adding a particle filler to a glass mixture.
1. A method comprising:
providing a glass matrix in a powder form, wherein the matrix comprises of from about 65 wt. % to about 80 wt. % of SiO 2 ; from about 8 wt. % to about 16 wt. % of Li 2 O; from about 2 wt. % to about 8 wt. % of Al 2 O 3 ; from about 1 wt. % to about 8 wt. % of K 2 O; from about 1 wt. % to about 5 wt. % of P 2 O 5 ; from about 0.5 wt. % to about 7 wt. % of B 2 O 3 ; and from about 0.1 wt. % to about 5 wt. % of ZnO;
adding a particle filler in an amount of from about 10 wt. % to about 60 wt. % to the mixture, thereby forming a mixture; and
thermally treating the mixture to form a filled glass composite.
2. The method of claim 1 , wherein the providing and adding are performed simultaneously.
3. The method of claim 1 , wherein the filler comprises a ceramic, a metal, or an oxide.
4. The method of claim 3 , wherein the filler is a crystalline quartz in powder form.
5. The method of claim 1 , wherein the composite further comprises of from about 10 wt. % to about 35 wt. % of the SiO 2 as a cristobalite phase; from about 3 wt. % to about 10 wt. % of the SiO 2 as a low quartz phase; and/or a crystalline phase of from about 0.5 wt. % to about 5 wt. % in a Li 2 Si 2 O 5 form.
6. The method of claim 1 , wherein the thermally treating step further comprises a heating step following by a series of one or more cooling steps.
7. The method of claim 6 , wherein the heating step comprises heating the combination to a first temperature T 1 of from about 950° C. to about 1050° C.
8. The method of claim 6 , wherein the series comprises a plurality of cooling steps, and wherein the plurality of cooling steps comprises cooling to a second temperature T 2 of from about 750° C. to about 850° C. and then cooling to a third temperature T 3 of from about 10° C. to about 500° C.
9. The method of claim 1 , wherein the thermally treating step is conducted in the presence of a metal.
10. The method of claim 9 , wherein the composite forms a seal with the metal.