IP Library Granted Patent US 11,030,513
Granted Patent B2
US 11,030,513 · App. 16/691,623 · Granted Jun 8, 2021

Chip card

Inventors: Walther Pachler (Wetzelsdorf, AT); Josef Gruber (Sankt Ruprecht an der Raab, AT); Juergen Hoelzl (Graz, AT); Francois Poensgen (Graz, AT); Stephan Rampetzreiter (Graz, AT)
Assignee: INFINEON TECHNOLOGIES AG
G06K19/07775G06K19/02G06K19/12G06K19/18
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Quick Facts
Patent No.
US 11,030,513
App. No.
16/691,623
Granted
Jun 8, 2021
Kind
B2
Abstract

A chip card is provided. The chip card can have a metal layer in which an opening is formed and a slot that extends from one edge of the opening to the outer edge of the metal layer, a booster antenna structure, arranged in the opening, having an antenna section for electromagnetically coupling to the metal layer and having a coupling region for electromagnetically coupling to an antenna structure of a chip module, and the chip module, which is arranged in the coupling region, having the antenna structure arranged on the chip module.

Claims (49)

1. A chip card, comprising:

a metal layer in which an opening is formed and a slot that extends from one edge of the opening to the outer edge of the metal layer;

a booster antenna structure, arranged in the opening, having an antenna section for electromagnetically coupling to the metal layer and having a coupling region for electromagnetically coupling to an antenna structure of a chip module; and

the chip module, which is arranged in the coupling region, having the antenna structure arranged on the chip module.

2. The chip card of claim 1 ,

wherein the booster antenna structure is formed by an etched metal.

3. The chip card of claim 1 ,

wherein the booster antenna structure is formed on a flexprint substrate.

4. The chip card of claim 1 ,

wherein the booster antenna structure is formed by a wire.

5. The chip card of claim 1 ,

wherein the booster antenna structure is formed by a punched metal.

6. The chip card of claim 1 ,

wherein the metal of the booster antenna structure is a metal selected from a group consisting of:

aluminum;

silver;

copper; and

an alloy of at least one of the metals listed above.

7. The chip card of claim 1 ,

wherein the booster antenna structure has at least one antenna turn;

wherein the distance between the outer edge of the antenna turn and the edge of the opening of the metal layer is no more than 500 μm.

8. The chip card of claim 7 ,

wherein the distance between the outer edge of the antenna turn and the edge of the opening of the metal layer is no more than 300 μm.

9. The chip card of claim 8 ,

wherein the distance between the outer edge of the antenna turn and the edge of the opening of the metal layer is no more than 200 μm.

10. The chip card of claim 9 ,

wherein the distance between the outer edge of the antenna turn and the edge of the opening of the metal layer is no more than 100 μm.

11. The chip card of claim 1 ,

wherein the distance between the outer edge of the antenna turn and the edge of the opening of the metal layer is in a range from approximately 50 μm to approximately 500 μm.

12. The chip card of claim 11 ,

wherein the distance between the outer edge of the antenna turn and the edge of the opening of the metal layer is in a range from approximately 100 μm to approximately 300 μm.

13. The chip card of claim 1 ,

wherein the metal layer has a thickness that is substantially equal to the total thickness of the chip card.

14. The chip card of claim 1 , further comprising:

a support;

wherein the metal layer is arranged above the support;

wherein the support has a cutout in which the chip module is arranged.

15. The chip card of claim 1 ,

wherein the metal layer is laminated with at least one additional layer.

16. The chip card of claim 1 ,

wherein the metal layer has a thickness that is at least 90% of the total thickness of the chip card.

17. The chip card of claim 1 ,

wherein the booster antenna structure, the metal layer and the antenna structure of the chip module are arranged relative to one another such that the electromagnetic coupling between the booster antenna structure and the metal layer is less than the electromagnetic coupling between the booster antenna structure and the antenna structure of the chip module.

18. The chip card of claim 1 ,

wherein the booster antenna structure and the metal layer are arranged relative to one another such that the electromagnetic coupling between the booster antenna structure and the metal layer has a coupling factor in a range from approximately 0.05 to approximately 0.35.

19. The chip card of claim 1 ,

wherein the booster antenna structure and the antenna structure of the chip module are arranged relative to one another such that the electromagnetic coupling between the booster antenna structure and the antenna structure of the chip module has a coupling factor in a range from approximately 0.3 to approximately 0.9.

20. The chip card of claim 1 ,

wherein the metal layer has a weight that is at least 90% of the total weight of the chip card.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 26, 2019
From: PACHLER, WALTHER; GRUBER, JOSEF; HOELZL, JUERGEN; RAMPETZREITER, STEPHAN; POENSGEN, FRANCOIS
To: INFINEON TECHNOLOGIES AG
Reel/Frame 051111/0555 →
Priority Claims (1)
DE 10 2018 129 569.3 · Nov 23, 2018 · national
Continuity (1)
Related Publication 20200167628A1 · May 28, 2020
Cited By (2)
US 1,103,272 US 12,423,552