Loose lay plastic floor and preparation method thereof

1. A method of preparing a loose lay plastic floor, comprising the following steps:

(a) subjecting a wear layer, a printing layer, a semi-rigid polyvinyl chloride (PVC) layer, a core layer and an adsorption layer to hot-melt compounding and shaping to obtain a composite board;

(b) coating at least one layer of ultraviolet (UV) coating on a surface of the wear layer of the composite board; and

(c) subjecting the composite board coated with the at least one layer of UV coating to tempering, conditioning and punching to obtain the loose lay plastic floor;

wherein a temperature of the tempering is 70-95° C., and a time duration of the tempering is 2-15 minutes, and the conditioning is to place the composite board at 20-28° C. for 48-72 hours.

2. The method according to claim 1 , wherein the core layer is a stone plastic core (SPC), the semi-rigid PVC layer comprises a first semi-rigid PVC layer and a second semi-rigid PVC layer, and the composite board is obtained by the hot-melt compounding by the following steps:

stacking the wear layer, the printing layer, the first semi-rigid PVC layer, the second semi-rigid PVC layer and the adsorption layer sequentially, disposing the first semi-rigid PVC layer between the core layer and the printing layer and disposing the second semi-rigid PVC layer between the core layer and the adsorption layer; and performing the hot-melt compounding and the shaping to obtain the composite board.

3. The method according to claim 1 , wherein the core layer is either a wood plastic core (WPC), a high density fiberboard (HDF), or a medium density fiberboard (MDF), the semi-rigid PVC layer comprises a first semi-rigid PVC layer and a second semi-rigid PVC layer, and the composite board is prepared by the following step:

adhesively bonding an upper composite layer, the core layer and a lower composite layer to obtain the composite board by a hot melt adhesive, wherein

the upper composite layer comprises the wear layer, the first semi-rigid PVC layer and the printing layer and is obtained by performing the hot-melt compounding on the wear layer, the first semi-rigid PVC layer and the printing layer and the shaping, and

the lower composite layer comprises the adsorption layer and the second semi-rigid PVC layer and is obtained by performing the hot-melt compounding on the second semi-rigid PVC layer and an adsorption layer and the shaping.

4. The method according to claim 1 , wherein during the hot-melt compounding, a temperature is controlled at 125-175° C., a pressure is controlled at 0.0-8.5 MPa, and a time duration is controlled at 15-45 minutes; and

the shaping is performed for 15-45 minutes at a temperature of no higher than 80° C. and a pressure of 2.0-8.5 MPa.

5. The method according to claim 1 , wherein the semi-rigid PVC layer comprises:

10.2-36.2% of PVC resin; 59.8-82.9% of CaCO 3 ; 4.8-14.7% of dioctyl terephthalate (DOTP); 0-5.9% of modifier; and 0.2-1.8% of stabilizer.

6. The method according to claim 5 , wherein the modifier is at least one selected from the group consisting of butadiene-acrylonitrile rubber, polyvinyl chloride-vinyl acetate copolymer resin, chlorinated polyethylene, and acrylate.

7. The method according to claim 1 , wherein the wear layer is made of PVC material, and has a thickness of 0.1-1.0 mm;

the printing layer is made of PVC material, and has a thickness of 0.05-0.09 mm;

the semi-rigid PVC layer has a thickness of 0.7-3.0 mm;

the adsorption layer is made of thermoplastic polyurethane (TPU) material or PVC micro foaming material, and has a thickness of 0.02-0.7 mm; and

the core layer has a thickness of 1-6 mm.

8. The method according to claim 2 , wherein during the hot-melt compounding, a temperature is controlled at 125-175° C., a pressure is controlled at 2.0-8.5 MPa, and a time duration is controlled at 15-45 minutes; and

the shaping is performed for 15-45 minutes at a temperature of no higher than 80° C. and a pressure of 2.0-8.5 MPa.

9. The method according to claim 3 , wherein during the hot-melt compounding, a temperature is controlled at 125-175° C., a pressure is controlled at 2.0-8.5 MPa, and a time duration is controlled at 15-45 minutes; and

the shaping is performed for 15-45 minutes at a temperature of no higher than 80° C. and a pressure of 2.0-8.5 MPa.