Semiconductor device mounted on circuit board of electronic device
There is provided a semiconductor device, including: a semiconductor element which includes an element main surface and an element rear surface that face opposite sides in a thickness direction and in which a first electrode and a second electrode are formed on the element main surface; a first conductive member electrically connected to the first electrode; a second conductive member electrically connected to the second electrode; and a sealing resin configured to cover part of the first conductive member, part of the second conductive member, and the semiconductor element.
1. A semiconductor device, comprising:
a semiconductor element which includes an element main surface and an element rear surface that face opposite sides in a thickness direction and in which a first electrode and a second electrode are formed on the element main surface;
a first conductive member electrically connected to the first electrode;
a second conductive member electrically connected to the second electrode;
a third conductive member on which the semiconductor element is mounted; and
a sealing resin configured to cover part of the first conductive member, part of the second conductive member, and the semiconductor element, the sealing resin including a resin rear surface facing the same direction as the element rear surface,
wherein the first conductive member comprises:
a first pad part overlapping with the semiconductor element as viewed in the thickness direction;
a first exposure part protruding from the sealing resin as viewed in the thickness direction; and
a first connection part which is covered with the sealing resin and is connected to the first pad part and the first exposure part,
wherein the first pad part comprises:
a bonding surface bonded to the first electrode;
a first pad main surface facing a direction opposite to the bonding surface in the thickness direction; and
a non-bonding portion which includes an inner surface extending from the bonding surface toward the first pad main surface and is not bonded to the first electrode,
wherein the first exposure part comprises:
a first bent part which is connected to the first connection part and is bent in the thickness direction; and
a first terminal part connected to the first bent part,
wherein a third electrode is formed on the element rear surface of the semiconductor element,
wherein the third conductive member is electrically connected to the third electrode, and includes a mounting surface facing the same direction as the element rear surface and exposed from the resin rear surface, and
wherein the first terminal part is configured to overlap with the third conductive member as viewed in a first direction orthogonal to the thickness direction.
2. The device of claim 1 , wherein the second electrode includes:
a pad electrode portion to which the second conductive member is bonded; and
a finger electrode portion for reducing an internal resistance of the second electrode, and
wherein the non-bonding portion is configured to overlap with the finger electrode portion as viewed in the thickness direction.
3. The device of claim 2 , wherein the semiconductor element includes an insulating film configured to cover the finger electrode portion.
4. The device of claim 2 , wherein the semiconductor element is 0.05 to 0.3 mm square as viewed in the thickness direction.
5. The device of claim 1 , wherein the second conductive member includes:
a second pad part bonded to the second electrode;
a second exposure part protruding from the sealing resin as viewed in the thickness direction; and
a second connection part covered with the sealing resin and connected to the second pad part and the second exposure part.
6. The device of claim 5 , wherein the second exposure part includes:
a second bent part connected to the second connection part and bent in the thickness direction; and
a second terminal part connected to the second bent part.
7. The device of claim 6 , wherein the second terminal part is configured to overlap with the third conductive member as viewed in the first direction.
8. The device of claim 1 , wherein the non-bonding portion further includes a bottom surface connected to the inner surface and facing the same direction as the bonding surface.
9. The device of claim 8 , wherein the non-bonding portion includes a plurality of recesses, each of the plurality of recesses extending in the first direction orthogonal to the thickness direction and being arranged in a second direction orthogonal to both the thickness direction and the first direction.
10. The device of claim 9 , wherein each of the plurality of recesses is connected from an edge on a first side of the first pad part in the first direction to an edge on a second side of the first pad part in the first direction.
11. The device of claim 1 , wherein at least part of the first pad main surface is exposed from the sealing resin.
12. The device of claim 11 , wherein the sealing resin includes:
a resin main surface facing the same direction as the element main surface; and
a resin recess recessed from the resin main surface,
wherein the resin recess includes:
a resin recess bottom surface; and
a resin recess side surface connected to the resin recess bottom surface and the resin main surface, and
wherein the resin recess bottom surface and the first pad main surface are flush with each other.
13. The device of claim 1 , wherein the semiconductor element is a power MOSFET,
wherein the first electrode is a source electrode, and
wherein the second electrode is a gate electrode.