IP Library Granted Patent US 11,060,937
Granted Patent B2
US 11,060,937 · App. 16/488,470 · Granted Jul 13, 2021

Micromechanical pressure sensor

Inventors: Ferenc Lukacs (Lenti, HU); Arne Dannenberg (Metzingen, DE); Friedjof Heuck (Stuttgart, DE); Helmut Grutzeck (Kusterdingen, DE); Mike Schwarz (Kusterdingen, DE); Robert Maul (Reutlingen, DE); Tamas Dögei (Nagykata, HU); Thomas Friedrich (Moessingen-Oeschingen, DE); Volkmar Senz (Metzingen, DE)
Assignee: Robert Bosch GmbH
G01L19/146G01L9/0052G01L19/0069G01L19/0618
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Quick Facts
Patent No.
US 11,060,937
App. No.
16/488,470
Granted
Jul 13, 2021
Kind
B2
Abstract

A micromechanical pressure sensor, having—a pressure sensor core including a sensor diaphragm and a cavity developed above the sensor diaphragm; and—a pressure sensor frame; and—a spring element for the mechanical connection of the pressure sensor core to the pressure sensor frame being developed in such a way that a mechanical robustness is maximized and a coupling of stress from the pressure sensor frame into the sensor pressure core is minimized.

Claims (24)

1. A micromechanical pressure sensor, comprising:

a pressure sensor core that includes a sensor diaphragm and a cavity developed above the sensor diaphragm;

a pressure sensor frame; and

a spring element that mechanically connects the pressure sensor core to the pressure sensor frame, wherein the spring element includes a ring disposed around the pressure sensor core, the spring element being connected to the pressure sensor core at only a singular connection location via a first connection element, and the spring element being connected to the pressure sensor frame at only a singular connection location via a second connection element.

2. A micromechanical pressure sensor, comprising:

a pressure sensor core that includes a sensor diaphragm and a cavity developed above the sensor diaphragm;

a pressure sensor frame; and

a spring element that mechanically connects the pressure sensor core to the pressure sensor frame, wherein the spring element is connected to the pressure sensor core at only two connection locations via two symmetrically disposed connection elements, and the spring element is connected to the pressure sensor frame at only a singular connection location via a further connection element.

3. A micromechanical pressure sensor, comprising:

a pressure sensor core that includes a sensor diaphragm and a cavity developed above the sensor diaphragm;

a pressure sensor frame; and

a spring element that mechanically connects the pressure sensor core to the pressure sensor frame, wherein the spring element is connected to the pressure sensor core at only a single connection location via a connection element, and the spring element is connected to the pressure sensor frame at only two connection locations via two symmetrically disposed connection elements.

4. A micromechanical pressure sensor, comprising:

a pressure sensor core that includes a sensor diaphragm and a cavity developed above the sensor diaphragm;

a pressure sensor frame; and

a spring element that mechanically connects the pressure sensor core to the pressure sensor frame, wherein the spring element is connected to the pressure sensor core at only four connection locations via four symmetrically disposed connection elements, and the spring element is connected to the pressure sensor frame at only two connection locations via two symmetrically disposed connection elements.

5. The micromechanical pressure sensor as recited in claim 1 , further comprising electrical lines for piezoresistive elements that are routed on the spring element in order to realize a Wheatstone bridge.

6. The micromechanical pressure sensor as recited in claim 2 , further comprising electrical lines for piezoresistive elements that are routed on the spring element in order to realize a Wheatstone bridge.

7. The micromechanical pressure sensor as recited in claim 3 , further comprising electrical lines for piezoresistive elements that are routed on the spring element in order to realize a Wheatstone bridge.

8. The micromechanical pressure sensor as recited in claim 4 , further comprising electrical lines for piezoresistive elements that are routed on the spring element in order to realize a Wheatstone bridge.

9. A method for producing a micromechanical pressure sensor, comprising:

providing a pressure sensor core including a sensor diaphragm and a cavity developed above the sensor diaphragm;

providing a pressure sensor frame;

providing a spring element for a mechanical connection of the pressure sensor core to the pressure sensor frame, wherein the spring element includes a ring disposed around the pressure sensor core, the spring element being connected to the pressure sensor core at only a singular connection location via a first connection element, and the spring element being connected to the pressure sensor frame at only a singular connection location via a second connection element.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 14, 2020
From: LUKACS, FERENC; DANNENBERG, ARNE; HEUCK, FRIEDJOF; GRUTZECK, HELMUT; SCHWARZ, MIKE; MAUL, ROBERT; DÖGEI, TAMAS; FRIEDRICH, THOMAS; SENZ, VOLKMAR
To: ROBERT BOSCH GMBH
Reel/Frame 051506/0595 →
Priority Claims (1)
DE 102017203384.3 · Mar 2, 2017 · national
Continuity (1)
Related Publication 20190376864A1 · Dec 12, 2019
Cited By (1)
US 12,467,802